Global Electronic Parts Packaging Cover Tape Market Growth 2025-2031
Description
The global Electronic Parts Packaging Cover Tape market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.
Electronic parts packaging cover tapes are mainly used in the electronic component mounting industry. It is used with carrier tape to carry and store electronic components such as resistors, capacitors, transistors, and diodes in the pockets of the carrier tape. The cover tape is sealed above the pocket formed by the carrier tape to form a closed package to protect the electronic components. Free from contamination and damage during transportation.
United States market for Electronic Parts Packaging Cover Tape is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Electronic Parts Packaging Cover Tape is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Electronic Parts Packaging Cover Tape is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Electronic Parts Packaging Cover Tape players cover 3M, ASAHIKASEI TECHNOPLUS, FORCE-ONE APPLIED MATERIALS, Shenzhen Delixin, SINHO ELECTRONIC TECHNOLOGY, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “Electronic Parts Packaging Cover Tape Industry Forecast” looks at past sales and reviews total world Electronic Parts Packaging Cover Tape sales in 2024, providing a comprehensive analysis by region and market sector of projected Electronic Parts Packaging Cover Tape sales for 2025 through 2031. With Electronic Parts Packaging Cover Tape sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Electronic Parts Packaging Cover Tape industry.
This Insight Report provides a comprehensive analysis of the global Electronic Parts Packaging Cover Tape landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Electronic Parts Packaging Cover Tape portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Electronic Parts Packaging Cover Tape market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Electronic Parts Packaging Cover Tape and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Electronic Parts Packaging Cover Tape.
This report presents a comprehensive overview, market shares, and growth opportunities of Electronic Parts Packaging Cover Tape market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Heat Activated Cover Tape
Pressure Sensitive Cover Tape
Segmentation by Application:
Active Components
Passive Components
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
3M
ASAHIKASEI TECHNOPLUS
FORCE-ONE APPLIED MATERIALS
Shenzhen Delixin
SINHO ELECTRONIC TECHNOLOGY
ITW EBA
Advantek
AQ PACK MALAYSIA
Denka
Shin-Etsu Polymer
ROTHE
C-Pak
Advanced Component Taping
Argosy Inc.
Dongguan Jiushuo Industrial
Zhuhai Tongxi Electronics Technology
Hwa Shu Enterprise
Sumitomo Bakelite
TAIWAN CARRIER TAPE (TCTEC)
Laser Tek
U-PAK
Nexteck Singapore Pte Ltd.
Carrier-Tech Precision
Shenzhen Sewate Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global Electronic Parts Packaging Cover Tape market?
What factors are driving Electronic Parts Packaging Cover Tape market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Electronic Parts Packaging Cover Tape market opportunities vary by end market size?
How does Electronic Parts Packaging Cover Tape break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Electronic parts packaging cover tapes are mainly used in the electronic component mounting industry. It is used with carrier tape to carry and store electronic components such as resistors, capacitors, transistors, and diodes in the pockets of the carrier tape. The cover tape is sealed above the pocket formed by the carrier tape to form a closed package to protect the electronic components. Free from contamination and damage during transportation.
United States market for Electronic Parts Packaging Cover Tape is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Electronic Parts Packaging Cover Tape is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Electronic Parts Packaging Cover Tape is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Electronic Parts Packaging Cover Tape players cover 3M, ASAHIKASEI TECHNOPLUS, FORCE-ONE APPLIED MATERIALS, Shenzhen Delixin, SINHO ELECTRONIC TECHNOLOGY, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “Electronic Parts Packaging Cover Tape Industry Forecast” looks at past sales and reviews total world Electronic Parts Packaging Cover Tape sales in 2024, providing a comprehensive analysis by region and market sector of projected Electronic Parts Packaging Cover Tape sales for 2025 through 2031. With Electronic Parts Packaging Cover Tape sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Electronic Parts Packaging Cover Tape industry.
This Insight Report provides a comprehensive analysis of the global Electronic Parts Packaging Cover Tape landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Electronic Parts Packaging Cover Tape portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Electronic Parts Packaging Cover Tape market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Electronic Parts Packaging Cover Tape and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Electronic Parts Packaging Cover Tape.
This report presents a comprehensive overview, market shares, and growth opportunities of Electronic Parts Packaging Cover Tape market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Heat Activated Cover Tape
Pressure Sensitive Cover Tape
Segmentation by Application:
Active Components
Passive Components
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
3M
ASAHIKASEI TECHNOPLUS
FORCE-ONE APPLIED MATERIALS
Shenzhen Delixin
SINHO ELECTRONIC TECHNOLOGY
ITW EBA
Advantek
AQ PACK MALAYSIA
Denka
Shin-Etsu Polymer
ROTHE
C-Pak
Advanced Component Taping
Argosy Inc.
Dongguan Jiushuo Industrial
Zhuhai Tongxi Electronics Technology
Hwa Shu Enterprise
Sumitomo Bakelite
TAIWAN CARRIER TAPE (TCTEC)
Laser Tek
U-PAK
Nexteck Singapore Pte Ltd.
Carrier-Tech Precision
Shenzhen Sewate Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global Electronic Parts Packaging Cover Tape market?
What factors are driving Electronic Parts Packaging Cover Tape market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Electronic Parts Packaging Cover Tape market opportunities vary by end market size?
How does Electronic Parts Packaging Cover Tape break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
160 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Electronic Parts Packaging Cover Tape by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Electronic Parts Packaging Cover Tape by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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