Global Back Grinding Tapes for Semiconductor Market Growth 2025-2031
Description
The global Back Grinding Tapes for Semiconductor market size is predicted to grow from US$ 470 million in 2025 to US$ 814 million in 2031; it is expected to grow at a CAGR of 9.6% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Back grinding tape for semiconductors is widely used in integrated circuit packaging and wafer manufacturing processes. The tape plays a temporary fixing and protection role when grinding the back of the wafer, effectively preventing wafer cracking, edge damage or contamination, while ensuring the integrity and cleanliness of the surface after grinding. Its structure usually includes a high-strength substrate layer (such as PET, PI, etc.) and a special adhesive layer with controllable peeling performance. It has key characteristics such as high temperature resistance, moisture and heat resistance, low residual adhesive, and smooth peeling. With the continuous miniaturization of chip size and the development of high-density packaging technology, the thickness of wafers is becoming thinner and thinner, which puts higher requirements on the safety and accuracy of the grinding process, thereby promoting the evolution of back grinding tapes towards higher adhesion, extremely low residual adhesive rate and automatic peeling.
Market Trends
With the continuous expansion of the global semiconductor industry and the development of advanced packaging technology, the semiconductor back grinding tape market has shown a rapid growth trend. Especially in the context of the widespread application of new processes such as wafer thinning, chip stacking (3D packaging) and Fan-Out packaging, the demand for high-precision and high-cleanliness grinding tapes continues to rise. Diversified products such as UV peelable, heat peelable and low-residue adhesive types have gradually become mainstream, meeting the personalized needs of different process flows for peeling methods, bonding strength and temperature tolerance.
Market Disadvantages
The technical threshold is high, and the performance requirements for material formulation, bonding performance, peeling residual adhesive control and high cleanliness are extremely strict. The core technology has been mastered by Japanese and Korean companies for a long time, resulting in a high concentration of the high-end market. Domestic manufacturers still focus on mid- and low-end products in high-end process applications, which is difficult to meet the needs of advanced processes of 7nm and below, and their market competitiveness is relatively weak. The customer verification cycle is long, and the requirements for product quality, stability and process compatibility are extremely high. New entrants need to face high trial production and certification costs.
Market Outlook
With the continuous advancement of semiconductor process nodes and the popularization of 3D packaging and chiplet design, the application of semiconductor back grinding tape will become more extensive, and its market size is expected to continue to expand. Wafers are getting thinner and the packaging levels are more complex, which puts higher requirements on the adhesion stability, residual glue control and peelability of grinding tapes, and also creates more room for technological innovation. The demand for green environmental protection and high-clean process will accelerate the application of new solvent-free and low-residue materials. The trend of domestic substitution will also accelerate the technological breakthroughs of local enterprises and gradually occupy the mid-to-high-end market share.
LP Information, Inc. (LPI) ' newest research report, the “Back Grinding Tapes for Semiconductor Industry Forecast” looks at past sales and reviews total world Back Grinding Tapes for Semiconductor sales in 2024, providing a comprehensive analysis by region and market sector of projected Back Grinding Tapes for Semiconductor sales for 2025 through 2031. With Back Grinding Tapes for Semiconductor sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Back Grinding Tapes for Semiconductor industry.
This Insight Report provides a comprehensive analysis of the global Back Grinding Tapes for Semiconductor landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Back Grinding Tapes for Semiconductor portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Back Grinding Tapes for Semiconductor market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Back Grinding Tapes for Semiconductor and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Back Grinding Tapes for Semiconductor.
This report presents a comprehensive overview, market shares, and growth opportunities of Back Grinding Tapes for Semiconductor market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
UV Type
Non-UV Type
Segmentation by Application:
Wet Etching
Metalizing Process
Grinding and Cleaning Process
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Mitsui Chemicals
LINTEC Corporation
Denka
Nitto
Furukawa Electric
Sekisui Chemical
Maxell Sliontec
KGK Chemical Corporation
AI Technology
D&X Co., Ltd
Daehyun ST
Alliance Material Co., Ltd (AMC)
Shanghai Guke Adhesive Tape Technology
Plusco Tech
Solar Plus Company
Taicang Zhanxin Adhesive Material
Cybrid Technologies
ZZSM
BYE POLYMER MATERIAL
ZHONGSHAN CROWN ADHESIVE PRODUCTS
Yantai Darbond Technology
Sunliky New Material Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global Back Grinding Tapes for Semiconductor market?
What factors are driving Back Grinding Tapes for Semiconductor market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Back Grinding Tapes for Semiconductor market opportunities vary by end market size?
