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North America LCP Based Molded Interconnect Devices Market Size, Share & Industry Analysis Report By Process (Laser Direct Structuring (LDS), Two-Shot Molding, and Other Process), By Product (Antennas, Connectors & Interconnects, Sensor Housings, and Othe

Published Nov 04, 2025
Length 169 Pages
SKU # KBV20576013

Description

The US market dominated the North America LCP Based Molded Interconnect Devices Market by Country in 2024, and would continue to be a dominant market till 2032; thereby, achieving a market value of $446.1 million by 2032. The Canada market is experiencing a CAGR of 19% during (2025 - 2032). Additionally, The Mexico market would exhibit a CAGR of 17.5% during (2025 - 2032). The US and Canada led the North America LCP Based Molded Interconnect Devices Market by Country with a market share of 69.1% and 11% in 2024.

North America has been a leader in LCP-based molded interconnect devices (MIDs) because it has strong electronics, automotive, aerospace, and medical industries. The region's initial trials with plastic-embedded circuits progressed into widespread utilization as LCP materials developed, providing thermal stability, dimensional accuracy, and minimal moisture absorption. Laser activation and metallization methods, particularly Laser Direct Structuring (LDS), made it possible to create complicated 3D circuit designs. OEMs are using MIDs increasingly to cut down on the number of parts, make things smaller, and make them more reliable. At the same time, domestic material suppliers, toolmakers, and plating houses are working together to improve the ecosystem, which is helping with pilot and small-scale production.

Some important trends in North America are faster adoption in automotive and mobility systems, integration into medical and wearable devices, and the creation of localized design automation tools. To make it easier for MID to be adopted, top companies work together with OEMs to come up with new ideas and offer design enablement services. Laser Direct Structuring is the most popular method because it is precise and efficient. Two-shot molding is next in line for making durable, multifunctional parts. Emerging or niche processes are useful in specific situations. Overall, competition is more about integration capability, design support, and reliability than price. High entry barriers keep companies focused on strategy and slowly consolidate the market.

Process Outlook

Based on Process, the market is segmented into Laser Direct Structuring (LDS), Two-Shot Molding, and Other Process. With a compound annual growth rate (CAGR) of 14.9% over the projection period, the Laser Direct Structuring (LDS) Market, dominate the US LCP Based Molded Interconnect Devices Market by Process in 2024 and would be a prominent market until 2032. The Two-Shot Molding market is expected to witness a CAGR of 15.8% during (2025 - 2032).

Product Outlook

Based on Product, the market is segmented into Antennas, Connectors & Interconnects, Sensor Housings, and Other Product. The Antennas market segment dominated the Canada LCP Based Molded Interconnect Devices Market by Product is expected to grow at a CAGR of 18.1 % during the forecast period thereby continuing its dominance until 2032. Also, The Sensor Housings market is anticipated to grow as a CAGR of 19.6 % during the forecast period during (2025 - 2032).

Country Outlook

The United States is the biggest user of LCP-based molded interconnect devices (MIDs) because it has strong electronics, aerospace, defense, medical, and consumer sectors. Early adoption in avionics, medical implants, and 5G modules is driven by the need for smaller sizes, better high-frequency performance, and systems that work together. Government support, research into new materials, and access to capital all help speed up innovation, but high labor costs and regulatory requirements make it harder. Hybrid manufacturing and additive integration are becoming more popular. MID adoption is expected to slowly grow from high-reliability, high-margin applications to premium consumer electronics and automotive modules. The U.S. has an edge over other countries because it is good at precision manufacturing and coming up with new materials.

List of Key Companies Profiled
  • Molex, LLC (Koch Industries, Inc.)
  • TE Connectivity Ltd.
  • Kyocera Corporation
  • Amphenol Corporation
  • Sumitomo Electric Industries, Ltd.
  • Taoglas
  • HARTING Technology Group
  • LPKF Laser & Electronics SE
  • Celanese Corporation
  • Solvay SA
North America LCP Based Molded Interconnect Devices Market Report Segmentation

By Process
  • Laser Direct Structuring (LDS)
  • Two-Shot Molding
  • Other Process
By Product
  • Antennas
  • Connectors & Interconnects
  • Sensor Housings
  • Other Product
By End Use
  • Automotive
  • Consumer Electronics
  • Telecommunication
  • Aerospace & Defense
  • Healthcare
  • Other End Use
By Country
  • US
  • Canada
  • Mexico
  • Rest of North America

