Global DCB and AMB Substrates for Power Modules Market Growth 2025-2031

The global DCB and AMB Substrates for Power Modules market size is predicted to grow from US$ 1001 million in 2025 to US$ 2045 million in 2031; it is expected to grow at a CAGR of 12.6% from 2025 to 2031.

The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.

DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic. This report studies the DBC ceramic substrate, including the AlN DBC Ceramic Substrate and Al2O3 DBC Ceramic Substrate. Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800µm on thin ceramic substrates of just 0.25mm.

The global DBC ceramic substrates market is dominated by few players like Rogers Corporation, Ferrotec, NGK Electronics Devices, KCC, Shengda Tech, BYD, Heraeus Electronics and Nanjing Zhongjiang New Material, etc. Global five players hold a share over 79.8 percent in 2024. In recent years, more and more Chinese players enter the DBC ceramic substrates market, driven by the rapid growth of new energy vehicles in China market. In future, the Chinese players will play more roles around the world.

The global key manufacturers of AMB Ceramic Substrate include Rogers Corporation, Ferrotec, BYD, Toshiba Materials, Heraeus Electronics, Denka, Proterial and Mitsubishi Materials, etc. In 2023, the global top eight players had a share approximately 85% in terms of revenue.

Currently the AMB ceramic substrates are mainly produced in Japan, Germany and China, which account for 27.3%, 24.56% and 43.5% of the market share respectively in 2023. It is expected that China's production share will reach 57% in 2030. As NGK Electronics Devices and Ferrotec have started or built factories to produce AMB in Malaysia, Southeast Asia is expected to play an important role as a production base in the next few years.

LP Information, Inc. (LPI) ' newest research report, the “DCB and AMB Substrates for Power Modules Industry Forecast” looks at past sales and reviews total world DCB and AMB Substrates for Power Modules sales in 2024, providing a comprehensive analysis by region and market sector of projected DCB and AMB Substrates for Power Modules sales for 2025 through 2031. With DCB and AMB Substrates for Power Modules sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world DCB and AMB Substrates for Power Modules industry.

This Insight Report provides a comprehensive analysis of the global DCB and AMB Substrates for Power Modules landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on DCB and AMB Substrates for Power Modules portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global DCB and AMB Substrates for Power Modules market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for DCB and AMB Substrates for Power Modules and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global DCB and AMB Substrates for Power Modules.

This report presents a comprehensive overview, market shares, and growth opportunities of DCB and AMB Substrates for Power Modules market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
DBC Ceramic Substrates
AMB Ceramic Substrate

Segmentation by Application:
Automotive Power Modules
PV and Wind Power
Industrial Drives
Rail Transport
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Rogers Corporation
Heraeus Electronics
Kyocera
NGK Electronics Devices
Toshiba Materials
Denka
DOWA METALTECH
KCC
Proterial
Mitsubishi Materials
Jiangsu Fulehua Semiconductor Technology
BYD
Bomin Electronics
Zhejiang TC Ceramic Electronic
Shengda Tech
Beijing Moshi Technology
Nantong Winspower
Wuxi Tianyang Electronics
Fengpeng Electronics (Zhuhai)
Guangzhou Xianyi Electronic Technology
Fujian Huaqing Electronic Material Technology
Konfoong Materials International
Littelfuse IXYS
FJ Composite
Zhejiang Jingci Semiconductor
Taotao Technology
Guangde Dongfeng Semiconductor
Anhui Taoxinke Semiconductor
Suzhou Aicheng Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global DCB and AMB Substrates for Power Modules market?

What factors are driving DCB and AMB Substrates for Power Modules market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do DCB and AMB Substrates for Power Modules market opportunities vary by end market size?

How does DCB and AMB Substrates for Power Modules break out by Type, by Application?

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