Global Wafer Grinding Equipment Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Wafer Grinding Equipment market size was valued at US$ 1259 million in 2024 and is forecast to a readjusted size of USD 2027 million by 2031 with a CAGR of 6.9% during review period.
Wafer Grinding Equipment refers to machinery used in the semiconductor manufacturing process for grinding and reducing the thickness of semiconductor wafers. This equipment helps to achieve precise thickness control and smooth surface finishing by removing material from the wafer's surface. The grinding process is crucial for wafer thinning, which is necessary for the manufacturing of microelectronic devices, sensors, and integrated circuits. Wafer grinding equipment is often used after the wafer has been processed for front-end fabrication, before it undergoes further packaging or testing. This equipment typically includes a grinding wheel, a slurry system for lubrication, and automated control systems to ensure high precision.
This report covers Wafer Edge Grinder and Wafer Surface Grinder in Semiconductor and Photovoltaic field.
The Wafer Grinding Equipments market, primarily driven by the increasing demand for precision and efficiency in semiconductor manufacturing, is growing rapidly across the globe.
Geographically, the Asia-Pacific (APAC) region holds the largest consumption share, accounting for about 78% of the global market, driven by the robust semiconductor manufacturing ecosystem in countries like China, Japan, South Korea, and Taiwan.
Manufacturers, like Disco, TOKYO SEIMITSU, Okamoto Semiconductor Equipment Division, CETC, G&N, etc. are well-known for the wonderful performance of their Wafer Grinding Equipment and related services. The top five players account for about 90% of the revenue market in 2024.
Market Drivers:
Technological Advancements in Semiconductor Manufacturing: As the demand for smaller, more powerful, and energy-efficient electronic devices grows, semiconductor manufacturers are continuously advancing their processes to meet these demands. This includes the need for thinner, more precisely engineered wafers, driving the demand for high-performance Wafer Grinding Equipments. Fully automatic Wafer Grinding Equipments, known for their precision and ability to handle larger volumes, are particularly in demand to meet these stringent manufacturing requirements.
Miniaturization of Electronic Devices: The global trend towards smaller, more compact electronic devices—such as smartphones, wearables, and IoT devices—requires thinner semiconductor wafers. As a result, there is a growing demand for wafer thinning solutions that can maintain high quality while reducing thickness. Fully automatic Wafer Grinding Equipments are the preferred solution, as they offer high precision and productivity.
Surge in Semiconductor Demand: The semiconductor industry is experiencing significant growth, driven by the rise in demand for various electronic applications, including computing, communication, and automotive systems. As the industry's focus shifts towards advanced technology nodes, the demand for larger wafers, particularly 300mm wafers, is growing. These trends are contributing to the expansion of the Wafer Grinding Equipment market, especially in regions such as APAC, which dominate semiconductor manufacturing.
Growth in 300mm Wafer Demand: The 300mm wafer segment is the most significant application for Wafer Grinding Equipments, accounting for 83% of the global market share. Larger wafers allow for more chips to be processed at once, reducing manufacturing costs per chip. This increase in 300mm wafer production is a significant growth factor for the Wafer Grinding Equipment market, as manufacturers need specialized equipment to handle the larger wafers efficiently.
Shift Towards Fully Automated Solutions: Fully automated Wafer Grinding Equipments are gaining popularity due to their higher efficiency, reduced labor costs, and the ability to maintain consistency across large batches. As semiconductor manufacturers continue to scale production, automation becomes increasingly essential to meet high-volume production requirements without compromising quality.
Market Restraints:
Despite the strong growth, several factors may restrain the expansion of the Wafer Grinding Equipment market:
High Initial Investment: Fully automatic Wafer Grinding Equipments come with a high initial cost, which could be prohibitive for smaller semiconductor manufacturers or emerging markets with limited capital. Additionally, the cost of maintaining and upgrading these high-tech machines can be a barrier for smaller players who may prefer less expensive, semi-automatic models.
Technological Complexity: Fully automatic Wafer Grinding Equipments are highly complex systems that require specialized knowledge to operate, program, and maintain. This could limit the adoption of such systems in regions with a shortage of skilled technicians and engineers. The technical complexity can also result in extended downtime during maintenance or troubleshooting, affecting overall production efficiency.
This report is a detailed and comprehensive analysis for global Wafer Grinding Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Wafer Grinding Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Wafer Grinding Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Wafer Grinding Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Wafer Grinding Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K USD/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Wafer Grinding Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Wafer Grinding Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Wafer Grinding Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Wafer Edge Grinder
Wafer Surface Grinder
Market segment by Application
Semiconductor
Photovoltaic
Major players covered
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam
TSD
Engis Corporation
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Grinding Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Grinding Equipment, with price, sales quantity, revenue, and global market share of Wafer Grinding Equipment from 2020 to 2025.
Chapter 3, the Wafer Grinding Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Grinding Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Wafer Grinding Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Grinding Equipment.
