Global Wafer Thinning Grinding Wheel Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Wafer Thinning Grinding Wheel market size was valued at US$ 95.8 million in 2024 and is forecast to a readjusted size of USD 171 million by 2031 with a CAGR of 8.6% during review period.

A Wafer Thinning Grinding Wheel is a specialized abrasive tool used in semiconductor manufacturing to reduce the thickness of silicon wafers while maintaining their structural integrity and surface quality. This process, known as wafer thinning, is critical for producing ultra-thin wafers used in advanced electronic devices like smartphones, microprocessors, and memory chips. The grinding wheel typically features a diamond abrasive layer, ensuring precision, minimal damage, and high efficiency. Its design and material composition are optimized to handle the delicate nature of wafers while achieving the required thickness and flatness.

This report is a detailed and comprehensive analysis for global Wafer Thinning Grinding Wheel market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Wafer Thinning Grinding Wheel market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031

Global Wafer Thinning Grinding Wheel market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031

Global Wafer Thinning Grinding Wheel market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031

Global Wafer Thinning Grinding Wheel market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Wafer Thinning Grinding Wheel

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Wafer Thinning Grinding Wheel market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Tokyo Diamond, Disco, Asahi Diamond, Saint-Gobain, Tyrolit Group, Noritake, Kinik, EHWA Diamond, Shinhan Diamond, Qingdao Gaoce Technology, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Wafer Thinning Grinding Wheel market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type

Vitrified Bond

Resinoid Bond

Others

Market segment by Application

Rough Grinding

Fine Grinding

Major players covered

Tokyo Diamond

Disco

Asahi Diamond

Saint-Gobain

Tyrolit Group

Noritake

Kinik

EHWA Diamond

Shinhan Diamond

Qingdao Gaoce Technology

Kure Grinding Wheel

Zhengzhou Research Institute For Abrasives & Grinding

Suzhou Sail Science & Technology

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Wafer Thinning Grinding Wheel product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Wafer Thinning Grinding Wheel, with price, sales quantity, revenue, and global market share of Wafer Thinning Grinding Wheel from 2020 to 2025.

Chapter 3, the Wafer Thinning Grinding Wheel competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Wafer Thinning Grinding Wheel breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Wafer Thinning Grinding Wheel market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Thinning Grinding Wheel.

Chapter 14 and 15, to describe Wafer Thinning Grinding Wheel sales channel, distributors, customers, research findings and conclusion.