Global Wafer Edge Inspection Equipment Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Wafer Edge Inspection Equipment market size was valued at US$ 128 million in 2024 and is forecast to a readjusted size of USD 195 million by 2031 with a CAGR of 6.0% during review period.

Wafer edge inspection equipment is used in semiconductor manufacturing to detect defects and anomalies on the edges of silicon wafers. These defects can include chips, cracks, notches, or contamination, which can negatively impact subsequent processing steps and device yield. These systems typically employ optical imaging, laser scanning, or other non-destructive techniques to capture high-resolution images or data of the wafer edge. Automated analysis software then identifies and classifies defects based on pre-defined criteria.

The industry trend for wafer edge inspection equipment is driven by the increasing complexity of semiconductor devices, shrinking feature sizes, and the growing demand for higher yields. Key trends include:

Higher resolution and sensitivity: There's a constant drive for higher resolution imaging and more sensitive detection methods to identify smaller and more subtle edge defects. This includes advancements in optical microscopy, laser technology, and image processing algorithms.

3D edge profiling: Traditional 2d edge inspection is being complemented by 3D profiling techniques to provide more comprehensive information about the edge shape and topography. This enables the detection of more complex defects and improves defect classification.

Integration with metrology and process control: Wafer edge inspection is increasingly being integrated with other metrology tools and process control systems to provide real-time feedback and enable closed-loop process optimization.

Automated defect classification and review: Advanced machine learning and artificial intelligence algorithms are being implemented to automate defect classification and review, reducing manual inspection time and improving accuracy.

Handling of thinner wafers and new substrates: As wafer thickness decreases and new substrate materials are introduced (e.G., silicon carbide, gallium nitride), inspection equipment needs to be adapted to handle these changes and maintain high inspection accuracy.

Increased throughput and automation: To meet the demands of high-volume manufacturing, there's a need for wafer edge inspection systems with higher throughput and greater automation, minimizing inspection time and maximizing production efficiency.

This report is a detailed and comprehensive analysis for global Wafer Edge Inspection Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Wafer Edge Inspection Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031

Global Wafer Edge Inspection Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031

Global Wafer Edge Inspection Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031

Global Wafer Edge Inspection Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (US$/Unit), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Wafer Edge Inspection Equipment

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Wafer Edge Inspection Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Lasertec, Optima, Hologenix, Unity Semiconductor, Zhejiang Xinhui, Avant Semiconductor Equipment, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Wafer Edge Inspection Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type

Full Automatic

Semi-Automatic

Market segment by Application

6 Inches

8 Inches

12 Inches

Major players covered

Lasertec

Optima

Hologenix

Unity Semiconductor

Zhejiang Xinhui

Avant Semiconductor Equipment

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Wafer Edge Inspection Equipment product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Wafer Edge Inspection Equipment, with price, sales quantity, revenue, and global market share of Wafer Edge Inspection Equipment from 2020 to 2025.

Chapter 3, the Wafer Edge Inspection Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Wafer Edge Inspection Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Wafer Edge Inspection Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Edge Inspection Equipment.

Chapter 14 and 15, to describe Wafer Edge Inspection Equipment sales channel, distributors, customers, research findings and conclusion.