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Global High Thermally-conductive Epoxy Molding Compound Market Growth 2025-2031

Publisher LP Information, Inc.
Published Aug 14, 2025
Length 105 Pages
SKU # LPI20312770

Description

The global High Thermally-conductive Epoxy Molding Compound market size is predicted to grow from US$ 657 million in 2025 to US$ 1281 million in 2031; it is expected to grow at a CAGR of 11.8% from 2025 to 2031.

The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.

A High Thermally-Conductive Epoxy Molding Compound (HTC EMC) is a composite material consisting of epoxy resin, thermally conductive fillers, curing agents, and additives. It is specifically engineered to encapsulate and protect electronic components while facilitating efficient heat dissipation. HTC EMCs are widely used in power electronics, automotive modules, LEDs, and semiconductor packaging to manage thermal loads and enhance reliability.

United States market for High Thermally-conductive Epoxy Molding Compound is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for High Thermally-conductive Epoxy Molding Compound is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for High Thermally-conductive Epoxy Molding Compound is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key High Thermally-conductive Epoxy Molding Compound players cover Sumitomo Bakelite, KYOCERA GROUP GLOBAL SITE, SolEpoxy, Inc., CAPLINQ, Henkel, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LP Information, Inc. (LPI) ' newest research report, the “High Thermally-conductive Epoxy Molding Compound Industry Forecast” looks at past sales and reviews total world High Thermally-conductive Epoxy Molding Compound sales in 2024, providing a comprehensive analysis by region and market sector of projected High Thermally-conductive Epoxy Molding Compound sales for 2025 through 2031. With High Thermally-conductive Epoxy Molding Compound sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world High Thermally-conductive Epoxy Molding Compound industry.

This Insight Report provides a comprehensive analysis of the global High Thermally-conductive Epoxy Molding Compound landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on High Thermally-conductive Epoxy Molding Compound portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global High Thermally-conductive Epoxy Molding Compound market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for High Thermally-conductive Epoxy Molding Compound and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global High Thermally-conductive Epoxy Molding Compound.

This report presents a comprehensive overview, market shares, and growth opportunities of High Thermally-conductive Epoxy Molding Compound market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Powder
Particles

Segmentation by Application:
Power Module
Mold Under Fill (MUF)

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Sumitomo Bakelite
KYOCERA GROUP GLOBAL SITE
SolEpoxy, Inc.
CAPLINQ
Henkel
Resonac

Key Questions Addressed in this Report

What is the 10-year outlook for the global High Thermally-conductive Epoxy Molding Compound market?

What factors are driving High Thermally-conductive Epoxy Molding Compound market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do High Thermally-conductive Epoxy Molding Compound market opportunities vary by end market size?

How does High Thermally-conductive Epoxy Molding Compound break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.

Table of Contents

105 Pages
*This is a tentative TOC and the final deliverable is subject to change.*
1 Scope of the Report
2 Executive Summary
3 Global by Company
4 World Historic Review for High Thermally-conductive Epoxy Molding Compound by Geographic Region
5 Americas
6 APAC
7 Europe
8 Middle East & Africa
9 Market Drivers, Challenges and Trends
10 Manufacturing Cost Structure Analysis
11 Marketing, Distributors and Customer
12 World Forecast Review for High Thermally-conductive Epoxy Molding Compound by Geographic Region
13 Key Players Analysis
14 Research Findings and Conclusion

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