Global Ball Grid Array SSD Market Growth 2025-2031
Description
The global Ball Grid Array SSD market size is predicted to grow from US$ 12700 million in 2025 to US$ 18390 million in 2031; it is expected to grow at a CAGR of 6.4% from 2025 to 2031.
A BGA-type solid-state drive (SSD) is a solid-state drive that uses Ball Grid Array (BGA) packaging technology. BGA packaging mounts the flash memory and controller chips onto a small printed circuit board (PCB) and connects them to the motherboard through solder balls on the bottom. Compared to traditional SATA or M.2 interface SSDs, BGA SSDs offer smaller form factors, higher integration, and better heat dissipation. As BGA SSDs do not require traditional connectors, they are typically soldered directly onto the motherboard and are commonly found in ultrathin laptops, embedded devices, and high-performance servers.
United States market for Ball Grid Array SSD is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Ball Grid Array SSD is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Ball Grid Array SSD is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Ball Grid Array SSD players cover Samsung, YANSEN, Shanghai VEIGLO, Biwin, HIKSEMI, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “Ball Grid Array SSD Industry Forecast” looks at past sales and reviews total world Ball Grid Array SSD sales in 2024, providing a comprehensive analysis by region and market sector of projected Ball Grid Array SSD sales for 2025 through 2031. With Ball Grid Array SSD sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Ball Grid Array SSD industry.
This Insight Report provides a comprehensive analysis of the global Ball Grid Array SSD landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Ball Grid Array SSD portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Ball Grid Array SSD market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Ball Grid Array SSD and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Ball Grid Array SSD.
This report presents a comprehensive overview, market shares, and growth opportunities of Ball Grid Array SSD market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
High Capacity
Medium Capacity
Low Capacity
Segmentation by Application:
Automobile
Railway
Electronics
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Samsung
YANSEN
Shanghai VEIGLO
Biwin
HIKSEMI
Western Digital
Micron Technology
Exascend
SK Hynix
Storlead
Innodisk
SiliconGo
ATP Electronics
Transcend Information
Key Questions Addressed in this Report
What is the 10-year outlook for the global Ball Grid Array SSD market?
What factors are driving Ball Grid Array SSD market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Ball Grid Array SSD market opportunities vary by end market size?
How does Ball Grid Array SSD break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
A BGA-type solid-state drive (SSD) is a solid-state drive that uses Ball Grid Array (BGA) packaging technology. BGA packaging mounts the flash memory and controller chips onto a small printed circuit board (PCB) and connects them to the motherboard through solder balls on the bottom. Compared to traditional SATA or M.2 interface SSDs, BGA SSDs offer smaller form factors, higher integration, and better heat dissipation. As BGA SSDs do not require traditional connectors, they are typically soldered directly onto the motherboard and are commonly found in ultrathin laptops, embedded devices, and high-performance servers.
United States market for Ball Grid Array SSD is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Ball Grid Array SSD is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Ball Grid Array SSD is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Ball Grid Array SSD players cover Samsung, YANSEN, Shanghai VEIGLO, Biwin, HIKSEMI, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “Ball Grid Array SSD Industry Forecast” looks at past sales and reviews total world Ball Grid Array SSD sales in 2024, providing a comprehensive analysis by region and market sector of projected Ball Grid Array SSD sales for 2025 through 2031. With Ball Grid Array SSD sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Ball Grid Array SSD industry.
This Insight Report provides a comprehensive analysis of the global Ball Grid Array SSD landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Ball Grid Array SSD portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Ball Grid Array SSD market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Ball Grid Array SSD and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Ball Grid Array SSD.
This report presents a comprehensive overview, market shares, and growth opportunities of Ball Grid Array SSD market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
High Capacity
Medium Capacity
Low Capacity
Segmentation by Application:
Automobile
Railway
Electronics
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Samsung
YANSEN
Shanghai VEIGLO
Biwin
HIKSEMI
Western Digital
Micron Technology
Exascend
SK Hynix
Storlead
Innodisk
SiliconGo
ATP Electronics
Transcend Information
Key Questions Addressed in this Report
What is the 10-year outlook for the global Ball Grid Array SSD market?
What factors are driving Ball Grid Array SSD market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Ball Grid Array SSD market opportunities vary by end market size?
How does Ball Grid Array SSD break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
122 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Ball Grid Array SSD by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Ball Grid Array SSD by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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