Global Glass Core Substrates Market Growth 2025-2031

The global Glass Core Substrates market size is predicted to grow from US$ 238 million in 2025 to US$ 591 million in 2031; it is expected to grow at a CAGR of 16.3% from 2025 to 2031.

Glass core substrates are advanced packaging materials that use glass as the core layer instead of traditional organic (e.g., epoxy resin) or silicon-based substrates. They are designed to address the limitations of existing technologies in high-performance computing (HPC), AI chips, and advanced semiconductor packaging.

Global key players of Glass Substrate for Semiconductor Packaging include AGC, Schott, Corning, Hoya, Ohara, etc. The top five players hold a share about 90%. Asia-Pacific is the largest market, and has a share about 80%, followed by North America and Europe with share 16% and 3%, separately. In terms of product type, Coefficient of Thermal Expansion (CTE), above 5 ppm/°C is the largest segment, occupied for a share of 65%. In terms of application, Wafer Level Packaging has a share about 60 percent.

LP Information, Inc. (LPI) ' newest research report, the “Glass Core Substrates Industry Forecast” looks at past sales and reviews total world Glass Core Substrates sales in 2024, providing a comprehensive analysis by region and market sector of projected Glass Core Substrates sales for 2025 through 2031. With Glass Core Substrates sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Glass Core Substrates industry.

This Insight Report provides a comprehensive analysis of the global Glass Core Substrates landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Glass Core Substrates portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Glass Core Substrates market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Glass Core Substrates and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Glass Core Substrates.

This report presents a comprehensive overview, market shares, and growth opportunities of Glass Core Substrates market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Coefficient of Thermal Expansion (CTE), above 5 ppm/°C
Coefficient of Thermal Expansion (CTE), below 5 ppm/°C

Segmentation by Application:
Wafer Level Packaging
Panel Level Packaging

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
AGC
Schott
Corning
Hoya
Ohara
Dai Nippon Printing (DNP)
NEG
CrysTop Glass
WGTech

Key Questions Addressed in this Report

What is the 10-year outlook for the global Glass Core Substrates market?

What factors are driving Glass Core Substrates market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Glass Core Substrates market opportunities vary by end market size?

How does Glass Core Substrates break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.