Global EUV Lithography Pellicle Market Growth 2025-2031

The global EUV Lithography Pellicle market size is predicted to grow from US$ 102 million in 2025 to US$ 170 million in 2031; it is expected to grow at a CAGR of 8.9% from 2025 to 2031.

In a typical semiconductor process, a thin protective film is usually placed on the surface of the photomask to protect it from contaminants. This thin film, called a pellicle, prevents undesirable conditions or defects in the wafer circuit pattern, thereby protecting the IC chip from potential damage. In addition, the mask protective film is also a consumable that needs to be replaced regularly, and because the light source wavelength of EUV lithography equipment is shorter, the protective film needs to be thinner to increase light transmittance.

Initially, the pellicle was a single-layer structure with a core layer made of polysilicon. Since 2021, EUV pellicle have adopted composite materials. Its key components now consist of alternating molybdenum disilicide (MoSi₂) and silicon (Si) layers to form a multi-layer structure. EUV transmittance (EUVT) is a key performance indicator of EUV pellicle. The transition from a single-layer structure to a multi-layer structure has increased EUVT from about 82% to about 90%. The next generation of film technology will go beyond structural changes (from single-layer to multi-layer) and introduce material advances, leading to the emergence of CNT pellicle.

Driven by advances in artificial intelligence (AI) and computing technology, the semiconductor industry's demand for advanced chips continues to grow, with the fastest growth in chips below 7nm manufactured using EUV technology. In advanced processes of 7nm and below, the pattern size on the mask may be only tens of nanometers, which places extremely strict requirements on the uniformity and defect control of the Pellicle. The next generation of high-power EUV lithography machines operates at more than 500W, and EUV films are needed to protect the photomask from particle contamination during chip production.

In recent years, the phenomenon of chipmakers adopting extreme ultraviolet (EUV) processes in their advanced chip manufacturing is rapidly increasing. To meet this growing demand, many companies are developing protective films for EUV processes.

ASML launched its first EUV pellicle in 2019 and licensed the technology to Mitsui Chemicals, which began mass sales in 2021. Since then, ASML has made improvements to its pellicle. It is reported that Mitsui Chemicals' next-generation CNT pellicle production facility will be completed by the end of 2025.

In 2021, South Korean company S&S Tech developed a pellicle with a transmittance of more than 90%. FST's EUV pellicle is still in the development stage.

Canatu has been working with Imec since 2015 to develop CNT pellicle to meet performance targets such as life and transmittance, thermal durability, permeability and strength.

LP Information, Inc. (LPI) ' newest research report, the “EUV Lithography Pellicle Industry Forecast” looks at past sales and reviews total world EUV Lithography Pellicle sales in 2024, providing a comprehensive analysis by region and market sector of projected EUV Lithography Pellicle sales for 2025 through 2031. With EUV Lithography Pellicle sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world EUV Lithography Pellicle industry.

This Insight Report provides a comprehensive analysis of the global EUV Lithography Pellicle landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on EUV Lithography Pellicle portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global EUV Lithography Pellicle market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for EUV Lithography Pellicle and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global EUV Lithography Pellicle.

This report presents a comprehensive overview, market shares, and growth opportunities of EUV Lithography Pellicle market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Transmittance: ＞90%
Transmittance: ≤ 90%

Segmentation by Application:
Integrated Device Manufacturer (IDM)
Foundry

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Mitsui
S&S Tech
Canatu
TSMC

Key Questions Addressed in this Report

What is the 10-year outlook for the global EUV Lithography Pellicle market?

What factors are driving EUV Lithography Pellicle market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do EUV Lithography Pellicle market opportunities vary by end market size?

How does EUV Lithography Pellicle break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.