Global High Speed PCB Market Growth 2025-2031

The global High Speed PCB market size is predicted to grow from US$ 6323 million in 2025 to US$ 8733 million in 2031; it is expected to grow at a CAGR of 5.5% from 2025 to 2031.

High-speed PCB designs are becoming more prevalent today. High-speed PCB design refers to the process of designing printed circuit boards that are intended to transmit and receive signals at high frequencies. These types of PCBs are commonly used in electronic devices such as computers, smartphones, routers, and other high-speed data communication systems. The signal densities of high-speed PCBs run into a few GHz. Hence, the fundamentals of high-speed design, routing, and layout are crucial to mitigate issues such as EMI in these boards. With the rise of advanced technologies like 5G, the Internet of Things (IoT), and artificial intelligence (AI), designers are challenged to create PCBs that can support high-speed communication, processing, and storage.

High-Speed Printed Circuit Boards (PCBs) are engineered to handle high-frequency signals, typically above 50 MHz, ensuring reliable and rapid data transmission. These PCBs are essential in applications where signal integrity and minimal latency are critical.

High-Speed PCBs are foundational to modern electronics, driven by advancements in AI, 5G, and automotive innovation. Regional markets like China and North America will continue to lead production and R&D, while material science and miniaturization will define future competitiveness. Companies must prioritize collaboration with IC designers and adopt eco-friendly practices to align with global regulatory trends.

The global PCB market was valued at US$ 78.9billion in 2024 and is anticipated to reach US$ 101.6 billion by 2031, witnessing a CAGR of 4.86% during the forecast period 2025-2031. Asia-Pacific dominates the market, accounting for over 85% of global PCB production, led by China Mainland, China Taiwan, and South Korea. The major global manufacturers of PCB include Unimicron, DSBJ (Dongshan Precision), Zhen Ding Technology, Kinwong, Shennan Circuit, Tripod Technology, Suntak Technology, Shenzhen Fastprint Circuit Tech, and Gul Technologies Group, etc. In 2024, the world's top 20 manufacturers accounted for approximately 54.12 % of the revenue.

LP Information, Inc. (LPI) ' newest research report, the “High Speed PCB Industry Forecast” looks at past sales and reviews total world High Speed PCB sales in 2024, providing a comprehensive analysis by region and market sector of projected High Speed PCB sales for 2025 through 2031. With High Speed PCB sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world High Speed PCB industry.

This Insight Report provides a comprehensive analysis of the global High Speed PCB landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on High Speed PCB portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global High Speed PCB market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for High Speed PCB and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global High Speed PCB.

This report presents a comprehensive overview, market shares, and growth opportunities of High Speed PCB market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Multilayer PCB
HDI PCB
FPC PCB

Segmentation by Application:
Wireline & Wireless Networks
Server & Storage
Enterprise Network
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Kinwong
Shennan Circuit
Suntak Technology
Shenzhen Fastprint Circuit Tech
Gul Technologies Group
Kingboard Holdings
WUS Printed Circuit (Kunshan)
Victory Giant Technology
Dongguan Shengyi Electronics
Murata Manufacturing
Bomin Electronics
Guangdong Ellington Electronic Technology
DSBJ (Dongshan Precision)
Unimicron
Founder PCB
Nippon Mektron
TTM Technologies, Inc
Nan Ya PCB
Meiko Electronics
Daeduck Electronics
Simmtech
AKM Meadville
Fujikura Printed Circuits
CMK Corporation
Aoshikang Technology
Dynamic Electronics
Jiangsu Allfavor Intelligent Circuits Technology
Guangdong Kingshine Electronics
Sunshine Global Circuits
Glorysky Electronics

Key Questions Addressed in this Report

What is the 10-year outlook for the global High Speed PCB market?

What factors are driving High Speed PCB market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do High Speed PCB market opportunities vary by end market size?

How does High Speed PCB break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.