Global Epoxy Resin Impregnated Paper Sleeve (RIP) Market Growth 2025-2031
Description
The global Epoxy Resin Impregnated Paper Sleeve (RIP) market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.
Epoxy resin impregnated paper casing (RIP) is currently the mainstream dry casing product in my country and the global market. Bushings are used in electrical equipment as support for current-carrying conductors, insulation between conductors and equipment enclosures/walls. Since the insulating layer does not contain insulating oil, the dry bushing is safer and more environmentally friendly, and its application ratio is gradually increasing. The core body of epoxy resin impregnated paper sleeve is made of epoxy resin impregnated insulating paper, also known as glue impregnated paper sleeve.
United States market for Epoxy Resin Impregnated Paper Sleeve (RIP) is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Epoxy Resin Impregnated Paper Sleeve (RIP) is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Epoxy Resin Impregnated Paper Sleeve (RIP) is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Epoxy Resin Impregnated Paper Sleeve (RIP) players cover ABB, Weidmann Electrical, SIEMENS AG, General Electric Company, HITACHI, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “Epoxy Resin Impregnated Paper Sleeve (RIP) Industry Forecast” looks at past sales and reviews total world Epoxy Resin Impregnated Paper Sleeve (RIP) sales in 2024, providing a comprehensive analysis by region and market sector of projected Epoxy Resin Impregnated Paper Sleeve (RIP) sales for 2025 through 2031. With Epoxy Resin Impregnated Paper Sleeve (RIP) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Epoxy Resin Impregnated Paper Sleeve (RIP) industry.
This Insight Report provides a comprehensive analysis of the global Epoxy Resin Impregnated Paper Sleeve (RIP) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Epoxy Resin Impregnated Paper Sleeve (RIP) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Epoxy Resin Impregnated Paper Sleeve (RIP) market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Epoxy Resin Impregnated Paper Sleeve (RIP) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Epoxy Resin Impregnated Paper Sleeve (RIP).
This report presents a comprehensive overview, market shares, and growth opportunities of Epoxy Resin Impregnated Paper Sleeve (RIP) market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Silicone Rubber Exterior Insulation
Ceramic External Insulation
Segmentation by Application:
Transformer
Reactor
Switchgear
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
ABB
Weidmann Electrical
SIEMENS AG
General Electric Company
HITACHI
Baiyun Power Group
Ahlstrom
Nanjing Rainbow Electric Co., Ltd
China XD Electric Co.,Ltd
Sieyuan Electric Co.,Ltd
Key Questions Addressed in this Report
What is the 10-year outlook for the global Epoxy Resin Impregnated Paper Sleeve (RIP) market?
What factors are driving Epoxy Resin Impregnated Paper Sleeve (RIP) market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Epoxy Resin Impregnated Paper Sleeve (RIP) market opportunities vary by end market size?
How does Epoxy Resin Impregnated Paper Sleeve (RIP) break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Epoxy resin impregnated paper casing (RIP) is currently the mainstream dry casing product in my country and the global market. Bushings are used in electrical equipment as support for current-carrying conductors, insulation between conductors and equipment enclosures/walls. Since the insulating layer does not contain insulating oil, the dry bushing is safer and more environmentally friendly, and its application ratio is gradually increasing. The core body of epoxy resin impregnated paper sleeve is made of epoxy resin impregnated insulating paper, also known as glue impregnated paper sleeve.
United States market for Epoxy Resin Impregnated Paper Sleeve (RIP) is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Epoxy Resin Impregnated Paper Sleeve (RIP) is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Epoxy Resin Impregnated Paper Sleeve (RIP) is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Epoxy Resin Impregnated Paper Sleeve (RIP) players cover ABB, Weidmann Electrical, SIEMENS AG, General Electric Company, HITACHI, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “Epoxy Resin Impregnated Paper Sleeve (RIP) Industry Forecast” looks at past sales and reviews total world Epoxy Resin Impregnated Paper Sleeve (RIP) sales in 2024, providing a comprehensive analysis by region and market sector of projected Epoxy Resin Impregnated Paper Sleeve (RIP) sales for 2025 through 2031. With Epoxy Resin Impregnated Paper Sleeve (RIP) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Epoxy Resin Impregnated Paper Sleeve (RIP) industry.
This Insight Report provides a comprehensive analysis of the global Epoxy Resin Impregnated Paper Sleeve (RIP) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Epoxy Resin Impregnated Paper Sleeve (RIP) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Epoxy Resin Impregnated Paper Sleeve (RIP) market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Epoxy Resin Impregnated Paper Sleeve (RIP) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Epoxy Resin Impregnated Paper Sleeve (RIP).
This report presents a comprehensive overview, market shares, and growth opportunities of Epoxy Resin Impregnated Paper Sleeve (RIP) market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Silicone Rubber Exterior Insulation
Ceramic External Insulation
Segmentation by Application:
Transformer
Reactor
Switchgear
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
ABB
Weidmann Electrical
SIEMENS AG
General Electric Company
HITACHI
Baiyun Power Group
Ahlstrom
Nanjing Rainbow Electric Co., Ltd
China XD Electric Co.,Ltd
Sieyuan Electric Co.,Ltd
Key Questions Addressed in this Report
What is the 10-year outlook for the global Epoxy Resin Impregnated Paper Sleeve (RIP) market?
What factors are driving Epoxy Resin Impregnated Paper Sleeve (RIP) market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Epoxy Resin Impregnated Paper Sleeve (RIP) market opportunities vary by end market size?
How does Epoxy Resin Impregnated Paper Sleeve (RIP) break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
98 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Epoxy Resin Impregnated Paper Sleeve (RIP) by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Epoxy Resin Impregnated Paper Sleeve (RIP) by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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