Global Wafer Level Chip Scale Packaging (WLCSP) Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Wafer Level Chip Scale Packaging (WLCSP) market size was valued at US$ 2223 million in 2024 and is forecast to a readjusted size of USD 2689 million by 2031 with a CAGR of 1.8% during review period.
Wafer-level chip-scale packaging (WLCSP) is an innovative packaging technology that cleverly combines the characteristics of chip-scale packaging (CSP) and wafer-level packaging (WLP). CSP technology emphasizes the compact ratio between package size and chip size, which is usually less than 1.2:1, which is crucial to promoting the miniaturization of integrated circuits. WLP technology takes a different approach, packaging the wafer directly after the front-end process is completed, and then cutting it into individual chips. This approach has shown significant advantages in cost control compared to the traditional process of cutting first and then packaging.
WLCSP technology combines the advantages of both. It directly packages and tests on the entire wafer before cutting it into independent chips. This process eliminates the steps of wire bonding and glue filling, making the size of the packaged chip almost the same as that of the bare chip. Therefore, WLCSP technology can not only significantly reduce the size of the IC to meet the needs of mobile electronic products for high-density integration space, but also directly connect the solder balls on the chip to the circuit board to minimize the circuit path. This not only greatly improves the transmission speed of information, but also effectively reduces the risk of noise interference.
This article only counts WLCSP packaging and testing companies, excluding TSMC and IDM businesses.
WLCSP usually consists of four parts: Silicon Die, Re-passivation, UBM, and bump.
The current challenges of WLCSP packaging are mainly:
1. Uniformity, consistency and reliability: WLCSP needs to be packaged and tested on a whole wafer, and then cut into dies after completion. The uniformity and consistency of the dies need to be maintained throughout the process.
2. Structural complexity: The WLCSP packaging structure is relatively complex. The more complex the structure, the more difficult the testing process.
3. Technology substitution: In advanced packaging, the packaging technologies with a higher share are FC, SiP, and 2.5D/3D, which account for more than 88% of the share, while WLCSP only accounts for about 5%. Although the share of advanced packaging has been steadily increasing due to major trends such as AI, high-performance computing, and automobiles, as downstream new markets and new technologies increasingly focus on equipment functions rather than technology, the three packaging technologies with a larger share still dominate the share of advanced packaging.
Globally, there are three types of WLCSP companies: OAST, IDM, and Foundry. Among them, OAST dominates the WLCSP packaging market. The core enterprises mainly include ASE, Amkor, JCET Group, etc., and the top 3 account for more than 40%.
This report is a detailed and comprehensive analysis for global Wafer Level Chip Scale Packaging (WLCSP) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Wafer Level Chip Scale Packaging (WLCSP) market size and forecasts, in consumption value ($ Million), sales quantity (Million Units), and average selling prices (USD/K Unit), 2020-2031
Global Wafer Level Chip Scale Packaging (WLCSP) market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Million Units), and average selling prices (USD/K Unit), 2020-2031
Global Wafer Level Chip Scale Packaging (WLCSP) market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Million Units), and average selling prices (USD/K Unit), 2020-2031
Global Wafer Level Chip Scale Packaging (WLCSP) market shares of main players, shipments in revenue ($ Million), sales quantity (Million Units), and ASP (USD/K Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Wafer Level Chip Scale Packaging (WLCSP)
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Wafer Level Chip Scale Packaging (WLCSP) market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Amkor, JCET, ASE, Powertech Technology Inc, Nepes, SPIL, Tianshui Huatian Technology, Tongfu Microelectronics, Macronix, CHIPBOND, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Wafer Level Chip Scale Packaging (WLCSP) market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Fan-In WLCSP
Fan-Out WLCSP
Market segment by Application
WiFi and Bluetooth
PMIC
Flash/EEPROM
RF
Audio Codec
Driver, Display and Wireless Charging IC
NFC Controller
Others
Major players covered
Amkor
JCET
ASE
Powertech Technology Inc
Nepes
SPIL
Tianshui Huatian Technology
Tongfu Microelectronics
Macronix
CHIPBOND
China Wafer Level CSP Co., Ltd
Xintec Inc
SJ Semiconductor
Suzhou Keyang Semiconductor
Raytek Semiconductor
ChipMOS
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Level Chip Scale Packaging (WLCSP) product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Level Chip Scale Packaging (WLCSP), with price, sales quantity, revenue, and global market share of Wafer Level Chip Scale Packaging (WLCSP) from 2020 to 2025.
Chapter 3, the Wafer Level Chip Scale Packaging (WLCSP) competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Level Chip Scale Packaging (WLCSP) breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Wafer Level Chip Scale Packaging (WLCSP) market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Level Chip Scale Packaging (WLCSP).
