Global Wafer Thinning Machine Supply, Demand and Key Producers, 2026-2032
Description
The global Wafer Thinning Machine market size is expected to reach $ 1843 million by 2032, rising at a market growth of 6.9% CAGR during the forecast period (2026-2032).
Wafer thinning machines, also called grinders, use a centrally located robot to move wafers from the input station to the measurement station. After that, the wafer moves to the polishing station and the cleaning station in sequence. The robot can move the wafer from the cleaning station to the measuring station for measurement after grinding or directly to the output station.
The Wafer Thinning Machines market, primarily driven by the increasing demand for precision and efficiency in semiconductor manufacturing, is growing rapidly across the globe. Wafer Thinning Machines are integral in wafer thinning processes, where the primary applications include the processing of 200mm and 300mm wafers. Among the various types of Wafer Thinning Machines, the fully automatic Wafer Thinning Machines dominate the market, they have higher automation levels, allowing for increased efficiency and precision, accounting for approximately 52% of the global market share. The most significant application market is for 300mm wafers, which accounts for 83% of the global demand, primarily driven by the advanced semiconductor manufacturing processes that require thinner wafers with high precision. Geographically, the Asia-Pacific (APAC) region holds the largest consumption share, accounting for about 78% of the global market, driven by the robust semiconductor manufacturing ecosystem in countries like China, Japan, South Korea, and Taiwan.
Manufacturers, like Disco, TOKYO SEIMITSU, Okamoto Semiconductor Equipment Division, CETC, G&N, etc. are well-known for the wonderful performance of their Wafer Thinning Machine and related services. The top five players account for about 90% of the revenue market in 2024.
Market Drivers:
Technological Advancements in Semiconductor Manufacturing: As the demand for smaller, more powerful, and energy-efficient electronic devices grows, semiconductor manufacturers are continuously advancing their processes to meet these demands. This includes the need for thinner, more precisely engineered wafers, driving the demand for high-performance Wafer Thinning Machines. Fully automatic Wafer Thinning Machines, known for their precision and ability to handle larger volumes, are particularly in demand to meet these stringent manufacturing requirements.
Miniaturization of Electronic Devices: The global trend towards smaller, more compact electronic devices—such as smartphones, wearables, and IoT devices—requires thinner semiconductor wafers. As a result, there is a growing demand for wafer thinning solutions that can maintain high quality while reducing thickness. Fully automatic Wafer Thinning Machines are the preferred solution, as they offer high precision and productivity.
Surge in Semiconductor Demand: The semiconductor industry is experiencing significant growth, driven by the rise in demand for various electronic applications, including computing, communication, and automotive systems. As the industry's focus shifts towards advanced technology nodes, the demand for larger wafers, particularly 300mm wafers, is growing. These trends are contributing to the expansion of the Wafer Thinning Machine market, especially in regions such as APAC, which dominate semiconductor manufacturing.
Shift Towards Fully Automated Solutions: Fully automated Wafer Thinning Machines are gaining popularity due to their higher efficiency, reduced labor costs, and the ability to maintain consistency across large batches. As semiconductor manufacturers continue to scale production, automation becomes increasingly essential to meet high-volume production requirements without compromising quality.
Conclusion:
The Wafer Thinning Machine market is poised for significant growth, driven by advancements in semiconductor manufacturing, the increasing demand for thinner and more precise wafers, and the rise in 300mm wafer processing. Fully automatic Wafer Thinning Machines, which dominate the market with a 52% share, will continue to lead the market due to their higher efficiency and precision.
The APAC region remains the largest consumer of Wafer Thinning Machines. However, despite these strong growth drivers, challenges such as high initial investment costs and technological complexity may pose barriers to market entry for smaller players. Manufacturers will need to innovate and focus on automation, precision, and cost-effective solutions to capitalize on the growing demand for wafer thinning equipment.
This report studies the global Wafer Thinning Machine production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Wafer Thinning Machine and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Wafer Thinning Machine that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Wafer Thinning Machine total production and demand, 2021-2032, (Units)
Global Wafer Thinning Machine total production value, 2021-2032, (USD Million)
Global Wafer Thinning Machine production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Units), (based on production site)
Global Wafer Thinning Machine consumption by region & country, CAGR, 2021-2032 & (Units)
U.S. VS China: Wafer Thinning Machine domestic production, consumption, key domestic manufacturers and share
Global Wafer Thinning Machine production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Units)
Global Wafer Thinning Machine production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Units)
Global Wafer Thinning Machine production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Units)
This report profiles key players in the global Wafer Thinning Machine market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Wafer Thinning Machine market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (K US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Wafer Thinning Machine Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Wafer Thinning Machine Market, Segmentation by Type:
Fully Automatic Wafer Grinders
Semi-Automatic Wafer Grinders
Global Wafer Thinning Machine Market, Segmentation by Application:
Silicon Wafer
Compound Semiconductors
Companies Profiled:
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam
TSD
Engis Corporation
NTS
Key Questions Answered:
1. How big is the global Wafer Thinning Machine market?
2. What is the demand of the global Wafer Thinning Machine market?
3. What is the year over year growth of the global Wafer Thinning Machine market?
4. What is the production and production value of the global Wafer Thinning Machine market?
5. Who are the key producers in the global Wafer Thinning Machine market?
6. What are the growth factors driving the market demand?
Wafer thinning machines, also called grinders, use a centrally located robot to move wafers from the input station to the measurement station. After that, the wafer moves to the polishing station and the cleaning station in sequence. The robot can move the wafer from the cleaning station to the measuring station for measurement after grinding or directly to the output station.
