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Next Generation Memory Market Size, Share, Trends and Forecast by Technology, Wafer Size, Storage Type, Application, and Region, 2025-2033

Publisher IMARC Services Pvt. Ltd.
Published May 01, 2025
Length 136 Pages
SKU # IMRC20011259

Description

The global next generation memory market size reached USD 7.6 Billion in 2024. Looking forward, IMARC Group expects the market to reach USD 47.7 Billion by 2033, exhibiting a growth rate CAGR of 22.51% during 2025-2033. Asia Pacific currently dominates the market, holding a significant share of 39.8% in 2024, driven by strong semiconductor manufacturing, rising demand for advanced memory solutions, and increasing adoption of AI, IoT, and cloud technologies.

Next generation memory refers to a fast, efficient and cost-effective storage solution that can store more data than silicon chips. It consequently finds extensive applications in the telecommunications, information technology (IT), and banking, financial services and insurance (BFSI) industries across the globe. At present, there is a surge in the requirement for high bandwidth, low power consumption, and highly scalable memory devices that rely on artificial intelligence (AI), the Internet of things (IoT), big data and other technologies. This, in turn, is catalyzing the demand for next generation memory.

Next Generation Memory Market Trends:

There is presently a significant rise in the traction of universal memory worldwide. This, in confluence with the burgeoning electronics industry, represents one of the key factors bolstering the growth of the market. Apart from this, with the growing sales of smartphones, tablets, universal serial bus (USB) drives, and solid-state drives (SSD), the demand for NOT-AND (NAND) flash memory, which is a type of non-volatile storage technology that does not need energy to retain data is also increasing. Besides this, high-bandwidth memory (HBM), a next generation memory technology for graphics, is rapidly being used in leading-edge graphics, networking, high-performance computing (HPC), and artificial intelligence (AI) systems. For instance, it is utilized in decoders, fully autonomous vehicles, neural network designs, and other advanced applications that require low power and enormous bandwidth. This, coupled with the rising usage of wearable devices, is facilitating the growth of the market. Other factors, such as the increasing use of connected cars and considerable growth in the IT industry, are projected to create a positive outlook for the market in the upcoming years.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each segment of the global next generation memory market, along with forecast at the global, regional, and country levels from 2025-2033. The market has been categorized based on technology, wafer size, storage type, and application.

Breakup by Technology:
  • Non-Volatile
  • Magneto-Resistive Random-Access Memory (MRAM)
  • Ferroelectric RAM (FRAM)
  • Resistive Random-Access Memory (ReRAM)
  • 3D Xpoint
  • Nano RAM
  • Other Non-Volatile Technologies (Phase change RAM, STT-RAM, and SRAM)
  • Volatile
  • Hybrid Memory Cube (HMC)
  • High-Bandwidth Memory (HBM)
Breakup by Wafer Size:
  • 200 mm
  • 300 mm
  • 450 mm
Breakup by Storage Type:
  • Mass Storage
  • Embedded Storage
  • Others
Breakup by Application:
  • BFSI
  • Consumer Electronics
  • Government
  • Telecommunications
  • Information Technology
  • Others
Breakup by Region:
  • North America
  • United States
  • Canada
  • Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Russia
  • Others
  • Latin America
  • Brazil
  • Mexico
  • Others
  • Middle East and Africa
Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being Avalanche Technology, Crossbar Inc., Fujitsu Limited, Honeywell International Inc., Infineon Technologies AG, Intel Corporation, Micron Technology Inc., Nantero Inc., Samsung Electronics Co. Ltd., SK hynix Inc., Spin Memory Inc. and Taiwan Semiconductor Manufacturing Co. Ltd.

Key Questions Answered in This Report

1.How big is the next generation memory market?

2.What is the future outlook of next generation memory market?

3.What are the key factors driving the next generation memory market?

4.Which region accounts for the largest next generation memory market share?

5.Which are the leading companies in the global next generation memory market?

