Global Integrated Heat Spreader (IHS) Market Growth 2025-2031

The global Integrated Heat Spreader (IHS) market size is predicted to grow from US$ 716 million in 2025 to US$ 1063 million in 2031; it is expected to grow at a CAGR of 6.8% from 2025 to 2031.

An Integrated Heat Spreader (IHS) is the surface used to make contact between a heatsink or other thermal solution and a CPU or GPU processor.

Integrated Heat Spreader (IHS) - The metal “lid” of the CPU. This serves as a heat sink designed to distribute heat from the processor itself to a CPU cooler, as well as provide protection to the processor inside. This is the part of the CPU that is still exposed after being installed in a motherboard, and is the surface to which you apply thermal paste.

Integrated Heat Spreader (IHS) are one of the fundamental heat dissipation components used in various industries. They are typically made of high thermal conductivity metals such as copper or aluminum. In the electronics industry, heat spreaders or heat sinks are installed on electronic components or chips to transfer or dissipate the heat generated by the components using the thermal conductivity of the heat dissipation material itself. Heat spreaders find wide applications in the electronic information industry, semiconductor industry, and optoelectronic component industry, with downstream applications extending to the 3C industry.

Furthermore, electric vehicles (EVs) and hybrid electric vehicles (HEVs) have become a major trend in automotive development. In the inverters and rectifiers of electric vehicles, high-power chip modules pose thermal dissipation challenges. Currently, the mainstream solution for such designs is to use water-cooled heat spreaders. By utilizing highly thermally conductive metal materials, along with metal processing techniques and surface treatments, the chip temperature can be controlled within an acceptable range using water cooling. The thermal design of water-cooled heat spreaders needs to effectively dissipate the heat generated by the chips, while considering the cost and manufacturability aspects of the design for mass production.

Currently, the global heat spreader market is primarily dominated by manufacturers from Japan, the United States, and China Taiwan, with China Taiwan being the largest production region, accounting for approximately 57% of the global market share in 2024. Japan and the United States are also significant production regions, with market shares of 16.7% and 17.1%, respectively, in 2024. Chinese manufacturers entered this field relatively late, with two main players currently holding a combined global market share of 4.98% in 2024, which is expected to grow to 10.25% by 2031.

In terms of materials, copper heat spreaders currently dominate the market, accounting for 89% of the market share in 2024. Due to the design changes in AI chips, heat spreaders have not only become larger and thicker but also shifted materials. Historically, copper was the primary material used for heat spreaders due to its high thermal conductivity of 401 W/m.K, which is higher than that of gold or aluminum, second only to silver. However, heat spreader materials are now moving toward stainless steel, which has higher hardness and is more difficult to process, thus raising the technological barriers for manufacturers. In the coming years, stainless steel-based heat spreader are expected to see faster growth.

Regarding chip sizes, the proportion of large-sized heat spreader products is gradually increasing. Heat spreaders are closely related to chip packaging. In the past, processors required heat spreaders with an area of around 30mm x 30mm. Now, with chip manufacturers enhancing computational speeds and incorporating more memory, the number of bare die (chips) has significantly increased, expanding the area to 60mm x 60mm or larger. In 2024, heat spreaders with sizes greater than 35mm x 35mm will account for approximately 53%, and it is expected to rise to 61% by 2031.

In terms of market application, PC CPU/GPU heat spreaders currently hold the largest market share, accounting for 52% in 2024. However, the server/data center sector is growing at a faster pace, accounting for 35% in 2024 and projected to reach 50% by 2031.

The main global heat spreader manufacturers include Jentech Precision Industrial, Honeywell, Shinko, Fujikura, I-Chiun, Favor Precision Technology, and Shandong Ruisi Precision Industry. The top five global manufacturers are expected to account for approximately 91% of the market share in 2024. In the coming years, competition in this industry is expected to intensify.

LP Information, Inc. (LPI) ' newest research report, the “Integrated Heat Spreader (IHS) Industry Forecast” looks at past sales and reviews total world Integrated Heat Spreader (IHS) sales in 2024, providing a comprehensive analysis by region and market sector of projected Integrated Heat Spreader (IHS) sales for 2025 through 2031. With Integrated Heat Spreader (IHS) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Integrated Heat Spreader (IHS) industry.

This Insight Report provides a comprehensive analysis of the global Integrated Heat Spreader (IHS) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Integrated Heat Spreader (IHS) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Integrated Heat Spreader (IHS) market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Integrated Heat Spreader (IHS) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Integrated Heat Spreader (IHS).

This report presents a comprehensive overview, market shares, and growth opportunities of Integrated Heat Spreader (IHS) market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Heat Spreader for FC (Flip Chip)
Heat Spreader for BGA

Segmentation by Application:
PC CPU/GPU Package
Server/Data Center/AI Chip Package
Automotive SoC/FPGA Package
Gaming Console
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Shinko
Fujikura
Honeywell Advanced Materials
Jentech Precision Industrial
I-Chiun
Favor Precision Technology
Niching Industrial Corporation
Fastrong Technologies Corp.
ECE (Excel Cell Electronic)
Shandong Ruisi Precision Industry
HongRiDa Electronics (HRD)
TBT Co., Ltd

Key Questions Addressed in this Report

What is the 10-year outlook for the global Integrated Heat Spreader (IHS) market?

What factors are driving Integrated Heat Spreader (IHS) market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Integrated Heat Spreader (IHS) market opportunities vary by end market size?

How does Integrated Heat Spreader (IHS) break out by Type, by Application?

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