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North America Interposer and Fan-out Wafer Level Packaging Market Size, Share & Trends Analysis Report By Packaging Component & Design (Interposer, and FOWLP), By Packaging Type (2.5D, and 3D), By Device Type, By Vertical, By Country and Growth Forecast,

Publisher Knowledge Based Value (KBV) Research
Published Mar 07, 2024
Length 138 Pages
SKU # KBV18617689

Description

North America Interposer and Fan-out Wafer Level Packaging Market Size, Share & Trends Analysis Report By Packaging Component & Design (Interposer, and FOWLP), By Packaging Type (2.5D, and 3D), By Device Type, By Vertical, By Country and Growth Forecast, 2023 - 2030


The North America Interposer and Fan-out Wafer Level Packaging Market would witness market growth of 10.5% CAGR during the forecast period (2023-2030).

The US market dominated the North America Interposer and Fan-out Wafer Level Packaging Market by Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $12,916.5 million by 2030. The Canada market is showcasing a CAGR of 13% during (2023 - 2030). Additionally, The Mexico market would register a CAGR of 12% during (2023 - 2030).

In the realm of quantum computing, interposers and fan-out WLP play a crucial role in packaging qubits and controlling electronics. These technologies contribute to developing compact and efficient quantum processors, marking a significant advancement in quantum computing. Quantum bits, or qubits, are the foundational units of quantum information in quantum computing. These qubits require precise control electronics for manipulation and measurement. Interposer and fan-out WLP technologies facilitate the compact integration of qubits on a single substrate. Precisely positioning qubits is crucial for maintaining quantum coherence and minimizing interference, and these packaging solutions provide a scalable approach.

Innovations in the market also focus on environmental sustainability. Developing eco-friendly packaging materials and processes aligns with the industry's commitment to reducing the environmental impact of semiconductor manufacturing. Innovations extend beyond materials to encompass the entire manufacturing process. Low-impact manufacturing processes are being developed to minimize energy consumption, reduce waste generation, and decrease the use of hazardous substances. Sustainable manufacturing practices align with global efforts to achieve a more circular and resource-efficient economy.

As per the data released in 2023 by the International Trade Administration, Canada’s aerospace industry contributed over C$27 billion (approximately US$20.8 billion) in GDP. Active participants in global supply chains and exporters worth approximately C$18.7 billion (approximately US$14.4 billion) in 2022, the Canadian aerospace manufacturing sector generated over 80% of its revenues from exports, of which over 60% were supply chain-related. Thus, growing automotive and aerospace industries in North America will assist in expanding the regional market.

Based on Packaging Component & Design, the market is segmented into Interposer, and FOWLP. Based on Packaging Type, the market is segmented into 2.5D, and 3D. Based on Device Type, the market is segmented into Memory Devices, Logic ICs, Imaging & Optoelectronics, LEDs, MEMS/Sensors, and Others. Based on Vertical, the market is segmented into Consumer Electronics, Communications, Manufacturing, Automotive, Aerospace, Medical Devices, and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

List of Key Companies Profiled
  • Taiwan Semiconductor Manufacturing Company Limited
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • ASE Group (ASE Technology Holding Co., Ltd.)
  • Amkor Technology, Inc.
  • JCET Group
  • Powertech Technology, Inc.
  • Advanced Micro Devices, Inc.
  • Samtec
  • SK hynix, Inc.
  • Deca Technologies, Inc. (Infineon Technologies AG)
North America Interposer and Fan-out Wafer Level Packaging Market Report Segmentation

By Packaging Component & Design
  • Interposer
  • FOWLP
By Packaging Type
  • 2.5D
  • 3D
By Device Type
  • Memory Devices
  • Logic ICs
  • Imaging & Optoelectronics
  • LEDs
  • MEMS/Sensors
  • Others
By Vertical
  • Consumer Electronics
  • Communications
  • Manufacturing
  • Automotive
  • Aerospace
  • Medical Devices
  • Others
By Country
  • US
  • Canada
  • Mexico
  • Rest of North America