Table of Contents

169 Pages
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America LCP Based Molded Interconnect Devices Market, by Process
1.4.2 North America LCP Based Molded Interconnect Devices Market, by Product
1.4.3 North America LCP Based Molded Interconnect Devices Market, by End Use
1.4.4 North America LCP Based Molded Interconnect Devices Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario 
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.2.3 Market Opportunities
3.2.4 Market Challenges
Chapter 4. Market Trends – North America LCP Based Molded Interconnect Devices Market
Chapter 5. State of Competition – North America LCP Based Molded Interconnect Devices Market
Chapter 6. Value Chain Analysis of LCP Based Molded Interconnect Devices Market
Chapter 7. Competition Analysis – Global
7.1 Market Share Analysis, 2024
7.2 Porter Five Forces Analysis
Chapter 8. Product Life Cycle – LCP Based Molded Interconnect Devices Market
Chapter 9. Market Consolidation – LCP Based Molded Interconnect Devices Market
Chapter 10. Key Customer Criteria – LCP Based Molded Interconnect Devices Market
Chapter 11. North America LCP Based Molded Interconnect Devices Market by Process
11.1 North America Laser Direct Structuring (LDS) Market by Country
11.2 North America Two-Shot Molding Market by Country
11.3 North America Other Process Market by Country
Chapter 12. North America LCP Based Molded Interconnect Devices Market by Product
12.1 North America Antennas Market by Country
12.2 North America Connectors & Interconnects Market by Country
12.3 North America Sensor Housings Market by Country
12.4 North America Other Product Market by Country
Chapter 13. North America LCP Based Molded Interconnect Devices Market by End Use
13.1 North America Automotive Market by Country
13.2 North America Consumer Electronics Market by Country
13.3 North America Telecommunication Market by Country
13.4 North America Aerospace & Defense Market by Country
13.5 North America Healthcare Market by Country
13.6 North America Other End Use Market by Country
Chapter 14. North America LCP Based Molded Interconnect Devices Market by Country
14.1 US LCP Based Molded Interconnect Devices Market
14.1.1 US LCP Based Molded Interconnect Devices Market by Process
14.1.2 US LCP Based Molded Interconnect Devices Market by Product
14.1.3 US LCP Based Molded Interconnect Devices Market by End Use
14.2 Canada LCP Based Molded Interconnect Devices Market
14.2.1 Canada LCP Based Molded Interconnect Devices Market by Process
14.2.2 Canada LCP Based Molded Interconnect Devices Market by Product
14.2.3 Canada LCP Based Molded Interconnect Devices Market by End Use
14.3 Mexico LCP Based Molded Interconnect Devices Market
14.3.1 Mexico LCP Based Molded Interconnect Devices Market by Process
14.3.2 Mexico LCP Based Molded Interconnect Devices Market by Product
14.3.3 Mexico LCP Based Molded Interconnect Devices Market by End Use
14.4 Rest of North America LCP Based Molded Interconnect Devices Market
14.4.1 Rest of North America LCP Based Molded Interconnect Devices Market by Process
14.4.2 Rest of North America LCP Based Molded Interconnect Devices Market by Product
14.4.3 Rest of North America LCP Based Molded Interconnect Devices Market by End Use
Chapter 15. Company Profiles
15.1 Molex, LLC (Koch Industries, Inc.)
15.1.1 Company Overview
15.1.2 SWOT Analysis
15.2 TE Connectivity Ltd.
15.2.1 Company Overview
15.2.2 Financial Analysis
15.2.3 Segmental and Regional Analysis
15.2.4 Research & Development Expense
15.2.5 SWOT Analysis
15.3 Kyocera Corporation
15.3.1 Company Overview
15.3.2 Financial Analysis
15.3.3 Segmental and Regional Analysis
15.3.4 Research & Development Expenses
15.3.5 SWOT Analysis
15.4 Amphenol Corporation
15.4.1 Company Overview
15.4.2 Financial Analysis
15.4.3 Segmental and Regional Analysis
15.4.4 Research & Development Expenses
15.4.5 SWOT Analysis
15.5 Sumitomo Electric Industries, Ltd.
15.5.1 Company Overview
15.5.2 Financial Analysis
15.5.3 Segmental and Regional Analysis
15.5.4 Research & Development Expenses
15.5.5 SWOT Analysis
15.6 Taoglas
15.6.1 Company Overview
15.7 HARTING Technology Group
15.7.1 Company Overview
15.8 LPKF Laser & Electronics SE
15.8.1 Company Overview
15.8.2 Financial Analysis
15.8.3 Segmental and Regional Analysis
15.8.4 Research & Development Expenses
15.9 Celanese Corporation
15.9.1 Company Overview
15.9.2 Financial Analysis
15.9.3 Segmental and Regional Analysis
15.9.4 Research & Development Expenses
15.9.5 SWOT Analysis
15.10. Solvay SA
15.10.1 Company Overview
15.10.2 Financial Analysis
15.10.3 Segmental Regional Analysis
15.10.4 Research & Development Expenses
15.10.5 SWOT Analysis
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