Global Computing Power Equipment Cooling Module Market Growth 2025-2031

The global Computing Power Equipment Cooling Module market size is predicted to grow from US$ 1308 million in 2025 to US$ 1782 million in 2031; it is expected to grow at a CAGR of 5.3% from 2025 to 2031.

Computing Power Equipment Cooling Module is a critical component designed to provide efficient cooling solutions for high-power electronic devices such as servers, data centers, personal computers, etc. Among them, air-cooled heat sink modules include server heat sink modules, laptop heat sink modules, clean energy heat sink modules, and other customized heat sink modules, while liquid-cooled heat sink modules encompass tube-type liquid-cooled plates, buried-tube liquid-cooled plates, and integrated liquid-cooled plates. Air-cooled heat sink modules are characterized by their high heat dissipation power, while liquid-cooled heat sink modules feature waterproof and dustproof designs, are more energy-efficient than air-cooled systems, offer better heat flux density, high reliability, and allow for flexible fluid channel design to adapt to scenarios requiring higher heat dissipation power. These heat sink modules are widely used in servers/data centers, laptops, PCs, all-in-one computers, game consoles, projectors, medical, electronic, and power industries, among others.

United States market for Computing Power Equipment Cooling Module is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Computing Power Equipment Cooling Module is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Computing Power Equipment Cooling Module is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Computing Power Equipment Cooling Module players cover NIDEC CORPORATION, Jones Technology, SHENZHEN FRD SCIENCE& TECHNOLOGY, Suzhou Tianmai Thermal Technology, HYMN Advanced Material Technology, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LP Information, Inc. (LPI) ' newest research report, the “Computing Power Equipment Cooling Module Industry Forecast” looks at past sales and reviews total world Computing Power Equipment Cooling Module sales in 2024, providing a comprehensive analysis by region and market sector of projected Computing Power Equipment Cooling Module sales for 2025 through 2031. With Computing Power Equipment Cooling Module sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Computing Power Equipment Cooling Module industry.

This Insight Report provides a comprehensive analysis of the global Computing Power Equipment Cooling Module landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Computing Power Equipment Cooling Module portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Computing Power Equipment Cooling Module market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Computing Power Equipment Cooling Module and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Computing Power Equipment Cooling Module.

This report presents a comprehensive overview, market shares, and growth opportunities of Computing Power Equipment Cooling Module market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Air-cooled
Liquid-cooled

Segmentation by Application:
Server
GPU
Laptop
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
NIDEC CORPORATION
Jones Technology
SHENZHEN FRD SCIENCE& TECHNOLOGY
Suzhou Tianmai Thermal Technology
HYMN Advanced Material Technology
AURAS Technology
Forcecon Technology
Suzhou Yongteng Electronic Product
NTK HOLDINGS LIMITED
Shenzhen Weibochi Thermal Technology
Jentech Precision Industrial
LINGYI iTECH (GUANGDONG) COMPANY
Jiangsu Gian Technology
Taisol Electronics
ZheJiang RIFA Precision Machinery

Key Questions Addressed in this Report

What is the 10-year outlook for the global Computing Power Equipment Cooling Module market?

What factors are driving Computing Power Equipment Cooling Module market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Computing Power Equipment Cooling Module market opportunities vary by end market size?

How does Computing Power Equipment Cooling Module break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.