Global Hot Air Reflow Market Growth 2026-2032
Description
The global Hot Air Reflow market size is predicted to grow from US$ 820 million in 2025 to US$ 1223 million in 2032; it is expected to grow at a CAGR of 6.5% from 2026 to 2032.
In 2025, global production of Reflow Soldering equipment reached 23,485 units, with an average selling price of USD 35,700 per unit. Reflow soldering is a surface-mount soldering process used in electronic assembly, where a solder paste-coated PCB and surface-mount components are heated to the melting point of the solder, allowing the solder to flow and form reliable electrical and mechanical connections. Reflow soldering is widely applied in consumer electronics, communication devices, automotive electronics, industrial control, and medical electronics, enabling high-precision and high-efficiency mass soldering. Compared to traditional manual soldering or wave soldering, reflow soldering offers better process control, higher solder joint quality, and suitability for miniaturized and complex PCB designs, making it a critical process in modern electronics manufacturing.
The reflow soldering market is currently characterized by dual drivers of technological upgrading and automation. In the consumer electronics segment, trends toward miniaturization, high-density, multilayer, and flexible PCBs push equipment development toward high precision, low thermal stress, and fast thermal ramp-up and cool-down control. In automotive electronics, industrial control, and medical electronics, requirements for reliability and high-temperature tolerance demand precise temperature control, stable thermal cycles, and traceable production data management. Industry trends indicate that smart control, remote monitoring, energy efficiency, and MES integration will be the main development directions for reflow soldering equipment. Market consensus holds that, despite intense competition, high technical barriers, long customer validation cycles, and low equipment replacement frequency ensure that vendors with long-term technological expertise and service capabilities maintain stable positions in the mid-to-high-end market.
LP Information, Inc. (LPI) ' newest research report, the “Hot Air Reflow Industry Forecast” looks at past sales and reviews total world Hot Air Reflow sales in 2025, providing a comprehensive analysis by region and market sector of projected Hot Air Reflow sales for 2026 through 2032. With Hot Air Reflow sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Hot Air Reflow industry.
This Insight Report provides a comprehensive analysis of the global Hot Air Reflow landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Hot Air Reflow portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Hot Air Reflow market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Hot Air Reflow and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Hot Air Reflow.
This report presents a comprehensive overview, market shares, and growth opportunities of Hot Air Reflow market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Convection Reflow Oven
Vapor Phase Reflow Oven
Others
Segmentation by Thermal Zone:
Single-Zone Reflow
Multi-Zone Reflow
Segmentation by Operation Mode:
Inline
Offline
Segmentation by Application:
Medical Electronics
Consumer Electronics
Automotive Electronics
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Rehm Thermal Systems
Kurtz Ersa
BTU International
Heller Industries
Shenzhen JT Automation Equipment
TAMURA Corporation
ITW EAE
SMT Wertheim
Dongguan Folungwin Automatic Equipment
Senju Metal Industry
JUKI
SEHO Systems GmbH
Suneast Intelligent Equipment Technology (Shenzhen)
ETA
Papaw
EIGHTECH TECTRON
ATV Technologie GmbH
3S Silicon
HIRATA Corporation
Shenzhen Haobao Technology
SHENZHEN JAGUAR AUTOMATION EQUIPMENT
Key Questions Addressed in this Report
What is the 10-year outlook for the global Hot Air Reflow market?
What factors are driving Hot Air Reflow market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Hot Air Reflow market opportunities vary by end market size?
How does Hot Air Reflow break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
In 2025, global production of Reflow Soldering equipment reached 23,485 units, with an average selling price of USD 35,700 per unit. Reflow soldering is a surface-mount soldering process used in electronic assembly, where a solder paste-coated PCB and surface-mount components are heated to the melting point of the solder, allowing the solder to flow and form reliable electrical and mechanical connections. Reflow soldering is widely applied in consumer electronics, communication devices, automotive electronics, industrial control, and medical electronics, enabling high-precision and high-efficiency mass soldering. Compared to traditional manual soldering or wave soldering, reflow soldering offers better process control, higher solder joint quality, and suitability for miniaturized and complex PCB designs, making it a critical process in modern electronics manufacturing.
The reflow soldering market is currently characterized by dual drivers of technological upgrading and automation. In the consumer electronics segment, trends toward miniaturization, high-density, multilayer, and flexible PCBs push equipment development toward high precision, low thermal stress, and fast thermal ramp-up and cool-down control. In automotive electronics, industrial control, and medical electronics, requirements for reliability and high-temperature tolerance demand precise temperature control, stable thermal cycles, and traceable production data management. Industry trends indicate that smart control, remote monitoring, energy efficiency, and MES integration will be the main development directions for reflow soldering equipment. Market consensus holds that, despite intense competition, high technical barriers, long customer validation cycles, and low equipment replacement frequency ensure that vendors with long-term technological expertise and service capabilities maintain stable positions in the mid-to-high-end market.
LP Information, Inc. (LPI) ' newest research report, the “Hot Air Reflow Industry Forecast” looks at past sales and reviews total world Hot Air Reflow sales in 2025, providing a comprehensive analysis by region and market sector of projected Hot Air Reflow sales for 2026 through 2032. With Hot Air Reflow sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Hot Air Reflow industry.
This Insight Report provides a comprehensive analysis of the global Hot Air Reflow landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Hot Air Reflow portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Hot Air Reflow market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Hot Air Reflow and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Hot Air Reflow.
This report presents a comprehensive overview, market shares, and growth opportunities of Hot Air Reflow market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Convection Reflow Oven
Vapor Phase Reflow Oven
Others
Segmentation by Thermal Zone:
Single-Zone Reflow
Multi-Zone Reflow
Segmentation by Operation Mode:
Inline
Offline
Segmentation by Application:
Medical Electronics
Consumer Electronics
Automotive Electronics
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Rehm Thermal Systems
Kurtz Ersa
BTU International
Heller Industries
Shenzhen JT Automation Equipment
TAMURA Corporation
ITW EAE
SMT Wertheim
Dongguan Folungwin Automatic Equipment
Senju Metal Industry
JUKI
SEHO Systems GmbH
Suneast Intelligent Equipment Technology (Shenzhen)
ETA
Papaw
EIGHTECH TECTRON
ATV Technologie GmbH
3S Silicon
HIRATA Corporation
Shenzhen Haobao Technology
SHENZHEN JAGUAR AUTOMATION EQUIPMENT
Key Questions Addressed in this Report
What is the 10-year outlook for the global Hot Air Reflow market?
What factors are driving Hot Air Reflow market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Hot Air Reflow market opportunities vary by end market size?
How does Hot Air Reflow break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
156 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Hot Air Reflow by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Hot Air Reflow by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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