Global Advanced Packaging Market Growth 2025-2031

The global Advanced Packaging market size is predicted to grow from US$ 267360 million in 2025 to US$ 480400 million in 2031; it is expected to grow at a CAGR of 10.3% from 2025 to 2031.

Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package, etc. While putting multiple chips in a package has been around for decades, the driver for advanced packaging is directly correlated with Moore’s Law. Wires are shrinking along with transistors, and the amount of distance that a signal needs to travel from one end of a chip over skinny wires is increasing at each node. By connecting these chips together using fatter pipes, which can be in the form of through-silicon vias, interposers, bridges or simple wires, the speed of those signals can be increased and the amount of energy required to drive those signals can be reduced. Moreover, depending on the package, there are fewer physical effects to contend with and components developed at different process nodes can be mixed. This report focus on Advanced Semiconductor Packaging market.

Automotive Demand: Advanced packaging supports sensor integration and compute units for autonomous vehicles, emphasizing thermal management and reliability. Government and Industry Investments. The U.S. CHIPS Act allocates $2.5 billion for advanced packaging R&D, while the EU Chips Act aims to bolster regional ecosystems. Industry leaders emphasize the need for public-private partnerships to compete with Asia’s dominance. Market Expansion in AI, HPC, and Consumer Electronics. AI/data centers drive demand for HBM and accelerators, while consumer devices (smartphones, AR/VR) require compact, high-density packaging. The market is projected to grow at a CAGR of 7.6% (2025–2035).

LP Information, Inc. (LPI) ' newest research report, the “Advanced Packaging Industry Forecast” looks at past sales and reviews total world Advanced Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Advanced Packaging sales for 2025 through 2031. With Advanced Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Advanced Packaging industry.

This Insight Report provides a comprehensive analysis of the global Advanced Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Advanced Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Advanced Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Advanced Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Advanced Packaging.

This report presents a comprehensive overview, market shares, and growth opportunities of Advanced Packaging market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Filp Chip
2.5D
3D
FO SIP
FO WLP
WLCSP
Chiplet
Others

Segmentation by Application:
Consumer Electronics
Automotive
Telecommunications
Aerospace and Defense
Medical Devices
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
ASE (SPIL)
Amkor
JCET
TFME
PTI
TSMC
Intel Corp
Huatian
UTAC
OSE
Chipmos
Walton

Key Questions Addressed in this Report

What is the 10-year outlook for the global Advanced Packaging market?

What factors are driving Advanced Packaging market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Advanced Packaging market opportunities vary by end market size?

How does Advanced Packaging break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.