
Europe Glass Interposers Market Size, Share & Industry Analysis Report By Wafer Size, By Application (2.5D Packaging, 3D Packaging, and Fan-Out Packaging), By Substrate Technology (Through-Glass Vias (TGV), Redistribution Layer (RDL)-First/Last, and Glass
Description
The Europe Glass Interposers Market would witness market growth of 11.5% CAGR during the forecast period (2025-2032).
The Germany market dominated the Europe Glass Interposers Market by Country in 2024, and would continue to be a dominant market till 2032; thereby, achieving a market value of $12.2 million by 2032. The UK market is exhibiting a CAGR of 10% during (2025 - 2032). Additionally, The France market would experience a CAGR of 12.4% during (2025 - 2032). The Germany and UK led the Europe Glass Interposers Market by Country with a market share of 26.3% and 12.9% in 2024.
Europe’s adoption of glass interposers is gradually increasing, supported by its strong presence in automotive, industrial automation, and energy-efficient electronics sectors. As smart mobility and digital technologies advance, European industries are leveraging glass interposers for their precision, reliability, and suitability in safety-critical applications. This technology is becoming integral in automotive radar, LiDAR, and ADAS systems where thermal stability and dimensional accuracy are crucial for performance.
Regional efforts are focused on enhancing local substrate design and embedding these capabilities into Europe’s semiconductor value chains. Public funding and collaborative innovation projects emphasize developing sustainable, scalable packaging solutions with glass interposers at the core. Influencing factors include strict EU regulations on device reliability and emissions, the drive for zero-defect automotive electronics, and strategic priorities to bolster domestic semiconductor production as part of broader digital and green transitions.
Wafer Size Outlook
Based on Wafer Size, the market is segmented into 300 mm, 200 mm, and Less than 200 mm. Among various UK Glass Interposers Market by Wafer Size; The 300 mm market achieved a market size of USD $3.3 Million in 2024 and is expected to grow at a CAGR of 9.5 % during the forecast period. The Less than 200 mm market is predicted to experience a CAGR of 11.1% throughout the forecast period from (2025 - 2032).
Application Outlook
Based on Application, the market is segmented into 2.5D Packaging, 3D Packaging, and Fan-Out Packaging. The 2.5D Packaging market segment dominated the Germany Glass Interposers Market by Application is expected to grow at a CAGR of 9.7 % during the forecast period thereby continuing its dominance until 2032. Also, The Fan-Out Packaging market is anticipated to grow as a CAGR of 11.3 % during the forecast period during (2025 - 2032).
Country Outlook
Germany’s glass interposers market is in an early but promising phase, driven by its leadership in automotive electronics, industrial automation, and aerospace. The focus is on upstream development with strong research institutions advancing through-glass via (TGV) technology and wafer-level packaging. Key strengths lie in precision glass suppliers and niche pilot projects for photonic, sensor, and telecom applications. Collaboration between research institutes and global firms supports innovation, despite challenges like high capital costs and competition from silicon and organic interposers. Germany is well-positioned for growth in specialized, high-value sectors such as automotive sensors and industrial packaging as global demand rises.
List of Key Companies Profiled
By Wafer Size
The Germany market dominated the Europe Glass Interposers Market by Country in 2024, and would continue to be a dominant market till 2032; thereby, achieving a market value of $12.2 million by 2032. The UK market is exhibiting a CAGR of 10% during (2025 - 2032). Additionally, The France market would experience a CAGR of 12.4% during (2025 - 2032). The Germany and UK led the Europe Glass Interposers Market by Country with a market share of 26.3% and 12.9% in 2024.
Europe’s adoption of glass interposers is gradually increasing, supported by its strong presence in automotive, industrial automation, and energy-efficient electronics sectors. As smart mobility and digital technologies advance, European industries are leveraging glass interposers for their precision, reliability, and suitability in safety-critical applications. This technology is becoming integral in automotive radar, LiDAR, and ADAS systems where thermal stability and dimensional accuracy are crucial for performance.
Regional efforts are focused on enhancing local substrate design and embedding these capabilities into Europe’s semiconductor value chains. Public funding and collaborative innovation projects emphasize developing sustainable, scalable packaging solutions with glass interposers at the core. Influencing factors include strict EU regulations on device reliability and emissions, the drive for zero-defect automotive electronics, and strategic priorities to bolster domestic semiconductor production as part of broader digital and green transitions.
Wafer Size Outlook
Based on Wafer Size, the market is segmented into 300 mm, 200 mm, and Less than 200 mm. Among various UK Glass Interposers Market by Wafer Size; The 300 mm market achieved a market size of USD $3.3 Million in 2024 and is expected to grow at a CAGR of 9.5 % during the forecast period. The Less than 200 mm market is predicted to experience a CAGR of 11.1% throughout the forecast period from (2025 - 2032).