How does Back Grinding Tapes for Semiconductor break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Back grinding tape for semiconductors is widely used in integrated circuit packaging and wafer manufacturing processes. The tape plays a temporary fixing and protection role when grinding the back of the wafer, effectively preventing wafer cracking, edge damage or contamination, while ensuring the integrity and cleanliness of the surface after grinding. Its structure usually includes a high-strength substrate layer (such as PET, PI, etc.) and a special adhesive layer with controllable peeling performance. It has key characteristics such as high temperature resistance, moisture and heat resistance, low residual adhesive, and smooth peeling. With the continuous miniaturization of chip size and the development of high-density packaging technology, the thickness of wafers is becoming thinner and thinner, which puts higher requirements on the safety and accuracy of the grinding process, thereby promoting the evolution of back grinding tapes towards higher adhesion, extremely low residual adhesive rate and automatic peeling.
Market Trends
With the continuous expansion of the global semiconductor industry and the development of advanced packaging technology, the semiconductor back grinding tape market has shown a rapid growth trend. Especially in the context of the widespread application of new processes such as wafer thinning, chip stacking (3D packaging) and Fan-Out packaging, the demand for high-precision and high-cleanliness grinding tapes continues to rise. Diversified products such as UV peelable, heat peelable and low-residue adhesive types have gradually become mainstream, meeting the personalized needs of different process flows for peeling methods, bonding strength and temperature tolerance.
Market Disadvantages
The technical threshold is high, and the performance requirements for material formulation, bonding performance, peeling residual adhesive control and high cleanliness are extremely strict. The core technology has been mastered by Japanese and Korean companies for a long time, resulting in a high concentration of the high-end market. Domestic manufacturers still focus on mid- and low-end products in high-end process applications, which is difficult to meet the needs of advanced processes of 7nm and below, and their market competitiveness is relatively weak. The customer verification cycle is long, and the requirements for product quality, stability and process compatibility are extremely high. New entrants need to face high trial production and certification costs.
Market Outlook
With the continuous advancement of semiconductor process nodes and the popularization of 3D packaging and chiplet design, the application of semiconductor back grinding tape will become more extensive, and its market size is expected to continue to expand. Wafers are getting thinner and the packaging levels are more complex, which puts higher requirements on the adhesion stability, residual glue control and peelability of grinding tapes, and also creates more room for technological innovation. The demand for green environmental protection and high-clean process will accelerate the application of new solvent-free and low-residue materials. The trend of domestic substitution will also accelerate the technological breakthroughs of local enterprises and gradually occupy the mid-to-high-end market share.
LP Information, Inc. (LPI) ' newest research report, the “Back Grinding Tapes for Semiconductor Industry Forecast” looks at past sales and reviews total world Back Grinding Tapes for Semiconductor sales in 2024, providing a comprehensive analysis by region and market sector of projected Back Grinding Tapes for Semiconductor sales for 2025 through 2031. With Back Grinding Tapes for Semiconductor sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Back Grinding Tapes for Semiconductor industry.
This Insight Report provides a comprehensive analysis of the global Back Grinding Tapes for Semiconductor landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Back Grinding Tapes for Semiconductor portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Back Grinding Tapes for Semiconductor market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Back Grinding Tapes for Semiconductor and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Back Grinding Tapes for Semiconductor.
This report presents a comprehensive overview, market shares, and growth opportunities of Back Grinding Tapes for Semiconductor market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
UV Type
Non-UV Type
Segmentation by Application:
Wet Etching
Metalizing Process
Grinding and Cleaning Process
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Mitsui Chemicals
LINTEC Corporation
Denka
Nitto
Furukawa Electric
Sekisui Chemical
Maxell Sliontec
KGK Chemical Corporation
AI Technology
D&X Co., Ltd
Daehyun ST
Alliance Material Co., Ltd (AMC)
Shanghai Guke Adhesive Tape Technology
Plusco Tech
Solar Plus Company
Taicang Zhanxin Adhesive Material
Cybrid Technologies
ZZSM
BYE POLYMER MATERIAL
ZHONGSHAN CROWN ADHESIVE PRODUCTS
Yantai Darbond Technology
Sunliky New Material Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global Back Grinding Tapes for Semiconductor market?
What factors are driving Back Grinding Tapes for Semiconductor market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Back Grinding Tapes for Semiconductor market opportunities vary by end market size?
How does Back Grinding Tapes for Semiconductor break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
164 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Back Grinding Tapes for Semiconductor by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Back Grinding Tapes for Semiconductor by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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