Global Epoxy Resin Encapsulation Glue for IC Packaging Market Growth 2025-2031

The global Epoxy Resin Encapsulation Glue for IC Packaging market size is predicted to grow from US$ 632 million in 2025 to US$ 1692 million in 2031; it is expected to grow at a CAGR of 17.8% from 2025 to 2031.

The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.

Epoxy resin encapsulation glue for IC packaging is a thermosetting polymer material specially designed for integrated circuit (IC) chip protection and packaging. It is based on epoxy resin and modified by adding curing agent, inorganic filler, flame retardant and stress regulator. After curing, it forms a high-strength insulating shell with excellent heat resistance, low dielectric constant, low thermal expansion coefficient and moisture penetration resistance. It can effectively protect the chip from mechanical stress, chemical corrosion and electromagnetic interference. At the same time, it can achieve high thermal conductivity or electromagnetic shielding function by adjusting the formula.

United States market for Epoxy Resin Encapsulation Glue for IC Packaging is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Epoxy Resin Encapsulation Glue for IC Packaging is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Epoxy Resin Encapsulation Glue for IC Packaging is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Epoxy Resin Encapsulation Glue for IC Packaging players cover 3M, Henkel, Parker LORD, SolEpoxy, Epic Resins, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LP Information, Inc. (LPI) ' newest research report, the “Epoxy Resin Encapsulation Glue for IC Packaging Industry Forecast” looks at past sales and reviews total world Epoxy Resin Encapsulation Glue for IC Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Epoxy Resin Encapsulation Glue for IC Packaging sales for 2025 through 2031. With Epoxy Resin Encapsulation Glue for IC Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Epoxy Resin Encapsulation Glue for IC Packaging industry.

This Insight Report provides a comprehensive analysis of the global Epoxy Resin Encapsulation Glue for IC Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Epoxy Resin Encapsulation Glue for IC Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Epoxy Resin Encapsulation Glue for IC Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Epoxy Resin Encapsulation Glue for IC Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Epoxy Resin Encapsulation Glue for IC Packaging.

This report presents a comprehensive overview, market shares, and growth opportunities of Epoxy Resin Encapsulation Glue for IC Packaging market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
One-component
Two-component

Segmentation by Application:
Consumer Electronics
Computers and Data Centers
Automotive Electronics
Medical Electronics
Industrial
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
3M
Henkel
Parker LORD
SolEpoxy
Epic Resins
Robnor ResinLab
Guangdong Anders Industrial Co., Ltd.
Shantou Niche-Tech Kaiser Co., Ltd.
Dongguan Huachuang Electronic Materials Co., Ltd.
Guangdong Wanmu New Material Technology Co., Ltd.
Beijing Kmt Technology Co., Ltd
Yongdeji Technology (Suzhou) Co., Ltd.
Shanghai Dodi Polymer Material Co., Ltd.
Hubei Huitian New Materials Co., Ltd.
Dongguan Sains Industrial Co., Ltd.

Key Questions Addressed in this Report

What is the 10-year outlook for the global Epoxy Resin Encapsulation Glue for IC Packaging market?

What factors are driving Epoxy Resin Encapsulation Glue for IC Packaging market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Epoxy Resin Encapsulation Glue for IC Packaging market opportunities vary by end market size?

How does Epoxy Resin Encapsulation Glue for IC Packaging break out by Type, by Application?

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