Chapter 14 and 15, to describe Wafer Grinding Equipment sales channel, distributors, customers, research findings and conclusion.
Wafer Grinding Equipment refers to machinery used in the semiconductor manufacturing process for grinding and reducing the thickness of semiconductor wafers. This equipment helps to achieve precise thickness control and smooth surface finishing by removing material from the wafer's surface. The grinding process is crucial for wafer thinning, which is necessary for the manufacturing of microelectronic devices, sensors, and integrated circuits. Wafer grinding equipment is often used after the wafer has been processed for front-end fabrication, before it undergoes further packaging or testing. This equipment typically includes a grinding wheel, a slurry system for lubrication, and automated control systems to ensure high precision.
This report covers Wafer Edge Grinder and Wafer Surface Grinder in Semiconductor and Photovoltaic field.
The Wafer Grinding Equipments market, primarily driven by the increasing demand for precision and efficiency in semiconductor manufacturing, is growing rapidly across the globe.
Geographically, the Asia-Pacific (APAC) region holds the largest consumption share, accounting for about 78% of the global market, driven by the robust semiconductor manufacturing ecosystem in countries like China, Japan, South Korea, and Taiwan.
Manufacturers, like Disco, TOKYO SEIMITSU, Okamoto Semiconductor Equipment Division, CETC, G&N, etc. are well-known for the wonderful performance of their Wafer Grinding Equipment and related services. The top five players account for about 90% of the revenue market in 2024.
Market Drivers:
Technological Advancements in Semiconductor Manufacturing: As the demand for smaller, more powerful, and energy-efficient electronic devices grows, semiconductor manufacturers are continuously advancing their processes to meet these demands. This includes the need for thinner, more precisely engineered wafers, driving the demand for high-performance Wafer Grinding Equipments. Fully automatic Wafer Grinding Equipments, known for their precision and ability to handle larger volumes, are particularly in demand to meet these stringent manufacturing requirements.
Miniaturization of Electronic Devices: The global trend towards smaller, more compact electronic devices—such as smartphones, wearables, and IoT devices—requires thinner semiconductor wafers. As a result, there is a growing demand for wafer thinning solutions that can maintain high quality while reducing thickness. Fully automatic Wafer Grinding Equipments are the preferred solution, as they offer high precision and productivity.
Surge in Semiconductor Demand: The semiconductor industry is experiencing significant growth, driven by the rise in demand for various electronic applications, including computing, communication, and automotive systems. As the industry's focus shifts towards advanced technology nodes, the demand for larger wafers, particularly 300mm wafers, is growing. These trends are contributing to the expansion of the Wafer Grinding Equipment market, especially in regions such as APAC, which dominate semiconductor manufacturing.
Growth in 300mm Wafer Demand: The 300mm wafer segment is the most significant application for Wafer Grinding Equipments, accounting for 83% of the global market share. Larger wafers allow for more chips to be processed at once, reducing manufacturing costs per chip. This increase in 300mm wafer production is a significant growth factor for the Wafer Grinding Equipment market, as manufacturers need specialized equipment to handle the larger wafers efficiently.
Shift Towards Fully Automated Solutions: Fully automated Wafer Grinding Equipments are gaining popularity due to their higher efficiency, reduced labor costs, and the ability to maintain consistency across large batches. As semiconductor manufacturers continue to scale production, automation becomes increasingly essential to meet high-volume production requirements without compromising quality.
Market Restraints:
Despite the strong growth, several factors may restrain the expansion of the Wafer Grinding Equipment market:
High Initial Investment: Fully automatic Wafer Grinding Equipments come with a high initial cost, which could be prohibitive for smaller semiconductor manufacturers or emerging markets with limited capital. Additionally, the cost of maintaining and upgrading these high-tech machines can be a barrier for smaller players who may prefer less expensive, semi-automatic models.
Technological Complexity: Fully automatic Wafer Grinding Equipments are highly complex systems that require specialized knowledge to operate, program, and maintain. This could limit the adoption of such systems in regions with a shortage of skilled technicians and engineers. The technical complexity can also result in extended downtime during maintenance or troubleshooting, affecting overall production efficiency.
This report is a detailed and comprehensive analysis for global Wafer Grinding Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Wafer Grinding Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Wafer Grinding Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Wafer Grinding Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Wafer Grinding Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K USD/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Wafer Grinding Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Wafer Grinding Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Wafer Grinding Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Wafer Edge Grinder
Wafer Surface Grinder
Market segment by Application
Semiconductor
Photovoltaic
Major players covered
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam
TSD
Engis Corporation
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Grinding Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Grinding Equipment, with price, sales quantity, revenue, and global market share of Wafer Grinding Equipment from 2020 to 2025.
Chapter 3, the Wafer Grinding Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Grinding Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Wafer Grinding Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Grinding Equipment.
Chapter 14 and 15, to describe Wafer Grinding Equipment sales channel, distributors, customers, research findings and conclusion.
Table of Contents
120 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Wafer Grinding Equipment by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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