Application Outlook
Based on Application, the market is segmented into 2.5D Packaging, 3D Packaging, and Fan-Out Packaging. The 2.5D Packaging market segment dominated the Germany Glass Interposers Market by Application is expected to grow at a CAGR of 9.7 % during the forecast period thereby continuing its dominance until 2032. Also, The Fan-Out Packaging market is anticipated to grow as a CAGR of 11.3 % during the forecast period during (2025 - 2032).
Country Outlook
Germany’s glass interposers market is in an early but promising phase, driven by its leadership in automotive electronics, industrial automation, and aerospace. The focus is on upstream development with strong research institutions advancing through-glass via (TGV) technology and wafer-level packaging. Key strengths lie in precision glass suppliers and niche pilot projects for photonic, sensor, and telecom applications. Collaboration between research institutes and global firms supports innovation, despite challenges like high capital costs and competition from silicon and organic interposers. Germany is well-positioned for growth in specialized, high-value sectors such as automotive sensors and industrial packaging as global demand rises.
List of Key Companies Profiled
- Corning Incorporated
- AGC Inc.
- Schott AG (Carl-Zeiss-Stiftung)
- Dai Nippon Printing Co., Ltd.
- Tecnisco, LTD. (Disco Corporation)
- Samtec, Inc.
- RENA Technologies GmbH
- PLANOPTIK AG
- 3DGS Inc.
- Workshop of Photonics
By Wafer Size
- 300 mm
- 200 mm
- Less than 200 mm
- 2.5D Packaging
- 3D Packaging
- Fan-Out Packaging
- Through-Glass Vias (TGV)
- Redistribution Layer (RDL)-First/Last
- Glass Panel Level Packaging (PLP)
- Consumer Electronics
- Telecommunications
- Automotive
- Defense & Aerospace
- Healthcare
- Other End Use Industry
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
Table of Contents
169 Pages
- Chapter 1. Market Scope & Methodology
- 1.1 Market Definition
- 1.2 Objectives
- 1.3 Market Scope
- 1.4 Segmentation
- 1.4.1 Europe Glass Interposers Market, by Wafer Size
- 1.4.2 Europe Glass Interposers Market, by Application
- 1.4.3 Europe Glass Interposers Market, by Substrate Technology
- 1.4.4 Europe Glass Interposers Market, by End Use Industry
- 1.4.5 Europe Glass Interposers Market, by Country
- 1.5 Methodology for the research
- Chapter 2. Market at a Glance
- 2.1 Key Highlights
- Chapter 3. Market Overview
- 3.1 Introduction
- 3.1.1 Overview
- 3.1.2 Market Drivers
- 3.1.3 Market Restraints
- 3.1.4 Market Opportunities
- 3.1.5 Market Challenges
- Chapter 4. Market Trends Europe Glass Interposers Market
- Chapter 5. State of Competition - Europe Glass Interposers Market
- Chapter 6. Competition Analysis – Global
- 6.1 Market Share Analysis, 2024
- 6.2 Recent Strategies Deployed in Glass Interposers Market
- 6.3 Porter Five Forces Analysis
- Chapter 7. PLC (Product Life Cycle) Glass Interposers Market
- Chapter 8. Market Consolidation - Glass Interposers Market
- Chapter 9. Value Chain Analysis of Glass Interposers Market
- Chapter 10. Key Customer Criteria - Glass Interposers Market
- Chapter 11. Europe Glass Interposers Market by Wafer Size
- 11.1 Europe 300 mm Market by Country
- 11.2 Europe 200 mm Market by Country
- 11.3 Europe Less than 200 mm Market by Country
- Chapter 12. Europe Glass Interposers Market by Application
- 12.1 Europe 2.5D Packaging Market by Country
- 12.2 Europe 3D Packaging Market by Country
- 12.3 Europe Fan-Out Packaging Market by Country
- Chapter 13. Europe Glass Interposers Market by Substrate Technology
- 13.1 Europe Through-Glass Vias (TGV) Market by Country
- 13.2 Europe Redistribution Layer (RDL)-First/Last Market by Country
- 13.3 Europe Glass Panel Level Packaging (PLP) Market by Country
- Chapter 14. Europe Glass Interposers Market by End Use Industry
- 14.1 Europe Consumer Electronics Market by Country
- 14.2 Europe Telecommunications Market by Country