Chapter 14 and 15, to describe Wafer Level Chip Scale Packaging (WLCSP) sales channel, distributors, customers, research findings and conclusion.
Wafer-level chip-scale packaging (WLCSP) is an innovative packaging technology that cleverly combines the characteristics of chip-scale packaging (CSP) and wafer-level packaging (WLP). CSP technology emphasizes the compact ratio between package size and chip size, which is usually less than 1.2:1, which is crucial to promoting the miniaturization of integrated circuits. WLP technology takes a different approach, packaging the wafer directly after the front-end process is completed, and then cutting it into individual chips. This approach has shown significant advantages in cost control compared to the traditional process of cutting first and then packaging.
WLCSP technology combines the advantages of both. It directly packages and tests on the entire wafer before cutting it into independent chips. This process eliminates the steps of wire bonding and glue filling, making the size of the packaged chip almost the same as that of the bare chip. Therefore, WLCSP technology can not only significantly reduce the size of the IC to meet the needs of mobile electronic products for high-density integration space, but also directly connect the solder balls on the chip to the circuit board to minimize the circuit path. This not only greatly improves the transmission speed of information, but also effectively reduces the risk of noise interference.
This article only counts WLCSP packaging and testing companies, excluding TSMC and IDM businesses.
WLCSP usually consists of four parts: Silicon Die, Re-passivation, UBM, and bump.
The current challenges of WLCSP packaging are mainly:
1. Uniformity, consistency and reliability: WLCSP needs to be packaged and tested on a whole wafer, and then cut into dies after completion. The uniformity and consistency of the dies need to be maintained throughout the process.
2. Structural complexity: The WLCSP packaging structure is relatively complex. The more complex the structure, the more difficult the testing process.
3. Technology substitution: In advanced packaging, the packaging technologies with a higher share are FC, SiP, and 2.5D/3D, which account for more than 88% of the share, while WLCSP only accounts for about 5%. Although the share of advanced packaging has been steadily increasing due to major trends such as AI, high-performance computing, and automobiles, as downstream new markets and new technologies increasingly focus on equipment functions rather than technology, the three packaging technologies with a larger share still dominate the share of advanced packaging.
Globally, there are three types of WLCSP companies: OAST, IDM, and Foundry. Among them, OAST dominates the WLCSP packaging market. The core enterprises mainly include ASE, Amkor, JCET Group, etc., and the top 3 account for more than 40%.
This report is a detailed and comprehensive analysis for global Wafer Level Chip Scale Packaging (WLCSP) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Wafer Level Chip Scale Packaging (WLCSP) market size and forecasts, in consumption value ($ Million), sales quantity (Million Units), and average selling prices (USD/K Unit), 2020-2031
Global Wafer Level Chip Scale Packaging (WLCSP) market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Million Units), and average selling prices (USD/K Unit), 2020-2031
Global Wafer Level Chip Scale Packaging (WLCSP) market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Million Units), and average selling prices (USD/K Unit), 2020-2031
Global Wafer Level Chip Scale Packaging (WLCSP) market shares of main players, shipments in revenue ($ Million), sales quantity (Million Units), and ASP (USD/K Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Wafer Level Chip Scale Packaging (WLCSP)
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Wafer Level Chip Scale Packaging (WLCSP) market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Amkor, JCET, ASE, Powertech Technology Inc, Nepes, SPIL, Tianshui Huatian Technology, Tongfu Microelectronics, Macronix, CHIPBOND, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Wafer Level Chip Scale Packaging (WLCSP) market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Fan-In WLCSP
Fan-Out WLCSP
Market segment by Application
WiFi and Bluetooth
PMIC
Flash/EEPROM
RF
Audio Codec
Driver, Display and Wireless Charging IC
NFC Controller
Others
Major players covered
Amkor
JCET
ASE
Powertech Technology Inc
Nepes
SPIL
Tianshui Huatian Technology
Tongfu Microelectronics
Macronix
CHIPBOND
China Wafer Level CSP Co., Ltd
Xintec Inc
SJ Semiconductor
Suzhou Keyang Semiconductor
Raytek Semiconductor
ChipMOS
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Level Chip Scale Packaging (WLCSP) product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Level Chip Scale Packaging (WLCSP), with price, sales quantity, revenue, and global market share of Wafer Level Chip Scale Packaging (WLCSP) from 2020 to 2025.
Chapter 3, the Wafer Level Chip Scale Packaging (WLCSP) competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Level Chip Scale Packaging (WLCSP) breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Wafer Level Chip Scale Packaging (WLCSP) market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Level Chip Scale Packaging (WLCSP).
Chapter 14 and 15, to describe Wafer Level Chip Scale Packaging (WLCSP) sales channel, distributors, customers, research findings and conclusion.
Table of Contents
133 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Wafer Level Chip Scale Packaging (WLCSP) by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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