Global Chip on Board (COB) Encapsulants Market Growth 2025-2031

The global Chip on Board (COB) Encapsulants market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.

United States market for Chip on Board (COB) Encapsulants is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Chip on Board (COB) Encapsulants is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Chip on Board (COB) Encapsulants is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Chip on Board (COB) Encapsulants players cover Nagase ChemteX, Henkel, Hangzhou First, Dymax, DuPont, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LP Information, Inc. (LPI) ' newest research report, the “Chip on Board (COB) Encapsulants Industry Forecast” looks at past sales and reviews total world Chip on Board (COB) Encapsulants sales in 2024, providing a comprehensive analysis by region and market sector of projected Chip on Board (COB) Encapsulants sales for 2025 through 2031. With Chip on Board (COB) Encapsulants sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Chip on Board (COB) Encapsulants industry.

This Insight Report provides a comprehensive analysis of the global Chip on Board (COB) Encapsulants landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Chip on Board (COB) Encapsulants portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Chip on Board (COB) Encapsulants market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Chip on Board (COB) Encapsulants and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Chip on Board (COB) Encapsulants.

This report presents a comprehensive overview, market shares, and growth opportunities of Chip on Board (COB) Encapsulants market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Silicone Type
Expoxy Resin

Segmentation by Application:
LED
ICs
Other

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Nagase ChemteX
Henkel
Hangzhou First
Dymax
DuPont
Shenzhen Guanghengwei
Suzhou Yichang Electronics
Shenzhen Pujia New Materials
Longain New Materials(Yantai)

Key Questions Addressed in this Report

What is the 10-year outlook for the global Chip on Board (COB) Encapsulants market?

What factors are driving Chip on Board (COB) Encapsulants market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Chip on Board (COB) Encapsulants market opportunities vary by end market size?

How does Chip on Board (COB) Encapsulants break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver. Show more