The global High frequency PCB for Automotive Radar market size is predicted to grow from US$ 332 million in 2025 to US$ 839 million in 2031; it is expected to grow at a CAGR of 16.7% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
For automotive millimeter-wave radar PCBs, which operate typically in the frequency range of 24 GHz to 77 GHz, selecting the right PCB material is crucial to ensure optimal performance, reliability, and signal integrity. Low loss tangent is critical for minimizing signal attenuation and ensuring efficient energy transfer at millimeter-wave frequencies. PCB materials with low loss tangents help reduce signal distortion and maintain signal integrity in automotive radar systems.
High-frequency PCBs for automotive radar systems are essential components in 24GHz, 77GHz, and 79GHz radar modules, playing a key role in enabling signal transmission, RF front-end processing, and system reliability. These PCBs must feature low dielectric constant (Dk), minimal dielectric loss (Df), excellent thermal stability, and precise impedance control to support next-generation ADAS (L2+/L3/L4) and autonomous driving functions.
Current PCB technology trends favor multilayer constructions using PTFE, LCP (liquid crystal polymer), PPE, and fluoropolymer substrates to meet stringent RF requirements. Hybrid stacking (combining high-frequency and FR4 materials) is increasingly used to reduce costs for non-critical radar applications such as side and rear radar modules.
Application-wise, long-range front radar demands the highest PCB material performance, typically adopting LCP/PTFE solutions for superior signal integrity. In contrast, corner radar and surround radar modules are more cost-sensitive and may leverage PPE or hybrid builds. Emerging technologies like 4D imaging radar and digital beamforming (DBF) are pushing for even finer line widths, enhanced heat dissipation, and new materials capable of higher frequency operation.
Regionally, China is leading demand growth, driven by NEV and smart vehicle penetration, with domestic PCB firms rapidly scaling up their high-frequency PCB capabilities. In contrast, Japan, Europe, and the US continue to dominate in high-end radar chipsets and premium PCB materials supply.
With increasing adoption of L2+ ADAS, regulatory mandates (e.g., EU NCAP radar standardization), and evolving radar technology, the automotive high-frequency PCB market is expected to grow at high CAGR globally, especially in high-frequency (>77GHz) and 4D radar applications.
LP Information, Inc. (LPI) ' newest research report, the “High frequency PCB for Automotive Radar Industry Forecast” looks at past sales and reviews total world High frequency PCB for Automotive Radar sales in 2024, providing a comprehensive analysis by region and market sector of projected High frequency PCB for Automotive Radar sales for 2025 through 2031. With High frequency PCB for Automotive Radar sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world High frequency PCB for Automotive Radar industry.
This Insight Report provides a comprehensive analysis of the global High frequency PCB for Automotive Radar landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on High frequency PCB for Automotive Radar portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global High frequency PCB for Automotive Radar market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for High frequency PCB for Automotive Radar and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global High frequency PCB for Automotive Radar.
This report presents a comprehensive overview, market shares, and growth opportunities of High frequency PCB for Automotive Radar market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
4-Layer
6-Layer
8-Layer
Other
Segmentation by Application:
Corner Radars
Front Radars
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Unitech PCB
WUS Printed Circuit
AT&S
Dynamic Electronics
Meiko
Schweizer
Dongguan Somacis Graphic PCB
Shennan Circuits
Zhen Ding Group
Shengyi Electronics
CMK
TTM Technologies
Shenzhen Kinwong Electron
Key Questions Addressed in this Report
What is the 10-year outlook for the global High frequency PCB for Automotive Radar market?
What factors are driving High frequency PCB for Automotive Radar market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do High frequency PCB for Automotive Radar market opportunities vary by end market size?
How does High frequency PCB for Automotive Radar break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
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