Global Conductive Die Attach Paste Market Growth 2025-2031
Description
The global Conductive Die Attach Paste market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.
High thermal conductivity die attach film, also known as a die attach adhesive or die attach film (DAF), is a specialized material used in semiconductor packaging and electronics assembly.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
LP Information, Inc. (LPI) ' newest research report, the “Conductive Die Attach Paste Industry Forecast” looks at past sales and reviews total world Conductive Die Attach Paste sales in 2024, providing a comprehensive analysis by region and market sector of projected Conductive Die Attach Paste sales for 2025 through 2031. With Conductive Die Attach Paste sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Conductive Die Attach Paste industry.
This Insight Report provides a comprehensive analysis of the global Conductive Die Attach Paste landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Conductive Die Attach Paste portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Conductive Die Attach Paste market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Conductive Die Attach Paste and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Conductive Die Attach Paste.
This report presents a comprehensive overview, market shares, and growth opportunities of Conductive Die Attach Paste market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
No-clean Pastes
Rosin-based Pastes
Water Soluble Pastes
Others
Segmentation by Application:
SMT Assembly
Semiconductor Packaging
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
MacDermid Alpha Electronics Solutions
KCC Corporation
Henkel
Indium Corporation
Sumitomo Bakelite
Heraeu
AIM Solder
Tamura
Kyocera
Al Technology
Creative Materials
NAMICS
Tongfang Electronic New Material
Shenmao Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global Conductive Die Attach Paste market?
What factors are driving Conductive Die Attach Paste market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Conductive Die Attach Paste market opportunities vary by end market size?
How does Conductive Die Attach Paste break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
High thermal conductivity die attach film, also known as a die attach adhesive or die attach film (DAF), is a specialized material used in semiconductor packaging and electronics assembly.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
LP Information, Inc. (LPI) ' newest research report, the “Conductive Die Attach Paste Industry Forecast” looks at past sales and reviews total world Conductive Die Attach Paste sales in 2024, providing a comprehensive analysis by region and market sector of projected Conductive Die Attach Paste sales for 2025 through 2031. With Conductive Die Attach Paste sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Conductive Die Attach Paste industry.
This Insight Report provides a comprehensive analysis of the global Conductive Die Attach Paste landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Conductive Die Attach Paste portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Conductive Die Attach Paste market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Conductive Die Attach Paste and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Conductive Die Attach Paste.
This report presents a comprehensive overview, market shares, and growth opportunities of Conductive Die Attach Paste market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
No-clean Pastes
Rosin-based Pastes
Water Soluble Pastes
Others
Segmentation by Application:
SMT Assembly
Semiconductor Packaging
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
MacDermid Alpha Electronics Solutions
KCC Corporation
Henkel
Indium Corporation
Sumitomo Bakelite
Heraeu
AIM Solder
Tamura
Kyocera
Al Technology
Creative Materials
NAMICS
Tongfang Electronic New Material
Shenmao Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global Conductive Die Attach Paste market?
What factors are driving Conductive Die Attach Paste market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Conductive Die Attach Paste market opportunities vary by end market size?
How does Conductive Die Attach Paste break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
112 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Conductive Die Attach Paste by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Conductive Die Attach Paste by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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