Global Double Table Fiber Laser Cutting Machine Market Growth 2025-2031
Description
The global Double Table Fiber Laser Cutting Machine market size is predicted to grow from US$ 989 million in 2025 to US$ 1648 million in 2031; it is expected to grow at a CAGR of 8.9% from 2025 to 2031.
Electronics manufacturing uses both wet and dry etching, but for different processes, much like using course- and fine-toothed saws to make different size and different quality cuts. In wet etching, aqueous solutions of acids or bases are used to quickly remove large amounts of material, or to completely remove a particular material. Dry etching uses plasma-activated etchant gases, usually containing halogen atoms, to selectively remove a portion of a material with greater precision and accuracy than wet etching can achieve. It is the dry etching process, often referred to as reactive ion etching or RIE.
The etching process requires a chemical reaction between the electron gas and the etched material. The etching process requires a large amount of fluorocarbon gases, such as hexafluoroethane, carbon tetrafluoride, trifluoromethane, octafluorocyclobutane, octafluorobutane, etc. The etched gas undergoes a chemical reaction with the etched material, resulting in the elimination of the etched material. In the etching process of wafer manufacturing, especially in the dry etching process, in order to achieve directional etching, it is necessary to use electronic special gases to form plasma under ionization conditions. The plasma undergoes chemical or physical reactions with the etched material to remove a portion of the etched material. Different electron gases are also used for reactions in different etching targets.
The commonly used etching gases include fluorinated and chlorinated gases, as well as oxygen-containing gases and some rare gases.
In the field of electronic semiconductors, etching gases are widely used in industries such as integrated Circuits, liquid crystal panels, LED and photovoltaics. Among them, integrated circuit manufacturing is the most important application. In recent years, downstream industry technologies have rapidly changed, especially in the field of integrated circuit manufacturing, where process nodes have been continuously reduced, ranging from 28nm to 5nm processes, and wafer sizes from 8-inch to 12-inch wafers. As a key material in integrated circuit manufacturing, with the rapid iteration of downstream industrial technology, the requirements for purity and accuracy of special gases continue to improve.
Asia Pacific is the region with the largest demand for semiconductor grade etching gases. Etching gases mainly include fluorine containing gas, chlorine containing gas, oxygen containing gas and other types. And the fluorine containing gas is the most common. Fluorinated containing gas include the following gases: CF4, NF3, SF6, CH2F2, CHF3, C2F6, C3F8, C4F8, C5F8, HF, etc. Silicon wafer etching gases are mainly fluorine-containing gases, but they are isotropic and have poor selectivity.
LP Information, Inc. (LPI) ' newest research report, the “Double Table Fiber Laser Cutting Machine Industry Forecast” looks at past sales and reviews total world Double Table Fiber Laser Cutting Machine sales in 2024, providing a comprehensive analysis by region and market sector of projected Double Table Fiber Laser Cutting Machine sales for 2025 through 2031. With Double Table Fiber Laser Cutting Machine sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Double Table Fiber Laser Cutting Machine industry.
This Insight Report provides a comprehensive analysis of the global Double Table Fiber Laser Cutting Machine landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Double Table Fiber Laser Cutting Machine portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Double Table Fiber Laser Cutting Machine market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Double Table Fiber Laser Cutting Machine and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Double Table Fiber Laser Cutting Machine.
This report presents a comprehensive overview, market shares, and growth opportunities of Double Table Fiber Laser Cutting Machine market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Open Type Fiber Laser Cutting Machine
Closed Type Fiber Laser Cutting Machine
Segmentation by Application:
General Machinery Processing
Automotive Industry
Home Appliance
Aerospace and Marine
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Trumpf
Han's Laser
Amada
LVD
Penta-Chutian
HG Laser
DXTECH
EETO Laser Equipment
EKS Laser
OWT Automation
Alpha CNC
Tianchen Machine Group
Acme Laser
iGOLDENCNC
Key Questions Addressed in this Report
What is the 10-year outlook for the global Double Table Fiber Laser Cutting Machine market?
What factors are driving Double Table Fiber Laser Cutting Machine market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Double Table Fiber Laser Cutting Machine market opportunities vary by end market size?
