Global IC Package Substrate Material Market Growth (Status and Outlook) 2025-2031
Description
The global IC Package Substrate Material market size is predicted to grow from US$ 7346 million in 2025 to US$ 11610 million in 2031; it is expected to grow at a CAGR of 7.9% from 2025 to 2031.
IC package substrate materials play a crucial role in providing a reliable and efficient electrical connection between the integrated circuit (IC) chip and the rest of the electronic system. The choice of substrate material depends on various factors such as the application, performance requirements, and thermal considerations.
At the regional level, the Chinese mainland market accounts for about 9% of the world. From the product perspective, substrate resin is currently the most important packaging material, accounting for 41%, and it is expected that it will continue to be the largest type in the future. From the application perspective, FC-BGA is currently the most important application, accounting for 38%.
At present, global manufacturers are mainly concentrated in the Asia-Pacific region, and China has also developed very rapidly in recent years. Major companies include Ajinomoto, Changchun, Mitsubishi Gas, Nanya Plastics, Showa Denko, Mitsui Metals and Panasonic Electric, etc. The top five companies account for more than 30%. It is expected that industry competition will become more intense in the next few years, especially in the Chinese market.
IC packaging substrate materials are affected by the following factors: First, the 2019 COVID-19 pandemic swept the world, causing serious impacts on all industries around the world. Although high-tech industries such as semiconductor chips have not been fatally hit, the fluctuations in the macro environment have also indirectly affected the normal development of the semiconductor packaging industry market. Second, with the expansion of Sino-US trade frictions, many Taiwanese and Chinese companies have been affected, and some Chinese semiconductor manufacturers have chosen to build factories in other countries and regions for production. Third, because chips belong to high-tech industries, they require a high level of manufacturing technology. Some countries or companies have mastered the latest technology, but due to some factors, they have not been made public. The existence of technical barriers has restricted the development of the IC packaging substrate material industry. Of course, challenges and opportunities coexist. In recent years, the United States, Europe, Japan and other countries have introduced bills to increase support for their IC packaging substrate materials and related industries, including various grants and subsidy policies. The rise of industries such as 5G/6G, the Internet of Things, and new energy vehicles has increased the demand for chips and greatly promoted the development of the chip industry. In addition, the rapid development of integrated circuits has driven the large-scale expansion of the entire semiconductor industry. Personal computers and smartphones are still important sources of demand for the chip industry, and strong demand is an important factor in the expansion of the chip industry. With the improvement of living standards, people's entertainment needs have been improved. The rise of wearable devices and entertainment devices has further increased the demand for chips. Chip packaging technology has involved various materials, electronics, thermal, mechanics, chemistry, reliability and other disciplines. It is a high-tech industry that is increasingly valued and developed in parallel with integrated circuit chips. With the simultaneous development of design, chip manufacturing and packaging and testing, the importance of packaging in the entire IC industry chain is unquestionable. The proportions are gradually tending towards reasonable and coordinated development, and its importance is increasing.
LPI (LP Information)' newest research report, the “IC Package Substrate Material Industry Forecast” looks at past sales and reviews total world IC Package Substrate Material sales in 2024, providing a comprehensive analysis by region and market sector of projected IC Package Substrate Material sales for 2025 through 2031. With IC Package Substrate Material sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world IC Package Substrate Material industry.
This Insight Report provides a comprehensive analysis of the global IC Package Substrate Material landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on IC Package Substrate Material portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global IC Package Substrate Material market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for IC Package Substrate Material and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global IC Package Substrate Material.
This report presents a comprehensive overview, market shares, and growth opportunities of IC Package Substrate Material market by product type, application, key players and key regions and countries.
Segmentation by Type:
Substrate Resin
Copper Foil
Insulation Materials
Drill
Other
Segmentation by Application:
FC-BGA
FC-CSP
WB BGA
WB CSP
RF Module
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Mitsubishi Gas Chemical
Ajinomoto
Resonac Corporation
Panasonic
Mitsui Mining & Smelting
Nan Ya Plastics
Sumitomo Bakelite
Chang Chun Group
Sekisui Chemical
WaferChem Technology
ITEQ
Please note: The report will take approximately 2 business days to prepare and deliver.