- 14.3 Europe Automotive Market by Country
- 14.4 Europe Defense & Aerospace Market by Country
- 14.5 Europe Healthcare Market by Country
- 14.6 Europe Other End Use Industry Market by Country
- Chapter 15. Europe Glass Interposers Market by Country
- 15.1 Germany Glass Interposers Market
- 15.1.1 Germany Glass Interposers Market by Wafer Size
- 15.1.2 Germany Glass Interposers Market by Application
- 15.1.3 Germany Glass Interposers Market by Substrate Technology
- 15.1.4 Germany Glass Interposers Market by End Use Industry
- 15.2 UK Glass Interposers Market
- 15.2.1 UK Glass Interposers Market by Wafer Size
- 15.2.2 UK Glass Interposers Market by Application
- 15.2.3 UK Glass Interposers Market by Substrate Technology
- 15.2.4 UK Glass Interposers Market by End Use Industry
- 15.3 France Glass Interposers Market
- 15.3.1 France Glass Interposers Market by Wafer Size
- 15.3.2 France Glass Interposers Market by Application
- 15.3.3 France Glass Interposers Market by Substrate Technology
- 15.3.4 France Glass Interposers Market by End Use Industry
- 15.4 Russia Glass Interposers Market
- 15.4.1 Russia Glass Interposers Market by Wafer Size
- 15.4.2 Russia Glass Interposers Market by Application
- 15.4.3 Russia Glass Interposers Market by Substrate Technology
- 15.4.4 Russia Glass Interposers Market by End Use Industry
- 15.5 Spain Glass Interposers Market
- 15.5.1 Spain Glass Interposers Market by Wafer Size
- 15.5.2 Spain Glass Interposers Market by Application
- 15.5.3 Spain Glass Interposers Market by Substrate Technology
- 15.5.4 Spain Glass Interposers Market by End Use Industry
- 15.6 Italy Glass Interposers Market
- 15.6.1 Italy Glass Interposers Market by Wafer Size
- 15.6.2 Italy Glass Interposers Market by Application
- 15.6.3 Italy Glass Interposers Market by Substrate Technology
- 15.6.4 Italy Glass Interposers Market by End Use Industry
- 15.7 Rest of Europe Glass Interposers Market
- 15.7.1 Rest of Europe Glass Interposers Market by Wafer Size
- 15.7.2 Rest of Europe Glass Interposers Market by Application
- 15.7.3 Rest of Europe Glass Interposers Market by Substrate Technology
- 15.7.4 Rest of Europe Glass Interposers Market by End Use Industry
- Chapter 16. Company Profiles
- 16.1 Corning Incorporated
- 16.1.1 Company Overview
- 16.1.2 Financial Analysis
- 16.1.3 Segmental and Regional Analysis
- 16.1.4 Research & Development Expenses
- 16.1.5 Recent strategies and developments:
- 16.1.5.1 Partnerships, Collaborations, and Agreements:
- 16.1.6 SWOT Analysis
- 16.2 AGC, Inc.
- 16.2.1 Company Overview
- 16.2.2 Financial Analysis
- 16.2.3 Segmental Analysis
- 16.2.4 Research & Development Expenses
- 16.2.5 SWOT Analysis
- 16.3 Schott AG (Carl-Zeiss-Stiftung)
- 16.3.1 Company Overview
- 16.3.2 Financial Analysis
- 16.3.3 Segmental and Regional Analysis
- 16.3.4 Research & Development Expenses
- 16.3.5 Recent strategies and developments:
- 16.3.5.1 Product Launches and Product Expansions:
- 16.3.6 SWOT Analysis
- 16.4 Dai Nippon Printing Co., Ltd.
- 16.4.1 Company Overview
- 16.4.2 Financial Analysis
- 16.4.3 Segmental and Regional Analysis
- 16.4.4 Research & Development Expenses
- 16.4.5 Recent strategies and developments:
- 16.4.5.1 Product Launches and Product Expansions:
- 16.5 Tecnisco, LTD. (Disco Corporation)
- 16.5.1 Company Overview
- 16.5.2 Financial Analysis
- 16.6 Samtec, Inc.
- 16.6.1 Company Overview
- 16.6.2 SWOT Analysis
- 16.7 RENA Technologies GmbH
- 16.7.1 Company Overview
- 16.8 PLANOPTIK AG
- 16.8.1 Company Overview
- 16.8.2 Financial Analysis
- 16.8.3 Research & Development Expenses
- 16.8.4 Recent strategies and developments:
- 16.8.4.1 Product Launches and Product Expansions:
- 16.9 3DGS Inc.
- 16.9.1 Company Overview
- 16.9.2 Recent strategies and developments:
- 16.9.2.1 Product Launches and Product Expansions:
- 16.10. Workshop of Photonics
- 16.10.1 Company Overview
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