Table of Contents

136 Pages
1 Preface
2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
4.1 Overview
4.2 Key Industry Trends
5 Global Next Generation Memory Market
5.1 Market Overview
5.2 Market Performance
5.3 Impact of COVID-19
5.4 Market Forecast
6 Market Breakup by Technology
6.1 Non-Volatile
6.1.1 Market Trends
6.1.2 Key Segments
6.1.2.1 Magneto-Resistive Random-Access Memory (MRAM)
6.1.2.2 Ferroelectric RAM (FRAM)
6.1.2.3 Resistive Random-Access Memory (ReRAM)
6.1.2.4 3D Xpoint
6.1.2.5 Nano RAM
6.1.2.6 Other Non-Volatile Technologies (Phase change RAM, STT-RAM, and SRAM)
6.1.3 Market Forecast
6.2 Volatile
6.2.1 Market Trends
6.2.2 Key Segments
6.2.2.1 Hybrid Memory Cube (HMC)
6.2.2.2 High-Bandwidth Memory (HBM)
6.2.3 Market Forecast
7 Market Breakup by Wafer Size
7.1 200 mm
7.1.1 Market Trends
7.1.2 Market Forecast
7.2 300 mm
7.2.1 Market Trends
7.2.2 Market Forecast
7.3 450 mm
7.3.1 Market Trends
7.3.2 Market Forecast
8 Market Breakup by Storage Type
8.1 Mass Storage
8.1.1 Market Trends
8.1.2 Market Forecast
8.2 Embedded Storage
8.2.1 Market Trends
8.2.2 Market Forecast
8.3 Others
8.3.1 Market Trends
8.3.2 Market Forecast
9 Market Breakup by Application
9.1 BFSI
9.1.1 Market Trends
9.1.2 Market Forecast
9.2 Consumer Electronics
9.2.1 Market Trends
9.2.2 Market Forecast
9.3 Government
9.3.1 Market Trends
9.3.2 Market Forecast
9.4 Telecommunications
9.4.1 Market Trends
9.4.2 Market Forecast
9.5 Information Technology
9.5.1 Market Trends
9.5.2 Market Forecast
9.6 Others
9.6.1 Market Trends
9.6.2 Market Forecast
10 Market Breakup by Region
10.1 North America
10.1.1 United States
10.1.1.1 Market Trends
10.1.1.2 Market Forecast
10.1.2 Canada
10.1.2.1 Market Trends
10.1.2.2 Market Forecast
10.2 Asia-Pacific
10.2.1 China
10.2.1.1 Market Trends
10.2.1.2 Market Forecast
10.2.2 Japan
10.2.2.1 Market Trends
10.2.2.2 Market Forecast
10.2.3 India
10.2.3.1 Market Trends
10.2.3.2 Market Forecast
10.2.4 South Korea
10.2.4.1 Market Trends
10.2.4.2 Market Forecast
10.2.5 Australia
10.2.5.1 Market Trends
10.2.5.2 Market Forecast
10.2.6 Indonesia
10.2.6.1 Market Trends
10.2.6.2 Market Forecast
10.2.7 Others
10.2.7.1 Market Trends
10.2.7.2 Market Forecast
10.3 Europe
10.3.1 Germany
10.3.1.1 Market Trends
10.3.1.2 Market Forecast
10.3.2 France
10.3.2.1 Market Trends
10.3.2.2 Market Forecast
10.3.3 United Kingdom
10.3.3.1 Market Trends
10.3.3.2 Market Forecast
10.3.4 Italy
10.3.4.1 Market Trends
10.3.4.2 Market Forecast
10.3.5 Spain
10.3.5.1 Market Trends
10.3.5.2 Market Forecast
10.3.6 Russia
10.3.6.1 Market Trends
10.3.6.2 Market Forecast
10.3.7 Others
10.3.7.1 Market Trends
10.3.7.2 Market Forecast
10.4 Latin America
10.4.1 Brazil
10.4.1.1 Market Trends
10.4.1.2 Market Forecast
10.4.2 Mexico
10.4.2.1 Market Trends
10.4.2.2 Market Forecast
10.4.3 Others
10.4.3.1 Market Trends
10.4.3.2 Market Forecast
10.5 Middle East and Africa
10.5.1 Market Trends
10.5.2 Market Breakup by Country
10.5.3 Market Forecast
11 SWOT Analysis
11.1 Overview
11.2 Strengths
11.3 Weaknesses
11.4 Opportunities
11.5 Threats
12 Value Chain Analysis
13 Porters Five Forces Analysis
13.1 Overview
13.2 Bargaining Power of Buyers
13.3 Bargaining Power of Suppliers
13.4 Degree of Competition
13.5 Threat of New Entrants
13.6 Threat of Substitutes
14 Price Analysis
15 Competitive Landscape
15.1 Market Structure
15.2 Key Players
15.3 Profiles of Key Players
15.3.1 Avalanche Technology
15.3.1.1 Company Overview
15.3.1.2 Product Portfolio
15.3.2 Crossbar Inc.
15.3.2.1 Company Overview
15.3.2.2 Product Portfolio
15.3.3 Fujitsu Limited
15.3.3.1 Company Overview
15.3.3.2 Product Portfolio
15.3.3.3 Financials
15.3.3.4 SWOT Analysis
15.3.4 Honeywell International Inc.
15.3.4.1 Company Overview
15.3.4.2 Product Portfolio
15.3.4.3 Financials
15.3.4.4 SWOT Analysis
15.3.5 Infineon Technologies AG
15.3.5.1 Company Overview
15.3.5.2 Product Portfolio
15.3.5.3 Financials
15.3.5.4 SWOT Analysis
15.3.6 Intel Corporation
15.3.6.1 Company Overview
15.3.6.2 Product Portfolio
15.3.6.3 Financials
15.3.6.4 SWOT Analysis
15.3.7 Micron Technology Inc.
15.3.7.1 Company Overview
15.3.7.2 Product Portfolio
15.3.7.3 Financials
15.3.7.4 SWOT Analysis
15.3.8 Nantero Inc.
15.3.8.1 Company Overview
15.3.8.2 Product Portfolio
15.3.9 Samsung Electronics Co. Ltd.
15.3.9.1 Company Overview
15.3.9.2 Product Portfolio
15.3.9.3 Financials
15.3.10 SK hynix Inc.
15.3.10.1 Company Overview
15.3.10.2 Product Portfolio
15.3.10.3 Financials
15.3.10.4 SWOT Analysis
15.3.11 Spin Memory Inc.
15.3.11.1 Company Overview
15.3.11.2 Product Portfolio
15.3.12 Taiwan Semiconductor Manufacturing Co. Ltd.
15.3.12.1 Company Overview
15.3.12.2 Product Portfolio
15.3.12.3 Financials
15.3.12.4 SWOT Analysis

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