The global Computing in Memory Technology market size is predicted to grow from US$ 628 million in 2025 to US$ 196160 million in 2031; it is expected to grow at a CAGR of 160.5% from 2025 to 2031.
As a new computing architecture, storage-computing integration is considered to be a revolutionary technology with potential and has received great attention at home and abroad. The core is to fully integrate storage and computing, effectively overcome the bottleneck of the von Neumann architecture, and combine advanced packaging and new storage devices in the post-Moore era to achieve an order of magnitude improvement in computing energy efficiency.
According to the distance between storage and computing, the technical solutions of generalized storage-computing integration are divided into three categories, namely, Processing Near Memory (PNM), Processing ln Memory (PlM) and Computing in Memory (CIM). In-memory computing is storage-computing integration in a narrow sense.
Global key players of Computing in Memory Technology include Syntiant, Zhicun(Witmem) Technology, Reexen Technology, Graphcore and Mythic, etc. The top five players hold a share over 80%. North America is the largest market, has a share about 50%. In terms of product type, In-memory Computing is the largest segment, occupied for a share of about 88%, and in terms of application, Small Computing Power has a share about 90 percent.
Analysis of the market drivers of Processing-in-Memory (PIM) technology,
1. Explosive growth in computing power demand: the underlying pressure of AI and big data
Demand for AI training and reasoning:
The global AI chip market is expected to reach US$120 billion in 2025, of which 75% of computing power is consumed in data transfer (not computing itself).
Large-scale language models (such as GPT-5) have more than 10 trillion parameters, and processing-in-memory (PIM) can improve the efficiency of sparse matrix operations by 3-5 times.
Data center energy consumption crisis:
Global data center power consumption accounts for 1.5% of total power demand, and data transfer energy consumption accounts for 40% in traditional architectures. Processing-in-Memory (PIM) can reduce energy consumption by more than 50% by reducing the memory wall effect.
2. Moore's Law slows down: an inevitable choice for architectural innovation
Process bottleneck:
The cost of advanced processes (below 3nm) has soared, and the marginal benefits of increasing transistor density have diminished. Processing-in-Memory integrates computing units through 3D stacking processes (such as HBM3) to break through the limitations of planar processes.
Heterogeneous computing needs:
Scenarios such as AI and graphics processing require customized computing units. Storage and computing integration supports the collaborative design of the logic layer and the storage layer to improve the efficiency of dedicated accelerators.
3. New storage technologies mature: hardware foundation is ready
Non-volatile memory (NVM) rises:
New memories such as ReRAM, MRAM, and PCM have analog computing capabilities and are naturally adapted to the storage and computing integration architecture. For example, the resistance state of ReRAM can directly participate in matrix operations.
Storage-class memory (SCM) popularization:
SCM technologies such as Intel Optane and Samsung Z-NAND have been mass-produced, providing PIM with high-performance, low-latency storage media.
4. Edge computing and IoT scenarios: energy efficiency revolution
The computing power dilemma of end-side devices:
Devices such as autonomous driving, AR/VR need to process massive amounts of data locally (such as 8K video streams). Storage and computing integration can reduce power consumption by 70% and extend battery life by 2-3 times.
Real-time requirements:
Predictive maintenance in industrial IoT needs to respond within microseconds, and storage and computing integration reduces data processing latency from milliseconds to nanoseconds.
5. Software ecology and algorithm collaboration: application scenario expansion
Sparse algorithm optimization:
Sparse matrices account for more than 95% of neural networks, and storage and computing integration can skip zero-value calculations, improving efficiency by more than 10 times.
Programming model evolution:
PIM-oriented spatial computing paradigms (such as NDA and GenASM) are gradually maturing, and developers can call computing units in storage.
6. Policy and capital promotion: global technology competition upgrades
National strategic support:
The US CHIPS Act and the EU's European Processor Initiative both list storage and computing integration as key directions. China's "14th Five-Year Plan" clearly supports the development of storage and computing integrated chips.
Capital inflow:
In 2023, global PIM financing will exceed US$5 billion, and giants such as Samsung, SK Hynix, and TSMC will accelerate their layout, and start-ups such as Mythic and UPMEM will receive multiple rounds of financing.
7. Supply chain reconstruction: from vertical integration to open collaboration
Industry chain collaboration:
Memory manufacturers (Micron, Kioxia) and IP suppliers (Synopsys, Cadence) cooperate to develop PIM design tool chains.
Foundries (SMIC, UMC) launched 2.5D/3D packaging technology to support mass production of integrated storage and computing chips.
Summary: The integrated storage and computing technology market is driven by computing power demand, hardware innovation, and policy capital. The core competition will focus on process integration capabilities (such as 3D stacking), algorithm-hardware co-design, and ecological openness. Chinese companies need to overcome the shortcomings of memory media and EDA tools and accelerate the commercialization of AI and edge scenarios.
LPI (LP Information)' newest research report, the “Computing in Memory Technology Industry Forecast” looks at past sales and reviews total world Computing in Memory Technology sales in 2024, providing a comprehensive analysis by region and market sector of projected Computing in Memory Technology sales for 2025 through 2031. With Computing in Memory Technology sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Computing in Memory Technology industry.
This Insight Report provides a comprehensive analysis of the global Computing in Memory Technology landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Computing in Memory Technology portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Computing in Memory Technology market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Computing in Memory Technology and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Computing in Memory Technology.
This report presents a comprehensive overview, market shares, and growth opportunities of Computing in Memory Technology market by product type, application, key players and key regions and countries.
Segmentation by Type:
Near-Memory Computing
In-memory Computing
Processing In Memory
Segmentation by Application:
Small Computing Power
Big Computing Power
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Syntiant
Zhicun(Witmem) Technology
Reexen Technology
Graphcore
Mythic
Shanyi Semiconductor
AistarTek
Samsung
SK Hynix
Houmo Technology
Pinxin Technology
Yizhu Intelligent Technology
TensorChip
Please note: The report will take approximately 2 business days to prepare and deliver.
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