Global IC Package Substrates Market Growth 2025-2031

The global IC Package Substrates market size is predicted to grow from US$ 17590 million in 2025 to US$ 29900 million in 2031; it is expected to grow at a CAGR of 9.2% from 2025 to 2031.

IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate for IC packaging is as high as 35-55%.

The major manufacturers that provide IC Package Substrates in China include SCC, Nanya and Access Substrates, etc. The top three manufacturers account for more than 50% of the market share. Among them, WB BGA and FC-CSP accounted for 39% and 38%, respectively. Smartphones and PCs (tablets and laptops) are the most widely used, accounting for 64% and 23%, respectively.

Surging Demand for Advanced Processors in AI and High-Performance Computing (HPC): The proliferation of artificial intelligence (AI) applications and HPC has escalated the need for sophisticated processors. These processors require advanced IC substrates to ensure efficient performance and reliability.

Expansion of Data Centers and Cloud Computing Services: The global increase in data centers and cloud services necessitates high-performance IC substrates to support robust server and storage solutions, driving market growth.

Advancements in 5G and Emerging 6G Technologies: The rollout of 5G networks and the anticipation of 6G have heightened the demand for advanced IC substrates capable of supporting faster and more efficient data transmission.

Miniaturization and Heterogeneous Integration in Electronics: The trend toward smaller, more complex electronic devices has led to increased adoption of heterogeneous integration. Advanced IC substrates are essential in accommodating multiple chips within compact designs.

Growth in Automotive Electronics: The automotive industry's shift toward electric vehicles (EVs) and autonomous driving technologies has amplified the need for advanced IC substrates to support complex electronic systems within vehicles.

Emergence of Internet of Things (IoT) Devices: The expanding IoT landscape requires efficient and compact IC substrates to facilitate connectivity and functionality across a myriad of devices.

LP Information, Inc. (LPI) ' newest research report, the “IC Package Substrates Industry Forecast” looks at past sales and reviews total world IC Package Substrates sales in 2024, providing a comprehensive analysis by region and market sector of projected IC Package Substrates sales for 2025 through 2031. With IC Package Substrates sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world IC Package Substrates industry.

This Insight Report provides a comprehensive analysis of the global IC Package Substrates landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on IC Package Substrates portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global IC Package Substrates market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for IC Package Substrates and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global IC Package Substrates.

This report presents a comprehensive overview, market shares, and growth opportunities of IC Package Substrates market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
FC-BGA
FC-CSP
WB BGA
WB CSP
RF Module
Others

Segmentation by Application:
Automotive
Mobile Electronics
PC (Tablet, Laptop)
Medical
Industrial
Other

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Ibiden
Kinsus Interconnect Technology
Unimicron
Shinko Electric Industries
Semco
Simmtech
Nanya
Kyocera
LG Innotek
AT&S
ASE
Daeduck
Shennan Circuit
Zhen Ding Technology
KCC (Korea Circuit Company)
ACCESS
Shenzhen Fastprint Circuit Tech
AKM Meadville
Toppan Printing

Key Questions Addressed in this Report

What is the 10-year outlook for the global IC Package Substrates market?

What factors are driving IC Package Substrates market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do IC Package Substrates market opportunities vary by end market size?

How does IC Package Substrates break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.