Global Die Attach Machine Market Growth 2025-2031

The global Die Attach Machine market size is predicted to grow from US$ 1372 million in 2025 to US$ 1783 million in 2031; it is expected to grow at a CAGR of 4.5% from 2025 to 2031.

Die Attach Machine responsible for accurately placing various microchips, electronic components, etc. on the corresponding positions on the surface of the printed circuit board (PCB) that has been printed with solder paste or patch adhesive in the production line. This process usually involves high-precision mechanical movement, visual recognition, precise control and automated operation technologies to ensure the accuracy and efficiency of chip placement.

With the trend of miniaturization, multifunctionality and intelligence of electronic products, the market demand for chip mounters continues to grow. Especially in the fields of smartphones, tablets, automotive electronics, IoT devices, etc., the application of chip mounters is becoming more and more extensive, and the market scale is expanding.

Market driving force: With the continuous growth of consumer demand for electronic products, especially the popularity of smart devices such as smartphones and tablets, the demand for chip mounters has also increased. These devices have extremely high requirements for the accuracy and efficiency of chip mounting, which has promoted the rapid development of the chip mounter market. The continuous advancement of chip mounter technology, including technological innovations in machine vision, precision machinery, and automation control, has provided strong support for the rapid development of the chip mounter market.

Market challenges and obstacles: The technology involved in chip mounters is highly complex, including high-precision mechanical movement, visual recognition, and precise control. The research and development and application of these technologies require a lot of manpower, material and financial resources, which poses a great challenge to enterprises. The chip mounter market is highly competitive, and domestic and foreign brands have increased their R&D investment and market expansion efforts to compete for market share. This makes enterprises face tremendous pressure and challenges in market competition. The prices of raw materials required for chip placement machine production, such as precision mechanical parts and electronic components, are greatly affected by international market price fluctuations. Fluctuations in raw material prices will affect the production cost and market price of chip placement machines, which in turn poses a challenge to the profitability of enterprises.

Regional development: Asia is one of the centers of the global electronics manufacturing industry, especially China, Japan, South Korea and other countries, which have a huge electronics manufacturing industry chain and market demand. The chip placement machine market in these regions is developing rapidly and has a huge market size. The electronics manufacturing industry in North America also has a high level of technology and market demand. In particular, the United States, as one of the centers of global scientific and technological innovation, its chip placement machine market is also showing a rapid development trend. The electronics manufacturing industry in Europe also has strong technical strength and market demand. In particular, countries such as Germany and France have developed electronics manufacturing industries and have a large demand for chip placement machines.

LP Information, Inc. (LPI) ' newest research report, the “Die Attach Machine Industry Forecast” looks at past sales and reviews total world Die Attach Machine sales in 2024, providing a comprehensive analysis by region and market sector of projected Die Attach Machine sales for 2025 through 2031. With Die Attach Machine sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Die Attach Machine industry.

This Insight Report provides a comprehensive analysis of the global Die Attach Machine landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Die Attach Machine portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Die Attach Machine market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Die Attach Machine and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Die Attach Machine.

This report presents a comprehensive overview, market shares, and growth opportunities of Die Attach Machine market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

SMT Die Attach

Advanced Packaging Die Attach

Segmentation by Application:

Memory

MEMS

LED

Optoelectronic

Others

This report also splits the market by region:

Americas

United States

Canada

Mexico

Brazil

APAC

China

Japan

Korea

Southeast Asia

India

Australia

Europe

Germany

France

UK

Italy

Russia

Middle East & Africa

Egypt

South Africa

Israel

Turkey

GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.

JUKI

LASER X

Fuji Corporation

ASMPT SMT Solutions

Panasonic

Yamaha Motor

Hanwha Precision

Universal Instruments Corporation

Europlacer

Mirae

Beijing Torch

Key Questions Addressed in this Report

What is the 10-year outlook for the global Die Attach Machine market?

What factors are driving Die Attach Machine market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Die Attach Machine market opportunities vary by end market size?

How does Die Attach Machine break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.


*This is a tentative TOC and the final deliverable is subject to change.*
2 Executive Summary
3 Global by Company
4 World Historic Review for Die Attach Machine by Geographic Region
5 Americas
6 APAC
7 Europe
8 Middle East & Africa
9 Market Drivers, Challenges and Trends
10 Manufacturing Cost Structure Analysis
11 Marketing, Distributors and Customer
12 World Forecast Review for Die Attach Machine by Geographic Region
13 Key Players Analysis
14 Research Findings and Conclusion

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