Global Through Glass Via (TGV) Technology Market Growth (Status and Outlook) 2026-2032
Description
The global Through Glass Via (TGV) Technology market size is predicted to grow from US$ 156 million in 2025 to US$ 840 million in 2032; it is expected to grow at a CAGR of 26.0% from 2026 to 2032.
Through Glass Via (TGV) Technology refers to an advanced packaging technology in which through micro-vias are formed in substrates such as borosilicate glass and fused silica (quartz), and the via sidewalls are metallized to create a three-dimensional interconnect structure with vertical electrical interconnection capability. In terms of process flow, high-aspect-ratio micro-via arrays with diameters of 10–100 μm are typically formed in glass via laser drilling and dry/wet etching, followed by seed-layer deposition and electroplating fill to complete via metallization. Glass through-vias without metallization are only an intermediate form; only metallized TGV structures provide practical electrical interconnect functionality and qualify as a product.From an industrialization perspective, Through Glass Via technology ultimately materializes as TGV substrates densely populated with metallized vias, and is widely used in RF chips, high-end MEMS devices, and high-density 3D system integration. In this report’s quantitative accounting, “Through Glass Via (TGV) Technology” refers specifically to wafer-format TGV substrates that have completed via metallization and are ready for packaging applications.
The supply chain for TGV substrates typically involves upstream glass material suppliers, midstream laser drilling and copper filling processing plants, and downstream packaging houses and semiconductor manufacturers. Supplier concentration is relatively high, with significant technical barriers. Major suppliers are primarily located in the United States, Japan, South Korea, Europe, and a few regions in China.
TGV technology was initially developed by American, Japanese, and European companies to enable micro-interconnects for high-density packaging, addressing bottlenecks in high-speed and high-frequency signal transmission associated with silicon interconnects and traditional PCBs. In recent years, with the rapid development of 5G, optoelectronic devices, and sensors, TGV technology has gradually been applied in MEMS, optical modules, and high-frequency antenna packaging.
The primary industry prospects lie in high-frequency and high-speed packaging applications, such as 5G RF modules, optical communication devices, micro-sensors, and Micro-Electro-Mechanical Systems (MEMS) devices. The market for mid-to-low-end TGV products is relatively small, while high-end products maintain strong competitiveness due to their precision and reliability. In the future, with the growing demand for heterogeneous integration and advanced packaging, the TGV market is expected to continue expanding.
TGV substrate production involves processes such as glass cutting, laser drilling, cleaning, metallization, and electroplating. The production capacity of a single line is usually constrained by glass size, via diameter, and filling efficiency. A high-precision TGV production line can have an annual capacity ranging from several hundred thousand to millions of wafers, depending on the aperture, number of layers, and copper filling speed.
Due to complex processes and high technical barriers, TGV products generally yield high gross margins, typically within the range of 30% to 35%. The margin level is significantly influenced by the degree of production line automation, yield rate, and order scale.
Costs are primarily composed of raw materials (glass substrates account for approximately 50%-60%), processing technologies (laser drilling, copper deposition, electroplating, etc., accounting for 30%-40%), and equipment depreciation and labor (accounting for 10%-20%). High yield rates and high automation can significantly reduce unit costs.
After packaging is completed, TGV substrates are generally not sold separately but enter the market mainly as finished component devices. Production waste primarily consists of drilling debris, defective copper deposition products, and broken glass. Companies mitigate losses through recycling, reuse, or low-value disposal.
This report presents a comprehensive overview, market shares, and growth opportunities of Through Glass Via (TGV) Technology market by product type, application, key players and key regions and countries.
Segmentation by Type:
Panel-Level TGV Substrate
Wafer-Level TGV Substrate
Segmentation by Size:
300 mm Wafer Size
200 mm Wafer Size
150 mm Wafer Size
510*515 mm Panel Size
Others
Segmentation by Hole Diameter:
D < 50 μm
D ≥ 50 μm
Segmentation by Application:
Consumer Electronics
Automotive Electronics
High-performance Computing and Data Centers
Others
This report also splits the market by region:
United States
China
Europe
Other regions
Japan
South Korea
Southeast Asia
Rest of world
The report also presents the market competition landscape and a corresponding detailed analysis of the major players in the market. The key players covered in this report:
Corning
LPKF
Samtec
SCHOTT
Xiamen Sky Semiconductor Technology
Tecnisco
PLANOPTIK
NSG Group
AGC
JNTC
Please note: The report will take approximately 2 business days to prepare and deliver.
