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North America MicroLED Interconnect Market Size, Share & Industry Analysis Report By Product Type (Chip-to-Chip, GPU-to-GPU, and GPU-to-Memory), By Data Rate (Less than 25 GBPS, 25 - 50 GBPS, More than 100 Gbps, and 50 - 100 Gbps), By Distance (Less than

Publisher Knowledge Based Value (KBV) Research
Published Jul 18, 2025
Length 146 Pages
SKU # KBV20295621

Description

The North America MicroLED Interconnect Market would witness market growth of 17.7% CAGR during the forecast period (2025-2032).

The US market dominated the North America MicroLED Interconnect Market by Country in 2024, and would continue to be a dominant market till 2032; thereby, achieving a market value of $166.7 Million by 2032. The Canada market is experiencing a CAGR of 21.2% during (2025 - 2032). Additionally, The Mexico market would exhibit a CAGR of 19.9% during (2025 - 2032).

The MicroLED interconnect market in North America is growing quickly thanks to a strong mix of academic research, federal incentives like the CHIPS and Science Act, and deep OEM involvement from companies like Apple, TSMC, and defense agencies. The area has moved from early lab demonstrations to pilot-scale production. Universities like Texas Tech and organizations like DARPA and the U.S. Department of Energy are helping to develop new ideas in mass transfer, wafer bonding, and ruggedized interconnects. Strategic partnerships between startups like Avicena and foundries like TSMC are key to making chip-to-chip optical interconnects, which are meant for next-generation AI and HPC systems.

Federal investment is increasing the capacity of GaN-on-Si chips made in the US, which is important for making MicroLED chips. At the same time, OEMs are focusing on high-value applications like AR/VR, smartwatches, and automotive HUDs. Defense programs are testing the reliability of interconnects in very harsh conditions, and dual-use technologies are moving into the commercial space. Companies are putting together IP portfolios that include precision bonding, pick-and-place tools, and optical platforms like LightBundle™. This is changing the way licenses work and who leads the industry. This combined ecosystem of research and development, pilot manufacturing, and intellectual property control is making North America the world's center for MicroLED interconnect innovation and commercialization.

Country Outlook

The U.S. MicroLED interconnect market is rapidly evolving through breakthroughs in chip-scale photonics, heterogeneous integration, and optical I/O systems, led by innovators like Avicena Tech with its LightBundle™ platform. Avicena is working on low-power, high-throughput optical links for AI and HPC with the help of USD 65 million in Series B funding and partnerships with TSMC and ams OSRAM. Federal programs like DARPA's C2OI and research from schools like MIT and Rochester are speeding up progress in micro-optics, flip-chip bonding, and fiber-aligned interposers. U.S. foundries and OSATs are increasing the production of co-packaged optics. This is possible because of a strong venture capital ecosystem and a strategic push toward vertical integration. This strengthens the country's position as a leader in MicroLED interconnect innovation.

The Canadian Photonics Fabrication Centre (CPFC) and top universities like the University of Toronto and UBC are helping to build a strong photonics research ecosystem that is helping Canada's MicroLED interconnect market grow. The National Optical Quantum Strategic Plan (NOQSP) is helping to drive new ideas in optical packaging, waveguide coupling, and microLED-on-CMOS integration. Startups like PhotonLED and partnerships like ImagineOptix–CAPE are making progress on board-level interconnect modules for AI, AR, and chip I/O. Programs like the Strategic Innovation Fund and CANARIE help public and private organizations work together to move from prototypes to products. Canada's position as a regional leader in low-power, high-bandwidth MicroLED interconnect solutions is even stronger because of partnerships with U.S. consortia.

Based on Product Type, the market is segmented into Chip-to-Chip, GPU-to-GPU, and GPU-to-Memory. Based on Data Rate, the market is segmented into Less than 25 GBPS, 25 - 50 GBPS, More than 100 Gbps, and 50 - 100 Gbps. Based on Distance, the market is segmented into Less than 1 meter, 1 - 5 meter, and More than 5 meter. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

List of Key Companies Profiled
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • Apple, Inc.
  • Sony Corporation
  • LG Electronics, Inc. (LG Corporation)
  • AU Optronics Corporation
  • BOE Technology Group Co., Ltd.
  • AvicenaTech, Corp.
  • Aledia
  • Ayar Labs, Inc.
  • EPISTAR Corporation
North America MicroLED Interconnect Market Report Segmentation

By Product Type
  • Chip-to-Chip
  • GPU-to-GPU
  • GPU-to-Memory
By Data Rate
  • Less than 25 GBPS
  • 25 - 50 GBPS
  • More than 100 Gbps
  • 50 - 100 Gbps
By Distance
  • Less than 1 meter
  • 1 - 5 meter
  • More than 5 meter
By Country
  • US
  • Canada
  • Mexico
  • Rest of North America

