Global Back Grinding Tapes (BGT) Market Growth 2026-2032
Description
The global Back Grinding Tapes (BGT) market size is predicted to grow from US$ 236 million in 2025 to US$ 341 million in 2032; it is expected to grow at a CAGR of 5.5% from 2026 to 2032.
BGT (Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling.
Demand for back grinding tapes (BGT) is primarily driven by wafer thinning and advanced packaging. As smartphones, HPC/AI, and miniaturized electronics push for thinner die, higher I/O density, and smaller form factors, back-grinding becomes more widespread and more stringent—raising the need for tapes that provide strong front-side protection with low defects and low residue. Increasing process complexity (larger wafers, ultra-thin silicon, compound semiconductors, backside metallization, etc.) also elevates requirements for crack/chip prevention, particle control, warpage management, and a stable tack window, accelerating adoption of cleaner, more controllable tapes and UV-release systems. In parallel, yield pressure and cost optimization encourage fabs to standardize reliable, high-throughput temporary protection materials, supporting ongoing growth in the BGT market.
The world's top five back grinding tapes (BGT) manufacturers include Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka., which together account for more than 85% of the market share, of which the largest producer is Mithui Chemicals Tohcello, accounting for more than 30% of the market. Japan is the world's leading back-grinding tape production region, accounting for more than 40% of the market share. In terms of type, the market share of UV tape is more than 55%. In the application field, bump accounts for about 50% of the market share.
LP Information, Inc. (LPI) ' newest research report, the “Back Grinding Tapes (BGT) Industry Forecast” looks at past sales and reviews total world Back Grinding Tapes (BGT) sales in 2025, providing a comprehensive analysis by region and market sector of projected Back Grinding Tapes (BGT) sales for 2026 through 2032. With Back Grinding Tapes (BGT) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Back Grinding Tapes (BGT) industry.
This Insight Report provides a comprehensive analysis of the global Back Grinding Tapes (BGT) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Back Grinding Tapes (BGT) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Back Grinding Tapes (BGT) market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Back Grinding Tapes (BGT) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Back Grinding Tapes (BGT).
This report presents a comprehensive overview, market shares, and growth opportunities of Back Grinding Tapes (BGT) market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
UV Type
Non-UV Type
Segmentation by Backing Film Material:
PET Film
PO/PE Film
PI Film
Composite Films
Segmentation by Adhesive System:
Acrylic PSA
Rubber-Based PSA
Silicone PSA
Hybrid and Multi-Layer Adhesive Systems
Segmentation by Application:
Standard
Standard Thin Die
(S)DBG (GAL)
Bump
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
LG Chem
Maxell
D&X
AI Technology
Taicang Zhanxin Adhesive Material
Kunshan BYE Science Macromolecule
Key Questions Addressed in this Report
What is the 10-year outlook for the global Back Grinding Tapes (BGT) market?
What factors are driving Back Grinding Tapes (BGT) market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Back Grinding Tapes (BGT) market opportunities vary by end market size?
How does Back Grinding Tapes (BGT) break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
BGT (Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling.
Demand for back grinding tapes (BGT) is primarily driven by wafer thinning and advanced packaging. As smartphones, HPC/AI, and miniaturized electronics push for thinner die, higher I/O density, and smaller form factors, back-grinding becomes more widespread and more stringent—raising the need for tapes that provide strong front-side protection with low defects and low residue. Increasing process complexity (larger wafers, ultra-thin silicon, compound semiconductors, backside metallization, etc.) also elevates requirements for crack/chip prevention, particle control, warpage management, and a stable tack window, accelerating adoption of cleaner, more controllable tapes and UV-release systems. In parallel, yield pressure and cost optimization encourage fabs to standardize reliable, high-throughput temporary protection materials, supporting ongoing growth in the BGT market.
The world's top five back grinding tapes (BGT) manufacturers include Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka., which together account for more than 85% of the market share, of which the largest producer is Mithui Chemicals Tohcello, accounting for more than 30% of the market. Japan is the world's leading back-grinding tape production region, accounting for more than 40% of the market share. In terms of type, the market share of UV tape is more than 55%. In the application field, bump accounts for about 50% of the market share.
LP Information, Inc. (LPI) ' newest research report, the “Back Grinding Tapes (BGT) Industry Forecast” looks at past sales and reviews total world Back Grinding Tapes (BGT) sales in 2025, providing a comprehensive analysis by region and market sector of projected Back Grinding Tapes (BGT) sales for 2026 through 2032. With Back Grinding Tapes (BGT) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Back Grinding Tapes (BGT) industry.
This Insight Report provides a comprehensive analysis of the global Back Grinding Tapes (BGT) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Back Grinding Tapes (BGT) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Back Grinding Tapes (BGT) market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Back Grinding Tapes (BGT) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Back Grinding Tapes (BGT).
This report presents a comprehensive overview, market shares, and growth opportunities of Back Grinding Tapes (BGT) market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
UV Type
Non-UV Type
Segmentation by Backing Film Material:
PET Film
PO/PE Film
PI Film
Composite Films
Segmentation by Adhesive System:
Acrylic PSA
Rubber-Based PSA
Silicone PSA
Hybrid and Multi-Layer Adhesive Systems
Segmentation by Application:
Standard
Standard Thin Die
(S)DBG (GAL)
Bump
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
LG Chem
Maxell
D&X
AI Technology
Taicang Zhanxin Adhesive Material
Kunshan BYE Science Macromolecule
Key Questions Addressed in this Report
What is the 10-year outlook for the global Back Grinding Tapes (BGT) market?
What factors are driving Back Grinding Tapes (BGT) market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Back Grinding Tapes (BGT) market opportunities vary by end market size?
How does Back Grinding Tapes (BGT) break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
123 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Back Grinding Tapes (BGT) by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Back Grinding Tapes (BGT) by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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