Global ACF Bonders Market Growth 2025-2031

The global ACF Bonders market size is predicted to grow from US$ 423 million in 2025 to US$ 642 million in 2031; it is expected to grow at a CAGR of 7.2% from 2025 to 2031.

An Anisotropic Conductive Film (ACF) Bonder is a specialized machine used to bond electronic components, such as flexible circuits (FPC), chips, and display panels, using anisotropic conductive film (ACF) as an adhesive and conductive interconnect. ACF Bonders apply heat, pressure, and time to create strong, electrically conductive, and mechanically secure connections.

The increasing miniaturization of electronics is driving the demand for precise and high-performance bonding.

ACF bonders are essential for the bonding of flex circuits to substrates, especially in touchscreens and display panels. This is particularly true in smartphones, tablets, and wearables where compactness and flexibility are critical.

As OLED and MicroLED displays gain popularity, especially in high-end consumer electronics, there is a growing need for flexible, fine-pitch interconnects.

ACF bonders play a crucial role in COF (Chip-on-Film) and FOG (Flex-on-Glass) bonding processes. As manufacturers aim to improve display resolution and flexibility, ACF bonders are vital to achieving high-density bonding in thin, flexible displays.

Modern vehicles incorporate advanced display panels, infotainment systems, and driver-assistance systems (ADAS), all of which require flexible and robust electronic bonding.

The automotive industry's need for reliable, high-performance connections is driving the demand for ACF bonders, particularly for bonding flexible circuits to display panels and sensors that must endure harsh conditions (vibrations, temperature extremes).

LP Information, Inc. (LPI) ' newest research report, the “ACF Bonders Industry Forecast” looks at past sales and reviews total world ACF Bonders sales in 2024, providing a comprehensive analysis by region and market sector of projected ACF Bonders sales for 2025 through 2031. With ACF Bonders sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world ACF Bonders industry.

This Insight Report provides a comprehensive analysis of the global ACF Bonders landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on ACF Bonders portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global ACF Bonders market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for ACF Bonders and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global ACF Bonders.

This report presents a comprehensive overview, market shares, and growth opportunities of ACF Bonders market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Semi-Automatic
Fully Automatic

Segmentation by Application:
LCD
OLED
Other

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Ohashi Engineering
Amada Weld Tech
Ito-Group
Shenzhen Olian Automatic
Advanced Integrated Technologies
Bondtronics Technology
C-Tech Systems
Finetech
Shenzhen Xinsanli Automation Equipment
Easy Field Corporation
Ings Shinano

Key Questions Addressed in this Report

What is the 10-year outlook for the global ACF Bonders market?

What factors are driving ACF Bonders market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do ACF Bonders market opportunities vary by end market size?

How does ACF Bonders break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.