Table of Contents

146 Pages
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America MicroLED Interconnect Market, by Product Type
1.4.2 North America MicroLED Interconnect Market, by Data Rate
1.4.3 North America MicroLED Interconnect Market, by Distance
1.4.4 North America MicroLED Interconnect Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.2.3 Market Opportunities
3.2.4 Market Challenges
Chapter 4. Competition Analysis – Global
4.1 Market Share Analysis, 2024
4.2 Porter Five Forces Analysis
Chapter 5. Value Chain Analysis of MicroLED Interconnect Market
5.1 Research & Technology Development
5.2 Wafer Fabrication & Epitaxy
5.3 Interconnect Design & Packaging Development
5.4 Mass Transfer & Assembly
5.5 Testing & Quality Assurance
5.6 Integration with End Devices
5.7 Customer Support & Feedback Loop
Chapter 6. Key Customer Criteria - MicroLED Interconnect Market
Chapter 7. North America MicroLED Interconnect Market by Product Type
7.1 North America Chip-to-Chip Market by Country
7.2 North America GPU-to-GPU Market by Country
7.3 North America GPU-to-Memory Market by Country
Chapter 8. North America MicroLED Interconnect Market by Data Rate
8.1 North America Less than 25 GBPS Market by Country
8.2 North America 25 - 50 GBPS Market by Country
8.3 North America More than 100 Gbps Market by Country
8.4 North America 50 - 100 Gbps Market by Country
Chapter 9. North America MicroLED Interconnect Market by Distance
9.1 North America Less than 1 meter Market by Country
9.2 North America 1 - 5 meter Market by Country
9.3 North America More than 5 meter Market by Country
Chapter 10. North America MicroLED Interconnect Market by Country
10.1 US MicroLED Interconnect Market
10.1.1 US MicroLED Interconnect Market by Product Type
10.1.2 US MicroLED Interconnect Market by Data Rate
10.1.3 US MicroLED Interconnect Market by Distance
10.2 Canada MicroLED Interconnect Market
10.2.1 Canada MicroLED Interconnect Market by Product Type
10.2.2 Canada MicroLED Interconnect Market by Data Rate
10.2.3 Canada MicroLED Interconnect Market by Distance
10.3 Mexico MicroLED Interconnect Market
10.3.1 Mexico MicroLED Interconnect Market by Product Type
10.3.2 Mexico MicroLED Interconnect Market by Data Rate
10.3.3 Mexico MicroLED Interconnect Market by Distance
10.4 Rest of North America MicroLED Interconnect Market
10.4.1 Rest of North America MicroLED Interconnect Market by Product Type
10.4.2 Rest of North America MicroLED Interconnect Market by Data Rate
10.4.3 Rest of North America MicroLED Interconnect Market by Distance
Chapter 11. Company Profiles
11.1 Samsung Electronics Co., Ltd. (Samsung Group)
11.1.1 Company Overview
11.1.2 Financial Analysis
11.1.3 Segmental and Regional Analysis
11.1.4 Research & Development Expenses
11.1.5 Recent strategies and developments:
11.1.5.1 Product Launches and Product Expansions:
11.1.6 SWOT Analysis
11.2 Apple, Inc.
11.2.1 Company Overview
11.2.2 Financial Analysis
11.2.3 Regional Analysis
11.2.4 Research & Development Expense
11.2.5 SWOT Analysis
11.3 Sony Corporation
11.3.1 Company Overview
11.3.2 Financial Analysis
11.3.3 Segmental and Regional Analysis
11.3.4 Research & Development Expenses
11.3.5 SWOT Analysis
11.4 LG Electronics, Inc. (LG Corporation)
11.4.1 Company Overview
11.4.2 Financial Analysis
11.4.3 Regional Analysis
11.4.4 Research & Development Expense
11.4.5 SWOT Analysis
11.5 AU Optronics Corporation
11.5.1 Company Overview
11.5.2 Financial Analysis
11.5.3 Segmental and Regional Analysis
11.5.4 Research & Development Expense
11.5.5 SWOT Analysis
11.6 BOE Technology Group Co., Ltd.
11.6.1 Company Overview
11.7 AvicenaTech, Corp.
11.7.1 Company Overview
11.7.2 Recent strategies and developments:
11.7.2.1 Partnerships, Collaborations, and Agreements:
11.8 Aledia
11.8.1 Company Overview
11.9 Ayar Labs, Inc.
11.9.1 Company Overview
11.10. EPISTAR Corporation
11.10.1 Company Overview

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