Global Chemical Gas Dry Etching Machine Market Growth 2025-2031
Description
The global Chemical Gas Dry Etching Machine market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.
Chemical gas dry etching machine is a device used in microelectronics manufacturing for the process of chemical etching of material surfaces. Compared with traditional wet etching, chemical gas dry etching machines use gas reactions instead of liquid solutions for etching, hence they are called "dry" etching. The working principle of a chemical gas dry etching machine is to remove parts of the material surface by exposing the material to a specific atmosphere and utilizing chemical or physical reactions. It uses specific chemical gases (such as fluoride, chloride, etc.) and plasma generation technology to etch the material surface in the form of high-energy particles. The main components of the chemical gas dry etching machine include: a reaction chamber: a sealed container providing an etching area for placing material samples to be etched. The environmental control in the reaction chamber can ensure the stability and consistency of the etching process. Gas supply system: used to provide the chemical gas mixture required for etching. The gas supply system usually includes a gas source, gas control valve, and gas purification device to ensure the supply of high-purity gas. Plasma source: A device that generates plasma, usually using an RF or microwave power source. The plasma source generates high-energy particles for etching the material surface by ionizing the gas. Control system: Used to monitor and control parameters of the etching process, such as gas flow rate, pressure, power, etc. The control system can adjust parameters according to specific etching requirements to achieve the desired etching effect. Chemical gas dry etching machines are widely used in fields such as integrated circuit manufacturing, nanomachining, and optical device manufacturing. It has high precision, high selectivity, and high efficiency etching ability, which can achieve micron level structure and pattern preparation. In addition, dry etching has lower pollution and corrosion risks compared to wet etching, and has better adaptability to specific materials and structures.
United States market for Chemical Gas Dry Etching Machine is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Chemical Gas Dry Etching Machine is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Chemical Gas Dry Etching Machine is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Chemical Gas Dry Etching Machine players cover Applied Materials, Inc., Lam Research Corporation, Tokyo Electron Limited, ASML Holding N.V., KLA Corporation, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “Chemical Gas Dry Etching Machine Industry Forecast” looks at past sales and reviews total world Chemical Gas Dry Etching Machine sales in 2024, providing a comprehensive analysis by region and market sector of projected Chemical Gas Dry Etching Machine sales for 2025 through 2031. With Chemical Gas Dry Etching Machine sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Chemical Gas Dry Etching Machine industry.
This Insight Report provides a comprehensive analysis of the global Chemical Gas Dry Etching Machine landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Chemical Gas Dry Etching Machine portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Chemical Gas Dry Etching Machine market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Chemical Gas Dry Etching Machine and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Chemical Gas Dry Etching Machine.
This report presents a comprehensive overview, market shares, and growth opportunities of Chemical Gas Dry Etching Machine market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Flat Chemical Gas Dry Etching Machine
Barrel Chemical Gas Dry Etching Machine
Reaction Chamber Chemical Gas Dry Etching Machine
Segmentation by Application:
Semiconductor Industry
Optoelectronics Industry
Biomedical Industry
Nano Industry
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Applied Materials, Inc.
Lam Research Corporation
Tokyo Electron Limited
ASML Holding N.V.
KLA Corporation
Hitachi High-Technologies Corporation
SCREEN Holdings Co., Ltd.
Nikon Corporation
ASM International N.V.
Veeco Instruments Inc.
SPTS Technologies Ltd.
Mattson Technology, Inc.
Axcelis Technologies, Inc.
Key Questions Addressed in this Report
What is the 10-year outlook for the global Chemical Gas Dry Etching Machine market?
What factors are driving Chemical Gas Dry Etching Machine market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Chemical Gas Dry Etching Machine market opportunities vary by end market size?
How does Chemical Gas Dry Etching Machine break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Chemical gas dry etching machine is a device used in microelectronics manufacturing for the process of chemical etching of material surfaces. Compared with traditional wet etching, chemical gas dry etching machines use gas reactions instead of liquid solutions for etching, hence they are called "dry" etching. The working principle of a chemical gas dry etching machine is to remove parts of the material surface by exposing the material to a specific atmosphere and utilizing chemical or physical reactions. It uses specific chemical gases (such as fluoride, chloride, etc.) and plasma generation technology to etch the material surface in the form of high-energy particles. The main components of the chemical gas dry etching machine include: a reaction chamber: a sealed container providing an etching area for placing material samples to be etched. The environmental control in the reaction chamber can ensure the stability and consistency of the etching process. Gas supply system: used to provide the chemical gas mixture required for etching. The gas supply system usually includes a gas source, gas control valve, and gas purification device to ensure the supply of high-purity gas. Plasma source: A device that generates plasma, usually using an RF or microwave power source. The plasma source generates high-energy particles for etching the material surface by ionizing the gas. Control system: Used to monitor and control parameters of the etching process, such as gas flow rate, pressure, power, etc. The control system can adjust parameters according to specific etching requirements to achieve the desired etching effect. Chemical gas dry etching machines are widely used in fields such as integrated circuit manufacturing, nanomachining, and optical device manufacturing. It has high precision, high selectivity, and high efficiency etching ability, which can achieve micron level structure and pattern preparation. In addition, dry etching has lower pollution and corrosion risks compared to wet etching, and has better adaptability to specific materials and structures.
United States market for Chemical Gas Dry Etching Machine is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Chemical Gas Dry Etching Machine is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Chemical Gas Dry Etching Machine is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Chemical Gas Dry Etching Machine players cover Applied Materials, Inc., Lam Research Corporation, Tokyo Electron Limited, ASML Holding N.V., KLA Corporation, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “Chemical Gas Dry Etching Machine Industry Forecast” looks at past sales and reviews total world Chemical Gas Dry Etching Machine sales in 2024, providing a comprehensive analysis by region and market sector of projected Chemical Gas Dry Etching Machine sales for 2025 through 2031. With Chemical Gas Dry Etching Machine sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Chemical Gas Dry Etching Machine industry.
This Insight Report provides a comprehensive analysis of the global Chemical Gas Dry Etching Machine landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Chemical Gas Dry Etching Machine portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Chemical Gas Dry Etching Machine market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Chemical Gas Dry Etching Machine and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Chemical Gas Dry Etching Machine.
This report presents a comprehensive overview, market shares, and growth opportunities of Chemical Gas Dry Etching Machine market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Flat Chemical Gas Dry Etching Machine
Barrel Chemical Gas Dry Etching Machine
Reaction Chamber Chemical Gas Dry Etching Machine
Segmentation by Application:
Semiconductor Industry
Optoelectronics Industry
Biomedical Industry
Nano Industry
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Applied Materials, Inc.
Lam Research Corporation
Tokyo Electron Limited
ASML Holding N.V.
KLA Corporation
Hitachi High-Technologies Corporation
SCREEN Holdings Co., Ltd.
Nikon Corporation
ASM International N.V.
Veeco Instruments Inc.
SPTS Technologies Ltd.
Mattson Technology, Inc.
Axcelis Technologies, Inc.
Key Questions Addressed in this Report
What is the 10-year outlook for the global Chemical Gas Dry Etching Machine market?
What factors are driving Chemical Gas Dry Etching Machine market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Chemical Gas Dry Etching Machine market opportunities vary by end market size?
How does Chemical Gas Dry Etching Machine break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
120 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Chemical Gas Dry Etching Machine by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Chemical Gas Dry Etching Machine by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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