Global Wafer Laser Stealth Dicing Machine Supply, Demand and Key Producers, 2026-2032

The global Wafer Laser Stealth Dicing Machine market size is expected to reach $ 104 million by 2032, rising at a market growth of 5.6% CAGR during the forecast period (2026-2032).

Wafer laser stealth dicing machine is a cutting equipment that uses laser stealth dicing technology. Stealth Dicing technology is a laser dicing technology that uses lasers, which has such features as the "completely dry process", "no kerf loss", "no chipping", "high bending strength" and the like. Stealth Dicing technology is a technology that focuses a laser beam of a wavelength that permeates through materials, focus internally and forms a starting point for cracking the wafer, then applies external stress to the wafer, separating it. The process is comprised primarily of two parts, namely the "laser irradiation process" in which the SD layer is formed to crack the wafer interior and the "expansion process" for separating the wafer.

The global top 3 players of Wafer Laser Stealth Dicing Machine are DISCO Corporation, Han's Laser and Wuhan Huagong Laser, with about 73% market shares. Asia-Pacific is the largest market, has a share about 82%, followed by North America, with share 13%. In terms of product type, fully-automatic is the largest segment, occupied for a share of 90%.

This report studies the global Wafer Laser Stealth Dicing Machine production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Wafer Laser Stealth Dicing Machine and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Wafer Laser Stealth Dicing Machine that contribute to its increasing demand across many markets.

Highlights and key features of the study

Global Wafer Laser Stealth Dicing Machine total production and demand, 2021-2032, (Units)

Global Wafer Laser Stealth Dicing Machine total production value, 2021-2032, (USD Million)

Global Wafer Laser Stealth Dicing Machine production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Units), (based on production site)

Global Wafer Laser Stealth Dicing Machine consumption by region & country, CAGR, 2021-2032 & (Units)

U.S. VS China: Wafer Laser Stealth Dicing Machine domestic production, consumption, key domestic manufacturers and share

Global Wafer Laser Stealth Dicing Machine production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Units)

Global Wafer Laser Stealth Dicing Machine production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Units)

Global Wafer Laser Stealth Dicing Machine production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Units)

This report profiles key players in the global Wafer Laser Stealth Dicing Machine market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DISCO Corporation, Tokyo Seimitsu, Henan General Intelligent, Suzhou Laser Technology, Suzhou Delphi Laser, Suzhou Cowin, Han's Laser, Wuhan Huagong Laser, Wuhan Dr Laser Technology, Suzhou Maxwell Technologies, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Wafer Laser Stealth Dicing Machine market

Detailed Segmentation:

Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (K US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.

Global Wafer Laser Stealth Dicing Machine Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global Wafer Laser Stealth Dicing Machine Market, Segmentation by Type:
Fully-automatic
Semi-automatic

Global Wafer Laser Stealth Dicing Machine Market, Segmentation by Application:
Foundry
IDM
Packaging and Testing
LED Industry
PV Industry

Companies Profiled:
DISCO Corporation
Tokyo Seimitsu
Henan General Intelligent
Suzhou Laser Technology
Suzhou Delphi Laser
Suzhou Cowin
Han's Laser
Wuhan Huagong Laser
Wuhan Dr Laser Technology
Suzhou Maxwell Technologies

Key Questions Answered:

1. How big is the global Wafer Laser Stealth Dicing Machine market?

2. What is the demand of the global Wafer Laser Stealth Dicing Machine market?

3. What is the year over year growth of the global Wafer Laser Stealth Dicing Machine market?

4. What is the production and production value of the global Wafer Laser Stealth Dicing Machine market?

5. Who are the key producers in the global Wafer Laser Stealth Dicing Machine market?

6. What are the growth factors driving the market demand? Show more