The global High Heat Resistance Phenolic Molding Compounds market size is predicted to grow from US$ 452 million in 2025 to US$ 605 million in 2031; it is expected to grow at a CAGR of 5.0% from 2025 to 2031.
Phenolic molding compound is based on phenolic resin as the matrix resin, hexamethyltetramine as the curing agent, plus various additives such as inorganic ore fillers, glass fibers, etc. The thermosetting plastics after high temperature mixing, its intentional heat resistance, The mechanical properties, acid resistance, alkali resistance and electrical insulation properties make the application of phenolic molding compounds more and more widely.
High heat resistance phenolic molding compound is a type of phenolic molding compound, it is widely used in electrical industry equipment, automobile parts, high temperature resistant cookware and other fields due to its ultra-high heat resistance.
Geographically, Japan's high heat-resistant phenolic molding compound has an international leading level and has a long history. Some Japanese manufacturers such as Sumitomo Bakelite and Panasonic, which are market leaders, have production sites in China. In recent years, China's production has been at the forefront of the world.
The global key High Heat Resistance Phenolic Molding Compounds manufacturers include Sumitomo Bakelite, Panasonic, Chang Chun Group, Plenco, Fudow Company Limited, Hexion, Jiangsu Zhongpeng New Material, Wuxi Chuangda Advanced Materials, etc. From the perspective of manufacturers, High Heat Resistance Phenolic Molding Compounds are relatively concentrated, and the top three manufacturers accounted for more than 54% of revenue in 2024. The competitive advantages of high heat-resistant phenolic molding compound manufacturers are mainly reflected in their entry barriers and technical barriers.
Looking to the future, new energy electric vehicles are expected to come into more common use around the world, and this will drive continuous growth in demand for high heat resistance phenolic molding compounds. The market for advanced equipment is set to expand, spurred by the development of newer products and broader areas of application. Accordingly, the demand for automotive components will likely grow, a prospect for which ensuring a stable supply of high heat resistance phenolic molding compounds is expected to become increasingly important.
LP Information, Inc. (LPI) ' newest research report, the “High Heat Resistance Phenolic Molding Compounds Industry Forecast” looks at past sales and reviews total world High Heat Resistance Phenolic Molding Compounds sales in 2024, providing a comprehensive analysis by region and market sector of projected High Heat Resistance Phenolic Molding Compounds sales for 2025 through 2031. With High Heat Resistance Phenolic Molding Compounds sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world High Heat Resistance Phenolic Molding Compounds industry.
This Insight Report provides a comprehensive analysis of the global High Heat Resistance Phenolic Molding Compounds landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on High Heat Resistance Phenolic Molding Compounds portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global High Heat Resistance Phenolic Molding Compounds market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for High Heat Resistance Phenolic Molding Compounds and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global High Heat Resistance Phenolic Molding Compounds.
This report presents a comprehensive overview, market shares, and growth opportunities of High Heat Resistance Phenolic Molding Compounds market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Compression Molding Compound
Injection Molding Compound
Segmentation by Application:
Automotive Components
Electrical and Eelectronic Equipment
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Sumitomo Bakelite
Panasonic
Chang Chun Group
Plenco
Hexion
Fudow Company
Jiangsu Zhongpeng New Material
Wuxi Chuangda Advanced Materials
Raschig GmbH
Beijing Sino-tech Electronic Material
Taizhou Changxiong Plastic
Shanghai European-Asian Synthetic Material
Changshu Southeast Plastic
Sprea Misr
Amity Thermosets (P) Ltd
Key Questions Addressed in this Report
What is the 10-year outlook for the global High Heat Resistance Phenolic Molding Compounds market?
What factors are driving High Heat Resistance Phenolic Molding Compounds market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do High Heat Resistance Phenolic Molding Compounds market opportunities vary by end market size?
How does High Heat Resistance Phenolic Molding Compounds break out by Type, by Application?
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