IC package substrate materials play a crucial role in providing a reliable and efficient electrical connection between the integrated circuit (IC) chip and the rest of the electronic system. The choice of substrate material depends on various factors such as the application, performance requirements, and thermal considerations.
At the regional level, the Chinese mainland market accounts for about 9% of the world. From the product perspective, substrate resin is currently the most important packaging material, accounting for 41%, and it is expected that it will continue to be the largest type in the future. From the application perspective, FC-BGA is currently the most important application, accounting for 38%.
At present, global manufacturers are mainly concentrated in the Asia-Pacific region, and China has also developed very rapidly in recent years. Major companies include Ajinomoto, Changchun, Mitsubishi Gas, Nanya Plastics, Showa Denko, Mitsui Metals and Panasonic Electric, etc. The top five companies account for more than 30%. It is expected that industry competition will become more intense in the next few years, especially in the Chinese market.
IC packaging substrate materials are affected by the following factors: First, the 2019 COVID-19 pandemic swept the world, causing serious impacts on all industries around the world. Although high-tech industries such as semiconductor chips have not been fatally hit, the fluctuations in the macro environment have also indirectly affected the normal development of the semiconductor packaging industry market. Second, with the expansion of Sino-US trade frictions, many Taiwanese and Chinese companies have been affected, and some Chinese semiconductor manufacturers have chosen to build factories in other countries and regions for production. Third, because chips belong to high-tech industries, they require a high level of manufacturing technology. Some countries or companies have mastered the latest technology, but due to some factors, they have not been made public. The existence of technical barriers has restricted the development of the IC packaging substrate material industry. Of course, challenges and opportunities coexist. In recent years, the United States, Europe, Japan and other countries have introduced bills to increase support for their IC packaging substrate materials and related industries, including various grants and subsidy policies. The rise of industries such as 5G/6G, the Internet of Things, and new energy vehicles has increased the demand for chips and greatly promoted the development of the chip industry. In addition, the rapid development of integrated circuits has driven the large-scale expansion of the entire semiconductor industry. Personal computers and smartphones are still important sources of demand for the chip industry, and strong demand is an important factor in the expansion of the chip industry. With the improvement of living standards, people's entertainment needs have been improved. The rise of wearable devices and entertainment devices has further increased the demand for chips. Chip packaging technology has involved various materials, electronics, thermal, mechanics, chemistry, reliability and other disciplines. It is a high-tech industry that is increasingly valued and developed in parallel with integrated circuit chips. With the simultaneous development of design, chip manufacturing and packaging and testing, the importance of packaging in the entire IC industry chain is unquestionable. The proportions are gradually tending towards reasonable and coordinated development, and its importance is increasing.
LPI (LP Information)' newest research report, the “IC Package Substrate Material Industry Forecast” looks at past sales and reviews total world IC Package Substrate Material sales in 2024, providing a comprehensive analysis by region and market sector of projected IC Package Substrate Material sales for 2025 through 2031. With IC Package Substrate Material sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world IC Package Substrate Material industry.
This Insight Report provides a comprehensive analysis of the global IC Package Substrate Material landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on IC Package Substrate Material portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global IC Package Substrate Material market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for IC Package Substrate Material and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global IC Package Substrate Material.
This report presents a comprehensive overview, market shares, and growth opportunities of IC Package Substrate Material market by product type, application, key players and key regions and countries.
Segmentation by Type:
Substrate Resin
Copper Foil
Insulation Materials
Drill
Other
Segmentation by Application:
FC-BGA
FC-CSP
WB BGA
WB CSP
RF Module
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Mitsubishi Gas Chemical
Ajinomoto
Resonac Corporation
Panasonic
Mitsui Mining & Smelting
Nan Ya Plastics
Sumitomo Bakelite
Chang Chun Group
Sekisui Chemical
WaferChem Technology
ITEQ
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
108 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 IC Package Substrate Material Market Size by Player
- 4 IC Package Substrate Material by Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Global IC Package Substrate Material Market Forecast
- 11 Key Players Analysis
- 12 Research Findings and Conclusion
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