Global Etchant for Under Bump Metallization (UBM) Market Growth 2025-2031
Description
The global Under Bump Metallization (UBM) System market size is predicted to grow from US$ 280 million in 2025 to US$ 396 million in 2031; it is expected to grow at a CAGR of 5.9% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
The Under Bump Metallization (UBM) system is a multilayer metal thin-film structure formed between the chip's I/O pads and bumps (typically solder balls or copper pillars) in flip-chip packaging. Deposited through processes like sputtering or electroplating with metals such as Ti/Cu/Ni/Au, UBM ensures reliable interconnection between the chip and substrate via metallurgical reactions. It provides compatibility with bump materials (e.g., solder wettability), enhances pad adhesion and mechanical connection strength, prevents metal diffusion, formation of brittle intermetallic compounds, and silicon corrosion, while optimizing signal integrity and interconnection performance. As a uniform soldering interface and barrier layer, UBM improves assembly yield and long-term reliability, making it a critical technology in flip-chip packaging and wafer-level packaging (WLP) for high-performance chip manufacturing.
United States market for Under Bump Metallization (UBM) System is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Under Bump Metallization (UBM) System is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Under Bump Metallization (UBM) System is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Under Bump Metallization (UBM) System players cover ASMPT, Classone Technology, KLA, PacTech, Veeco Instruments, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “Under Bump Metallization (UBM) System Industry Forecast” looks at past sales and reviews total world Under Bump Metallization (UBM) System sales in 2024, providing a comprehensive analysis by region and market sector of projected Under Bump Metallization (UBM) System sales for 2025 through 2031. With Under Bump Metallization (UBM) System sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Under Bump Metallization (UBM) System industry.
This Insight Report provides a comprehensive analysis of the global Under Bump Metallization (UBM) System landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Under Bump Metallization (UBM) System portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Under Bump Metallization (UBM) System market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Under Bump Metallization (UBM) System and breaks down the forecast Deposition Techniques, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Under Bump Metallization (UBM) System.
This report presents a comprehensive overview, market shares, and growth opportunities of Under Bump Metallization (UBM) System market by product type, application, key manufacturers and key regions and countries.
Segmentation Deposition Techniques:
Physical Vapor Deposition, PVD (Evaporation/Sputtering)
Electroplating
Electroless Plating
Segmentation by Application:
Integrated Circuits
Substrate
Printed Circuit Board
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
ASMPT
Classone Technology
KLA
PacTech
Veeco Instruments
Denton Vacuum
Applied Materials
AP&S
Key Questions Addressed in this Report
What is the 10-year outlook for the global Under Bump Metallization (UBM) System market?
What factors are driving Under Bump Metallization (UBM) System market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Under Bump Metallization (UBM) System market opportunities vary by end market size?
How does Under Bump Metallization (UBM) System break out Deposition Techniques, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
The Under Bump Metallization (UBM) system is a multilayer metal thin-film structure formed between the chip's I/O pads and bumps (typically solder balls or copper pillars) in flip-chip packaging. Deposited through processes like sputtering or electroplating with metals such as Ti/Cu/Ni/Au, UBM ensures reliable interconnection between the chip and substrate via metallurgical reactions. It provides compatibility with bump materials (e.g., solder wettability), enhances pad adhesion and mechanical connection strength, prevents metal diffusion, formation of brittle intermetallic compounds, and silicon corrosion, while optimizing signal integrity and interconnection performance. As a uniform soldering interface and barrier layer, UBM improves assembly yield and long-term reliability, making it a critical technology in flip-chip packaging and wafer-level packaging (WLP) for high-performance chip manufacturing.
United States market for Under Bump Metallization (UBM) System is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Under Bump Metallization (UBM) System is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Under Bump Metallization (UBM) System is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Under Bump Metallization (UBM) System players cover ASMPT, Classone Technology, KLA, PacTech, Veeco Instruments, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “Under Bump Metallization (UBM) System Industry Forecast” looks at past sales and reviews total world Under Bump Metallization (UBM) System sales in 2024, providing a comprehensive analysis by region and market sector of projected Under Bump Metallization (UBM) System sales for 2025 through 2031. With Under Bump Metallization (UBM) System sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Under Bump Metallization (UBM) System industry.
This Insight Report provides a comprehensive analysis of the global Under Bump Metallization (UBM) System landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Under Bump Metallization (UBM) System portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Under Bump Metallization (UBM) System market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Under Bump Metallization (UBM) System and breaks down the forecast Deposition Techniques, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Under Bump Metallization (UBM) System.
This report presents a comprehensive overview, market shares, and growth opportunities of Under Bump Metallization (UBM) System market by product type, application, key manufacturers and key regions and countries.
Segmentation Deposition Techniques:
Physical Vapor Deposition, PVD (Evaporation/Sputtering)
Electroplating
Electroless Plating
Segmentation by Application:
Integrated Circuits
Substrate
Printed Circuit Board
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
ASMPT
Classone Technology
KLA
PacTech
Veeco Instruments
Denton Vacuum
Applied Materials
AP&S
Key Questions Addressed in this Report
What is the 10-year outlook for the global Under Bump Metallization (UBM) System market?
What factors are driving Under Bump Metallization (UBM) System market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Under Bump Metallization (UBM) System market opportunities vary by end market size?
How does Under Bump Metallization (UBM) System break out Deposition Techniques, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
104 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Etchant for Under Bump Metallization (UBM) by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Etchant for Under Bump Metallization (UBM) by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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