Through Glass Via (TGV) Technology refers to an advanced packaging technology in which through micro-vias are formed in substrates such as borosilicate glass and fused silica (quartz), and the via sidewalls are metallized to create a three-dimensional interconnect structure with vertical electrical interconnection capability. In terms of process flow, high-aspect-ratio micro-via arrays with diameters of 10–100 μm are typically formed in glass via laser drilling and dry/wet etching, followed by seed-layer deposition and electroplating fill to complete via metallization. Glass through-vias without metallization are only an intermediate form; only metallized TGV structures provide practical electrical interconnect functionality and qualify as a product.From an industrialization perspective, Through Glass Via technology ultimately materializes as TGV substrates densely populated with metallized vias, and is widely used in RF chips, high-end MEMS devices, and high-density 3D system integration. In this report’s quantitative accounting, “Through Glass Via (TGV) Technology” refers specifically to wafer-format TGV substrates that have completed via metallization and are ready for packaging applications.
The supply chain for TGV substrates typically involves upstream glass material suppliers, midstream laser drilling and copper filling processing plants, and downstream packaging houses and semiconductor manufacturers. Supplier concentration is relatively high, with significant technical barriers. Major suppliers are primarily located in the United States, Japan, South Korea, Europe, and a few regions in China.
TGV technology was initially developed by American, Japanese, and European companies to enable micro-interconnects for high-density packaging, addressing bottlenecks in high-speed and high-frequency signal transmission associated with silicon interconnects and traditional PCBs. In recent years, with the rapid development of 5G, optoelectronic devices, and sensors, TGV technology has gradually been applied in MEMS, optical modules, and high-frequency antenna packaging.
The primary industry prospects lie in high-frequency and high-speed packaging applications, such as 5G RF modules, optical communication devices, micro-sensors, and Micro-Electro-Mechanical Systems (MEMS) devices. The market for mid-to-low-end TGV products is relatively small, while high-end products maintain strong competitiveness due to their precision and reliability. In the future, with the growing demand for heterogeneous integration and advanced packaging, the TGV market is expected to continue expanding.
TGV substrate production involves processes such as glass cutting, laser drilling, cleaning, metallization, and electroplating. The production capacity of a single line is usually constrained by glass size, via diameter, and filling efficiency. A high-precision TGV production line can have an annual capacity ranging from several hundred thousand to millions of wafers, depending on the aperture, number of layers, and copper filling speed.
Due to complex processes and high technical barriers, TGV products generally yield high gross margins, typically within the range of 30% to 35%. The margin level is significantly influenced by the degree of production line automation, yield rate, and order scale.
Costs are primarily composed of raw materials (glass substrates account for approximately 50%-60%), processing technologies (laser drilling, copper deposition, electroplating, etc., accounting for 30%-40%), and equipment depreciation and labor (accounting for 10%-20%). High yield rates and high automation can significantly reduce unit costs.
After packaging is completed, TGV substrates are generally not sold separately but enter the market mainly as finished component devices. Production waste primarily consists of drilling debris, defective copper deposition products, and broken glass. Companies mitigate losses through recycling, reuse, or low-value disposal.
This report presents a comprehensive overview, market shares, and growth opportunities of Through Glass Via (TGV) Technology market by product type, application, key players and key regions and countries.
Segmentation by Type:
Panel-Level TGV Substrate
Wafer-Level TGV Substrate
Segmentation by Size:
300 mm Wafer Size
200 mm Wafer Size
150 mm Wafer Size
510*515 mm Panel Size
Others
Segmentation by Hole Diameter:
D < 50 μm
D ≥ 50 μm
Segmentation by Application:
Consumer Electronics
Automotive Electronics
High-performance Computing and Data Centers
Others
This report also splits the market by region:
United States
China
Europe
Other regions
Japan
South Korea
Southeast Asia
Rest of world
The report also presents the market competition landscape and a corresponding detailed analysis of the major players in the market. The key players covered in this report:
Corning
LPKF
Samtec
SCHOTT
Xiamen Sky Semiconductor Technology
Tecnisco
PLANOPTIK
NSG Group
AGC
JNTC
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
96 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Through Glass Via (TGV) Technology Key Players
- 4 Through Glass Via (TGV) Technology by Regions
- 5 United States
- 6 Europe
- 7 China
- 8 Rest of World
- 9 Market Drivers, Challenges and Trends
- 10 Key Investors in Through Glass Via (TGV) Technology
- 11 Key Players Analysis
- 12 Research Findings and Conclusion
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