Global Advanced Packaging for Automotive Chips Market Growth (Status and Outlook) 2025-2031

According to this study, the global Advanced Packaging for Automotive Chips market size will reach US$ 3126 million by 2031.

Automotive electronics encompasses a variety of products – from body electronics and access systems to engine, lighting and infotainment components. This report studies the Advanced Packaging for Automotive Chips.

Advanced packaging for automotive chips refers to the use of next-generation packaging technologies—such as System-in-Package (SiP), Flip-Chip Ball Grid Array (FCBGA), Fan-Out Wafer-Level Packaging (FOWLP), 2.5D/3D integration, and Cu Clip-based power packages—to meet the rigorous demands of automotive electronics. Compared to conventional wire-bond packaging (e.g., QFP, DIP), advanced packaging offers superior electrical performance, thermal dissipation, form factor reduction, and system integration. These technologies enable multi-chip integration, high input/output (I/O) density, and reliability required for automotive-grade applications, aligning with safety and quality standards such as AEC-Q100, ISO 26262, and functional safety requirements.

Currently the key players of Automotive OSAT are Amkor, ASE Group and UTAC, Others Automotive OSAT players are mainly located in China Taiwan, South Korea, China mainland, Southeast Asia (Singapore and Malaysia), including Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, Powertech Technology Inc. (PTI), King Yuan Electronics Corp. (KYEC), OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, SFA Semicon, Unisem Group, Carsem, Union Semiconductor（Hefei）Co., Ltd., Tongfu Microelectronics (TFME), Hefei Chipmore Technology Co.,Ltd., JCET Group and HT-tech, etc.

LPI (LP Information)' newest research report, the “Advanced Packaging for Automotive Chips Industry Forecast” looks at past sales and reviews total world Advanced Packaging for Automotive Chips sales in 2024, providing a comprehensive analysis by region and market sector of projected Advanced Packaging for Automotive Chips sales for 2025 through 2031. With Advanced Packaging for Automotive Chips sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Advanced Packaging for Automotive Chips industry.

This Insight Report provides a comprehensive analysis of the global Advanced Packaging for Automotive Chips landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Advanced Packaging for Automotive Chips portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Advanced Packaging for Automotive Chips market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Advanced Packaging for Automotive Chips and breaks down the forecast by Technology, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Advanced Packaging for Automotive Chips.

This report presents a comprehensive overview, market shares, and growth opportunities of Advanced Packaging for Automotive Chips market by product type, application, key players and key regions and countries.

Segmentation by Technology:
FC (Flip Chip)
WLCSP
SiP
Others

Segmentation by Application:
ADAS
Infotainment & Telematics
Body Electronics
Safety Systems
Chassis Electronics
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
NXP
Infineon (Cypress)
Renesas
Texas Instrument
STMicroelectronics
Bosch
onsemi
Mitsubishi Electric
Rapidus
Rohm
ADI
Microchip (Microsemi)
Amkor
ASE (SPIL)
UTAC
JCET (STATS ChipPAC)
Carsem
King Yuan Electronics Corp. (KYEC)
KINGPAK Technology Inc
Powertech Technology Inc. (PTI)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP.
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
KESM Industries Berhad
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor（Hefei）Co., Ltd.
Tongfu Microelectronics (TFME)
Hefei Chipmore Technology Co.,Ltd.
HT-tech
China Wafer Level CSP Co., Ltd
Ningbo ChipEx Semiconductor Co., Ltd
Guangdong Leadyo IC Testing
Unimos Microelectronics (Shanghai)
Sino Technology
Taiji Semiconductor (Suzhou)

Please note: The report will take approximately 2 business days to prepare and deliver.