The Wafer Thinning Machines market, primarily driven by the increasing demand for precision and efficiency in semiconductor manufacturing, is growing rapidly across the globe. Wafer Thinning Machines are integral in wafer thinning processes, where the primary applications include the processing of 200mm and 300mm wafers. Among the various types of Wafer Thinning Machines, the fully automatic Wafer Thinning Machines dominate the market, they have higher automation levels, allowing for increased efficiency and precision, accounting for approximately 52% of the global market share. The most significant application market is for 300mm wafers, which accounts for 83% of the global demand, primarily driven by the advanced semiconductor manufacturing processes that require thinner wafers with high precision. Geographically, the Asia-Pacific (APAC) region holds the largest consumption share, accounting for about 78% of the global market, driven by the robust semiconductor manufacturing ecosystem in countries like China, Japan, South Korea, and Taiwan.
Manufacturers, like Disco, TOKYO SEIMITSU, Okamoto Semiconductor Equipment Division, CETC, G&N, etc. are well-known for the wonderful performance of their Wafer Thinning Machine and related services. The top five players account for about 90% of the revenue market in 2024.
Market Drivers:
Technological Advancements in Semiconductor Manufacturing: As the demand for smaller, more powerful, and energy-efficient electronic devices grows, semiconductor manufacturers are continuously advancing their processes to meet these demands. This includes the need for thinner, more precisely engineered wafers, driving the demand for high-performance Wafer Thinning Machines. Fully automatic Wafer Thinning Machines, known for their precision and ability to handle larger volumes, are particularly in demand to meet these stringent manufacturing requirements.
Miniaturization of Electronic Devices: The global trend towards smaller, more compact electronic devices—such as smartphones, wearables, and IoT devices—requires thinner semiconductor wafers. As a result, there is a growing demand for wafer thinning solutions that can maintain high quality while reducing thickness. Fully automatic Wafer Thinning Machines are the preferred solution, as they offer high precision and productivity.
Surge in Semiconductor Demand: The semiconductor industry is experiencing significant growth, driven by the rise in demand for various electronic applications, including computing, communication, and automotive systems. As the industry's focus shifts towards advanced technology nodes, the demand for larger wafers, particularly 300mm wafers, is growing. These trends are contributing to the expansion of the Wafer Thinning Machine market, especially in regions such as APAC, which dominate semiconductor manufacturing.
Shift Towards Fully Automated Solutions: Fully automated Wafer Thinning Machines are gaining popularity due to their higher efficiency, reduced labor costs, and the ability to maintain consistency across large batches. As semiconductor manufacturers continue to scale production, automation becomes increasingly essential to meet high-volume production requirements without compromising quality.
Conclusion:
The Wafer Thinning Machine market is poised for significant growth, driven by advancements in semiconductor manufacturing, the increasing demand for thinner and more precise wafers, and the rise in 300mm wafer processing. Fully automatic Wafer Thinning Machines, which dominate the market with a 52% share, will continue to lead the market due to their higher efficiency and precision.
The APAC region remains the largest consumer of Wafer Thinning Machines. However, despite these strong growth drivers, challenges such as high initial investment costs and technological complexity may pose barriers to market entry for smaller players. Manufacturers will need to innovate and focus on automation, precision, and cost-effective solutions to capitalize on the growing demand for wafer thinning equipment.
This report studies the global Wafer Thinning Machine production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Wafer Thinning Machine and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Wafer Thinning Machine that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Wafer Thinning Machine total production and demand, 2021-2032, (Units)
Global Wafer Thinning Machine total production value, 2021-2032, (USD Million)
Global Wafer Thinning Machine production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Units), (based on production site)
Global Wafer Thinning Machine consumption by region & country, CAGR, 2021-2032 & (Units)
U.S. VS China: Wafer Thinning Machine domestic production, consumption, key domestic manufacturers and share
Global Wafer Thinning Machine production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Units)
Global Wafer Thinning Machine production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Units)
Global Wafer Thinning Machine production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Units)
This report profiles key players in the global Wafer Thinning Machine market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Wafer Thinning Machine market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (K US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Wafer Thinning Machine Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Wafer Thinning Machine Market, Segmentation by Type:
Fully Automatic Wafer Grinders
Semi-Automatic Wafer Grinders
Global Wafer Thinning Machine Market, Segmentation by Application:
Silicon Wafer
Compound Semiconductors
Companies Profiled:
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam
TSD
Engis Corporation
NTS
Key Questions Answered:
1. How big is the global Wafer Thinning Machine market?
2. What is the demand of the global Wafer Thinning Machine market?
3. What is the year over year growth of the global Wafer Thinning Machine market?
4. What is the production and production value of the global Wafer Thinning Machine market?
5. Who are the key producers in the global Wafer Thinning Machine market?
6. What are the growth factors driving the market demand?
Table of Contents
118 Pages
- 1 Supply Summary
- 2 Demand Summary
- 3 World Manufacturers Competitive Analysis
- 4 United States VS China VS Rest of the World
- 5 Market Analysis by Type
- 6 Market Analysis by Application
- 7 Company Profiles
- 8 Industry Chain Analysis
- 9 Research Findings and Conclusion
- 10 Appendix
Pricing
Currency Rates
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