Global Chemicals for PCB Electroless Nickel Immersion Gold Market Growth 2026-2032
Description
The global Chemicals for PCB Electroless Nickel Immersion Gold market size is predicted to grow from US$ 436 million in 2025 to US$ 589 million in 2032; it is expected to grow at a CAGR of 4.5% from 2026 to 2032.
Chemicals for PCB Electroless Nickel Immersion Gold (ENIG) refer to a complete set of chemical solutions and process chemicals used to deposit a layer of nickel (Ni) followed by a layer of gold (Au) onto the bare copper surface of printed circuit boards (PCBs) through chemical reactions. These chemicals provide excellent solderability, conductivity, corrosion resistance, and long-term stability, and include electroless nickel plating solution and electroless gold plating solution.The upstream core lies in precious metal raw materials (such as gold salts and nickel salts) and high-purity chemical additives (such as complexing agents, reducing agents, and stabilizers).The global sales volume is projected to be approximately 50,200 tons in 2025, with an average market price of approximately US$8,900 per ton. The industry's gross profit margin is approximately 30-50%.
Electroless nickel-gold plating technology refers to the process of depositing a nickel layer on the bare copper surface of a PCB using palladium as a catalyst, through a chemical oxidation-reduction reaction. The nickel layer is then coated with an extremely thin layer of gold through a combination of displacement and reduction reactions in a chemical gold plating solution. The quality of the electroless nickel-gold plating directly affects the reliability of terminal soldering and the electrical performance of the PCB.
As a key surface treatment process for achieving high-density connections and excellent conductivity, electroless nickel-gold plating holds an irreplaceable strategic position in high-end circuit board manufacturing. With the downstream PCB industry transitioning towards high-density interconnect (HDI), ultra-thin designs, and lead-free processes, there are higher demands on the uniformity of the gold surface and the ability to prevent black pad defects in electroless nickel-gold plating solutions. This is driving continuous iterative upgrades in the industry chain towards higher reliability and environmental friendliness.
LP Information, Inc. (LPI) ' newest research report, the “Chemicals for PCB Electroless Nickel Immersion Gold Industry Forecast” looks at past sales and reviews total world Chemicals for PCB Electroless Nickel Immersion Gold sales in 2025, providing a comprehensive analysis by region and market sector of projected Chemicals for PCB Electroless Nickel Immersion Gold sales for 2026 through 2032. With Chemicals for PCB Electroless Nickel Immersion Gold sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Chemicals for PCB Electroless Nickel Immersion Gold industry.
This Insight Report provides a comprehensive analysis of the global Chemicals for PCB Electroless Nickel Immersion Gold landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Chemicals for PCB Electroless Nickel Immersion Gold portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Chemicals for PCB Electroless Nickel Immersion Gold market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Chemicals for PCB Electroless Nickel Immersion Gold and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Chemicals for PCB Electroless Nickel Immersion Gold.
This report presents a comprehensive overview, market shares, and growth opportunities of Chemicals for PCB Electroless Nickel Immersion Gold market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Electroless Nickel Plating
Electroless Gold Plating
Other
Segmentation by Phosphorus Content:
7%-9% P
10%-12% P
Other
Segmentation by Application:
Communications
Consumer Electronics
Automotive
Medical
Aerospace
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Atotech
Uyemura
MacDermid Alpha
Qnity
Technic
JCU
OKUNO Chemical
YMT
GHTech
Shenzhen Chuangzhi Semi-link Technology
Sanfu New Materials
Shenzhen Xingjingwei Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global Chemicals for PCB Electroless Nickel Immersion Gold market?
What factors are driving Chemicals for PCB Electroless Nickel Immersion Gold market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Chemicals for PCB Electroless Nickel Immersion Gold market opportunities vary by end market size?
How does Chemicals for PCB Electroless Nickel Immersion Gold break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Chemicals for PCB Electroless Nickel Immersion Gold (ENIG) refer to a complete set of chemical solutions and process chemicals used to deposit a layer of nickel (Ni) followed by a layer of gold (Au) onto the bare copper surface of printed circuit boards (PCBs) through chemical reactions. These chemicals provide excellent solderability, conductivity, corrosion resistance, and long-term stability, and include electroless nickel plating solution and electroless gold plating solution.The upstream core lies in precious metal raw materials (such as gold salts and nickel salts) and high-purity chemical additives (such as complexing agents, reducing agents, and stabilizers).The global sales volume is projected to be approximately 50,200 tons in 2025, with an average market price of approximately US$8,900 per ton. The industry's gross profit margin is approximately 30-50%.
Electroless nickel-gold plating technology refers to the process of depositing a nickel layer on the bare copper surface of a PCB using palladium as a catalyst, through a chemical oxidation-reduction reaction. The nickel layer is then coated with an extremely thin layer of gold through a combination of displacement and reduction reactions in a chemical gold plating solution. The quality of the electroless nickel-gold plating directly affects the reliability of terminal soldering and the electrical performance of the PCB.
As a key surface treatment process for achieving high-density connections and excellent conductivity, electroless nickel-gold plating holds an irreplaceable strategic position in high-end circuit board manufacturing. With the downstream PCB industry transitioning towards high-density interconnect (HDI), ultra-thin designs, and lead-free processes, there are higher demands on the uniformity of the gold surface and the ability to prevent black pad defects in electroless nickel-gold plating solutions. This is driving continuous iterative upgrades in the industry chain towards higher reliability and environmental friendliness.
LP Information, Inc. (LPI) ' newest research report, the “Chemicals for PCB Electroless Nickel Immersion Gold Industry Forecast” looks at past sales and reviews total world Chemicals for PCB Electroless Nickel Immersion Gold sales in 2025, providing a comprehensive analysis by region and market sector of projected Chemicals for PCB Electroless Nickel Immersion Gold sales for 2026 through 2032. With Chemicals for PCB Electroless Nickel Immersion Gold sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Chemicals for PCB Electroless Nickel Immersion Gold industry.
This Insight Report provides a comprehensive analysis of the global Chemicals for PCB Electroless Nickel Immersion Gold landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Chemicals for PCB Electroless Nickel Immersion Gold portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Chemicals for PCB Electroless Nickel Immersion Gold market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Chemicals for PCB Electroless Nickel Immersion Gold and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Chemicals for PCB Electroless Nickel Immersion Gold.
This report presents a comprehensive overview, market shares, and growth opportunities of Chemicals for PCB Electroless Nickel Immersion Gold market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Electroless Nickel Plating
Electroless Gold Plating
Other
Segmentation by Phosphorus Content:
7%-9% P
10%-12% P
Other
Segmentation by Application:
Communications
Consumer Electronics
Automotive
Medical
Aerospace
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Atotech
Uyemura
MacDermid Alpha
Qnity
Technic
JCU
OKUNO Chemical
YMT
GHTech
Shenzhen Chuangzhi Semi-link Technology
Sanfu New Materials
Shenzhen Xingjingwei Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global Chemicals for PCB Electroless Nickel Immersion Gold market?
What factors are driving Chemicals for PCB Electroless Nickel Immersion Gold market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Chemicals for PCB Electroless Nickel Immersion Gold market opportunities vary by end market size?
How does Chemicals for PCB Electroless Nickel Immersion Gold break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
121 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Chemicals for PCB Electroless Nickel Immersion Gold by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Chemicals for PCB Electroless Nickel Immersion Gold by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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