Global Epoxy Resin Thermal Conductive Potting Glue Market Growth 2025-2031

The global Epoxy Resin Thermal Conductive Potting Glue market size is predicted to grow from US$ 382 million in 2025 to US$ 589 million in 2031; it is expected to grow at a CAGR of 7.5% from 2025 to 2031.

Epoxy resin thermal conductive potting glue is a protective material specially designed for electronic components and circuit boards. It combines the excellent mechanical properties and high thermal conductivity of epoxy resin, and can form a strong protective layer with good thermal conductivity after curing. This potting glue is mainly used to fill and seal the gaps between electronic components, effectively conduct the heat generated inside, prevent damage caused by overheating, and provide multiple protection functions such as moisture-proof, corrosion-proof, and earthquake-proof. Epoxy resin thermal conductive potting glue is widely used in LED lamps, power modules, automotive electronics and other fields to ensure the reliability and long life of electronic equipment in complex environments.

The development trend of epoxy resin thermal conductive potting glue is moving towards high performance and multifunctionality. Future products will pay more attention to improving thermal conductivity and reducing thermal resistance while maintaining good mechanical properties and chemical stability. In addition, increasingly stringent environmental regulations have prompted manufacturers to develop halogen-free, low-volatile organic compound (VOC) green products. With the trend of electronic products towards miniaturization and lightweight, the requirements for potting glue are also increasing, including better fluidity and the ability to adapt to complex shapes, as well as higher temperature resistance and anti-aging performance to meet the needs of emerging markets such as electric vehicles, 5G communication equipment and high-performance computing equipment.

LP Information, Inc. (LPI) ' newest research report, the “Epoxy Resin Thermal Conductive Potting Glue Industry Forecast” looks at past sales and reviews total world Epoxy Resin Thermal Conductive Potting Glue sales in 2024, providing a comprehensive analysis by region and market sector of projected Epoxy Resin Thermal Conductive Potting Glue sales for 2025 through 2031. With Epoxy Resin Thermal Conductive Potting Glue sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Epoxy Resin Thermal Conductive Potting Glue industry.

This Insight Report provides a comprehensive analysis of the global Epoxy Resin Thermal Conductive Potting Glue landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Epoxy Resin Thermal Conductive Potting Glue portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Epoxy Resin Thermal Conductive Potting Glue market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Epoxy Resin Thermal Conductive Potting Glue and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Epoxy Resin Thermal Conductive Potting Glue.

This report presents a comprehensive overview, market shares, and growth opportunities of Epoxy Resin Thermal Conductive Potting Glue market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
One-component
Two-component

Segmentation by Application:
Aircraft
Automobile
Electronics
Other

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Anchuam
Parker
MG Chemicals
Henkel
KYOCERA
3M
Kafuter
Elantas
Shengkangtai Silicone Materials
Zhaoke Electronic Materials Technology Co., Ltd.
Jiaxing Shaohua Plastic New Materials Co., Ltd.
Shenzhen Dabond Technology Co., Ltd.

Key Questions Addressed in this Report

What is the 10-year outlook for the global Epoxy Resin Thermal Conductive Potting Glue market?

What factors are driving Epoxy Resin Thermal Conductive Potting Glue market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Epoxy Resin Thermal Conductive Potting Glue market opportunities vary by end market size?

How does Epoxy Resin Thermal Conductive Potting Glue break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.