Global 8 Inch Semiconductor Laser Slotting Equipment Market Growth 2025-2031
Description
The global 8 Inch Semiconductor Laser Slotting Equipment market size is predicted to grow from US$ 208 million in 2025 to US$ 350 million in 2031; it is expected to grow at a CAGR of 9.0% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
The 8-inch semiconductor laser slotting equipment is a special laser processing equipment designed for 200mm (8-inch) wafers. It is mainly used for high-precision slotting, cutting and micro-hole processing on the surface or inside of silicon, silicon carbide (SiC) or gallium nitride (GaN) wafers.
The 8-inch semiconductor laser slotting equipment market has shown structural growth in recent years, mainly benefiting from the surge in demand for power semiconductors (IGBT, SiC MOSFET) and analog chips (PMIC, MEMS) in the fields of new energy vehicles, industrial control and consumer electronics. With the expansion of global 8-inch wafer fabs and the migration of third-generation semiconductors to 8-inch wafer processes, the market size of this equipment, as a key link in wafer thinning, invisible cutting and TSV through-hole processing, has grown steadily.
The core driving factors include: the explosive demand for high-voltage chips in the electric drive system of new energy vehicles has promoted the upgrade of 8-inch SiC wafer processing equipment; the production capacity of mature process chips (such as MCU and sensors) has been moved back to 8 inches, forcing the replacement of old mechanical cutting equipment; China's semiconductor equipment localization policy support, local manufacturers (such as SMIC and HGU) have accelerated the replacement of imports.
The competitive landscape is dominated by Japanese companies, but Chinese manufacturers have continuously increased their market share through breakthroughs in ultraviolet laser technology and cost-effective advantages. The technology trend focuses on the combination of ultrafast laser (picosecond) and AI dynamic calibration to cope with the fragmentation rate control after 8-inch SiC wafers are thinned to less than 50μm, and the equipment is iterating towards modularization and intelligence. The challenge lies in the high difficulty of controlling thermal stress in 8-inch SiC wafer processing and the potential impact of European and American laser export restrictions on China on the supply chain.
LP Information, Inc. (LPI) ' newest research report, the “8 Inch Semiconductor Laser Slotting Equipment Industry Forecast” looks at past sales and reviews total world 8 Inch Semiconductor Laser Slotting Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected 8 Inch Semiconductor Laser Slotting Equipment sales for 2025 through 2031. With 8 Inch Semiconductor Laser Slotting Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world 8 Inch Semiconductor Laser Slotting Equipment industry.
This Insight Report provides a comprehensive analysis of the global 8 Inch Semiconductor Laser Slotting Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on 8 Inch Semiconductor Laser Slotting Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global 8 Inch Semiconductor Laser Slotting Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for 8 Inch Semiconductor Laser Slotting Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global 8 Inch Semiconductor Laser Slotting Equipment.
This report presents a comprehensive overview, market shares, and growth opportunities of 8 Inch Semiconductor Laser Slotting Equipment market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Semi-Automatic
Fully Automatic
Segmentation by Application:
Low-k Wafer
Non Low-k Wafer
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DISCO
ASMPT
EO Technics
Wuhan Dr Laser Technology
Delphi Laser
Synova
ACCRETECH
Suzhou Maxwell Technologies
Suzhou Lumi Laser Technology
Han's Laser Technology
Wuhan Huagong Laser Engineering
Key Questions Addressed in this Report
What is the 10-year outlook for the global 8 Inch Semiconductor Laser Slotting Equipment market?
What factors are driving 8 Inch Semiconductor Laser Slotting Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do 8 Inch Semiconductor Laser Slotting Equipment market opportunities vary by end market size?
How does 8 Inch Semiconductor Laser Slotting Equipment break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
The 8-inch semiconductor laser slotting equipment is a special laser processing equipment designed for 200mm (8-inch) wafers. It is mainly used for high-precision slotting, cutting and micro-hole processing on the surface or inside of silicon, silicon carbide (SiC) or gallium nitride (GaN) wafers.
The 8-inch semiconductor laser slotting equipment market has shown structural growth in recent years, mainly benefiting from the surge in demand for power semiconductors (IGBT, SiC MOSFET) and analog chips (PMIC, MEMS) in the fields of new energy vehicles, industrial control and consumer electronics. With the expansion of global 8-inch wafer fabs and the migration of third-generation semiconductors to 8-inch wafer processes, the market size of this equipment, as a key link in wafer thinning, invisible cutting and TSV through-hole processing, has grown steadily.
The core driving factors include: the explosive demand for high-voltage chips in the electric drive system of new energy vehicles has promoted the upgrade of 8-inch SiC wafer processing equipment; the production capacity of mature process chips (such as MCU and sensors) has been moved back to 8 inches, forcing the replacement of old mechanical cutting equipment; China's semiconductor equipment localization policy support, local manufacturers (such as SMIC and HGU) have accelerated the replacement of imports.
The competitive landscape is dominated by Japanese companies, but Chinese manufacturers have continuously increased their market share through breakthroughs in ultraviolet laser technology and cost-effective advantages. The technology trend focuses on the combination of ultrafast laser (picosecond) and AI dynamic calibration to cope with the fragmentation rate control after 8-inch SiC wafers are thinned to less than 50μm, and the equipment is iterating towards modularization and intelligence. The challenge lies in the high difficulty of controlling thermal stress in 8-inch SiC wafer processing and the potential impact of European and American laser export restrictions on China on the supply chain.
LP Information, Inc. (LPI) ' newest research report, the “8 Inch Semiconductor Laser Slotting Equipment Industry Forecast” looks at past sales and reviews total world 8 Inch Semiconductor Laser Slotting Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected 8 Inch Semiconductor Laser Slotting Equipment sales for 2025 through 2031. With 8 Inch Semiconductor Laser Slotting Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world 8 Inch Semiconductor Laser Slotting Equipment industry.
This Insight Report provides a comprehensive analysis of the global 8 Inch Semiconductor Laser Slotting Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on 8 Inch Semiconductor Laser Slotting Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global 8 Inch Semiconductor Laser Slotting Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for 8 Inch Semiconductor Laser Slotting Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global 8 Inch Semiconductor Laser Slotting Equipment.
This report presents a comprehensive overview, market shares, and growth opportunities of 8 Inch Semiconductor Laser Slotting Equipment market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Semi-Automatic
Fully Automatic
Segmentation by Application:
Low-k Wafer
Non Low-k Wafer
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DISCO
ASMPT
EO Technics
Wuhan Dr Laser Technology
Delphi Laser
Synova
ACCRETECH
Suzhou Maxwell Technologies
Suzhou Lumi Laser Technology
Han's Laser Technology
Wuhan Huagong Laser Engineering
Key Questions Addressed in this Report
What is the 10-year outlook for the global 8 Inch Semiconductor Laser Slotting Equipment market?
What factors are driving 8 Inch Semiconductor Laser Slotting Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do 8 Inch Semiconductor Laser Slotting Equipment market opportunities vary by end market size?
How does 8 Inch Semiconductor Laser Slotting Equipment break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
110 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for 8 Inch Semiconductor Laser Slotting Equipment by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for 8 Inch Semiconductor Laser Slotting Equipment by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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