Global CPU/GPU Heat Spreader Market Growth 2025-2031

The global CPU/GPU Heat Spreader market size is predicted to grow from US$ 716 million in 2025 to US$ 1063 million in 2031; it is expected to grow at a CAGR of 6.8% from 2025 to 2031.

A heat spreader is high thermal conductive metallic materials for efficient heat dissipation from an IC chip in a semiconductor package. These spreaders are used in CPU/GPU for desktop personal computers and servers/data centers.

Heat spreaders are fundamental in thermal management in electronic design. In cases where natural convection is insufficient for timely heat dissipation, and forced convection using fans is not yet necessary, heat spreaders are widely used as a solution. With the advancement of performance and miniaturization processes, the number of transistors in relation to the chip area has increased. This complexity in circuit design does not always result in a 100% improvement in performance. As a result, a significant portion of electrical energy is converted into thermal energy. Additionally, as process miniaturization progresses, leakage power consumption increases, leading to higher power requirements and waste heat generation within the same unit area. Furthermore, with the trend towards compact desktop computers and all-in-one functionality, future mini PCs will need to handle multiple tasks such as information processing and multimedia performance simultaneously. Therefore, effective heat dissipation becomes crucial, making heat spreaders an indispensable solution for efficient thermal management.

Major thermal solution providers are actively exploring new market applications, including gaming consoles, communication devices, servers, automotive electronics, home electronics, and smartphones. The emerging trends of cloud services and the Internet of Things (IoT) in the market contribute to the increasing demand for servers and data centers. As a result, the need for effective heat dissipation in central processing units (CPUs) and connectors becomes more prominent and represents a promising area for further exploration.

Currently, the global heat spreader market is primarily dominated by manufacturers from Japan, the United States, and China Taiwan, with China Taiwan being the largest production region, accounting for approximately 57% of the global market share in 2024. Japan and the United States are also significant production regions, with market shares of 16.7% and 17.1%, respectively, in 2024. Chinese manufacturers entered this field relatively late, with two main players currently holding a combined global market share of 4.98% in 2024, which is expected to grow to 10.25% by 2031.

In terms of materials, copper heat spreaders currently dominate the market, accounting for 89% of the market share in 2024. Due to the design changes in AI chips, heat spreaders have not only become larger and thicker but also shifted materials. Historically, copper was the primary material used for heat spreaders due to its high thermal conductivity of 401 W/m.K, which is higher than that of gold or aluminum, second only to silver. However, heat spreader materials are now moving toward stainless steel, which has higher hardness and is more difficult to process, thus raising the technological barriers for manufacturers. In the coming years, stainless steel-based heat spreader are expected to see faster growth.

Regarding chip sizes, the proportion of large-sized heat spreader products is gradually increasing. Heat spreaders are closely related to chip packaging. In the past, processors required heat spreaders with an area of around 30mm x 30mm. Now, with chip manufacturers enhancing computational speeds and incorporating more memory, the number of bare die (chips) has significantly increased, expanding the area to 60mm x 60mm or larger. In 2024, heat spreaders with sizes greater than 35mm x 35mm will account for approximately 53%, and it is expected to rise to 61% by 2031.

In terms of market application, PC CPU/GPU heat spreaders currently hold the largest market share, accounting for 52% in 2024. However, the server/data center sector is growing at a faster pace, accounting for 35% in 2024 and projected to reach 50% by 2031.

The main global heat spreader manufacturers include Jentech Precision Industrial, Honeywell, Shinko, Fujikura, I-Chiun, Favor Precision Technology, and Shandong Ruisi Precision Industry. The top five global manufacturers are expected to account for approximately 91% of the market share in 2024. In the coming years, competition in this industry is expected to intensify.

LP Information, Inc. (LPI) ' newest research report, the “CPU/GPU Heat Spreader Industry Forecast” looks at past sales and reviews total world CPU/GPU Heat Spreader sales in 2024, providing a comprehensive analysis by region and market sector of projected CPU/GPU Heat Spreader sales for 2025 through 2031. With CPU/GPU Heat Spreader sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world CPU/GPU Heat Spreader industry.

This Insight Report provides a comprehensive analysis of the global CPU/GPU Heat Spreader landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on CPU/GPU Heat Spreader portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global CPU/GPU Heat Spreader market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for CPU/GPU Heat Spreader and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global CPU/GPU Heat Spreader.

This report presents a comprehensive overview, market shares, and growth opportunities of CPU/GPU Heat Spreader market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Size (Above 35*35mm)
Size (Below 35*35mm)

Segmentation by Application:
PC CPU/GPU Package
Server/Data Center/AI Chip Package
Automotive SoC/FPGA Package
Gaming Console
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Shinko
Fujikura
Honeywell Advanced Materials
Jentech Precision Industrial
I-Chiun
Favor Precision Technology
Niching Industrial Corporation
Fastrong Technologies Corp.
ECE (Excel Cell Electronic)
Shandong Ruisi Precision Industry
HongRiDa Electronics (HRD)
TBT Co., Ltd

Key Questions Addressed in this Report

What is the 10-year outlook for the global CPU/GPU Heat Spreader market?

What factors are driving CPU/GPU Heat Spreader market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do CPU/GPU Heat Spreader market opportunities vary by end market size?

How does CPU/GPU Heat Spreader break out by Type, by Application?

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