Table of Contents

138 Pages
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Interposer and Fan-out Wafer Level Packaging Market, by Packaging Component & Design
1.4.2 North America Interposer and Fan-out Wafer Level Packaging Market, by Packaging Type
1.4.3 North America Interposer and Fan-out Wafer Level Packaging Market, by Device Type
1.4.4 North America Interposer and Fan-out Wafer Level Packaging Market, by Vertical
1.4.5 North America Interposer and Fan-out Wafer Level Packaging Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Opportunities
3.2.3 Market Restraints
3.2.4 Market Challenges
Chapter 4. Competition Analysis – Global
4.1 Market Share Analysis, 2022
4.2 Porter Five Forces Analysis
Chapter 5. North America Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design
5.1 North America Interposer Market by Region
5.2 North America FOWLP Market by Region
Chapter 6. North America Interposer and Fan-out Wafer Level Packaging Market by Packaging Type
6.1 North America 2.5D Market by Country
6.2 North America 3D Market by Country
Chapter 7. North America Interposer and Fan-out Wafer Level Packaging Market by Device Type
7.1 North America Memory Devices Market by Country
7.2 North America Logic ICs Market by Country
7.3 North America Imaging & Optoelectronics Market by Country
7.4 North America LEDs Market by Country
7.5 North America MEMS/Sensors Market by Country
7.6 North America Others Market by Country
Chapter 8. North America Interposer and Fan-out Wafer Level Packaging Market by Vertical
8.1 North America Consumer Electronics Market by Country
8.2 North America Communications Market by Country
8.3 North America Manufacturing Market by Country
8.4 North America Automotive Market by Country
8.5 North America Aerospace Market by Country
8.6 North America Medical Devices Market by Country
8.7 North America Others Market by Country
Chapter 9. North America Interposer and Fan-out Wafer Level Packaging Market by Country
9.1 US Interposer and Fan-out Wafer Level Packaging Market
9.1.1 US Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design
9.1.2 US Interposer and Fan-out Wafer Level Packaging Market by Packaging Type
9.1.3 US Interposer and Fan-out Wafer Level Packaging Market by Device Type
9.1.4 US Interposer and Fan-out Wafer Level Packaging Market by Vertical
9.2 Canada Interposer and Fan-out Wafer Level Packaging Market
9.2.1 Canada Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design
9.2.2 Canada Interposer and Fan-out Wafer Level Packaging Market by Packaging Type
9.2.3 Canada Interposer and Fan-out Wafer Level Packaging Market by Device Type
9.2.4 Canada Interposer and Fan-out Wafer Level Packaging Market by Vertical
9.3 Mexico Interposer and Fan-out Wafer Level Packaging Market
9.3.1 Mexico Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design
9.3.2 Mexico Interposer and Fan-out Wafer Level Packaging Market by Packaging Type
9.3.3 Mexico Interposer and Fan-out Wafer Level Packaging Market by Device Type
9.3.4 Mexico Interposer and Fan-out Wafer Level Packaging Market by Vertical
9.4 Rest of North America Interposer and Fan-out Wafer Level Packaging Market
9.4.1 Rest of North America Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design
9.4.2 Rest of North America Interposer and Fan-out Wafer Level Packaging Market by Packaging Type
9.4.3 Rest of North America Interposer and Fan-out Wafer Level Packaging Market by Device Type
9.4.4 Rest of North America Interposer and Fan-out Wafer Level Packaging Market by Vertical
Chapter 10. Company Profiles
10.1 Taiwan Semiconductor Manufacturing Company Limited
10.1.1 Company overview
10.1.2 Financial Analysis
10.1.3 Regional Analysis
10.1.4 Research & Development Expenses
10.1.5 SWOT Analysis
10.2 Samsung Electronics Co., Ltd. (Samsung Group)
10.2.1 Company Overview
10.2.2 Financial Analysis
10.2.3 Segmental and Regional Analysis
10.2.4 Recent strategies and developments:
10.2.4.1 Partnerships, Collaborations, and Agreements:
10.2.4.2 Product Launches and Product Expansions:
10.2.5 SWOT Analysis
10.3 ASE Group (ASE Technology Holding Co., Ltd.)
10.3.1 Company Overview
10.3.2 Financial Analysis
10.3.3 Segmental and Regional Analysis
10.3.4 Research & Development Expenses
10.3.5 Recent strategies and developments:
10.3.5.1 Product Launches and Product Expansions:
10.3.6 SWOT Analysis
10.4 Amkor Technology, Inc.
10.4.1 Company Overview
10.4.2 Financial Analysis
10.4.3 Research & Development Expense
10.4.4 SWOT Analysis
10.5 JCET Group
10.5.1 Company Overview
10.5.2 Financial Analysis
10.5.3 Research & Development Expenses
10.5.4 SWOT Analysis
10.6 Powertech Technology Inc.
10.6.1 Company Overview
10.6.2 Financial Analysis
10.6.3 Regional Analysis
10.6.4 Research & Development Expenses
10.6.5 SWOT Analysis
10.7 Advanced Micro Devices, Inc.
10.7.1 Company Overview
10.7.2 Financial Analysis
10.7.3 Segmental and Regional Analysis
10.7.4 Research & Development Expenses
10.7.5 SWOT Analysis
10.8 Samtec
10.8.1 Company Overview
10.8.2 SWOT Analysis
10.9 SK hynix, Inc.
10.9.1 Company Overview
10.9.2 Financial Analysis
10.9.3 SWOT Analysis
10.10. Deca Technologies, Inc. (Infineon Technologies AG)
10.10.1 Company Overview
10.10.2 Financial Analysis
10.10.3 Segmental and Regional Analysis
10.10.4 Research & Development Expense
10.10.5 SWOT Analysis

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