How does Double Table Fiber Laser Cutting Machine break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Electronics manufacturing uses both wet and dry etching, but for different processes, much like using course- and fine-toothed saws to make different size and different quality cuts. In wet etching, aqueous solutions of acids or bases are used to quickly remove large amounts of material, or to completely remove a particular material. Dry etching uses plasma-activated etchant gases, usually containing halogen atoms, to selectively remove a portion of a material with greater precision and accuracy than wet etching can achieve. It is the dry etching process, often referred to as reactive ion etching or RIE.
The etching process requires a chemical reaction between the electron gas and the etched material. The etching process requires a large amount of fluorocarbon gases, such as hexafluoroethane, carbon tetrafluoride, trifluoromethane, octafluorocyclobutane, octafluorobutane, etc. The etched gas undergoes a chemical reaction with the etched material, resulting in the elimination of the etched material. In the etching process of wafer manufacturing, especially in the dry etching process, in order to achieve directional etching, it is necessary to use electronic special gases to form plasma under ionization conditions. The plasma undergoes chemical or physical reactions with the etched material to remove a portion of the etched material. Different electron gases are also used for reactions in different etching targets.
The commonly used etching gases include fluorinated and chlorinated gases, as well as oxygen-containing gases and some rare gases.
In the field of electronic semiconductors, etching gases are widely used in industries such as integrated Circuits, liquid crystal panels, LED and photovoltaics. Among them, integrated circuit manufacturing is the most important application. In recent years, downstream industry technologies have rapidly changed, especially in the field of integrated circuit manufacturing, where process nodes have been continuously reduced, ranging from 28nm to 5nm processes, and wafer sizes from 8-inch to 12-inch wafers. As a key material in integrated circuit manufacturing, with the rapid iteration of downstream industrial technology, the requirements for purity and accuracy of special gases continue to improve.
Asia Pacific is the region with the largest demand for semiconductor grade etching gases. Etching gases mainly include fluorine containing gas, chlorine containing gas, oxygen containing gas and other types. And the fluorine containing gas is the most common. Fluorinated containing gas include the following gases: CF4, NF3, SF6, CH2F2, CHF3, C2F6, C3F8, C4F8, C5F8, HF, etc. Silicon wafer etching gases are mainly fluorine-containing gases, but they are isotropic and have poor selectivity.
LP Information, Inc. (LPI) ' newest research report, the “Double Table Fiber Laser Cutting Machine Industry Forecast” looks at past sales and reviews total world Double Table Fiber Laser Cutting Machine sales in 2024, providing a comprehensive analysis by region and market sector of projected Double Table Fiber Laser Cutting Machine sales for 2025 through 2031. With Double Table Fiber Laser Cutting Machine sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Double Table Fiber Laser Cutting Machine industry.
This Insight Report provides a comprehensive analysis of the global Double Table Fiber Laser Cutting Machine landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Double Table Fiber Laser Cutting Machine portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Double Table Fiber Laser Cutting Machine market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Double Table Fiber Laser Cutting Machine and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Double Table Fiber Laser Cutting Machine.
This report presents a comprehensive overview, market shares, and growth opportunities of Double Table Fiber Laser Cutting Machine market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Open Type Fiber Laser Cutting Machine
Closed Type Fiber Laser Cutting Machine
Segmentation by Application:
General Machinery Processing
Automotive Industry
Home Appliance
Aerospace and Marine
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Trumpf
Han's Laser
Amada
LVD
Penta-Chutian
HG Laser
DXTECH
EETO Laser Equipment
EKS Laser
OWT Automation
Alpha CNC
Tianchen Machine Group
Acme Laser
iGOLDENCNC
Key Questions Addressed in this Report
What is the 10-year outlook for the global Double Table Fiber Laser Cutting Machine market?
What factors are driving Double Table Fiber Laser Cutting Machine market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Double Table Fiber Laser Cutting Machine market opportunities vary by end market size?
How does Double Table Fiber Laser Cutting Machine break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
118 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Double Table Fiber Laser Cutting Machine by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Double Table Fiber Laser Cutting Machine by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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