Global Wafer Dicing Tape Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Wafer Dicing Tape market size was valued at US$ 457 million in 2024 and is forecast to a readjusted size of USD 848 million by 2031 with a CAGR of 8.4% during review period.
Dicing Tape is a type of adhesive tape used in semiconductor manufacturing, also known as cutting tape.
This report studies the semiconductor wafer dicing tapes, include the UV and Non-UV tapes used in waer dicing processing.
Current the key manufacturers of semiconductor wafer tapes worldwide mainly include Mitsui Chemicals, LINTEC Corporation, Furukawa Electric, Denka, Nitto Denko Corporation, Maxell Sliontec and Sekisui Chemical. In 2023, the top five manufacturers in the world accounted for about 82.5% of the market share. Chinese local manufacturers of wafer tapes are currently mainly in the verification and small batch stages. Representative companies include Shanghai Guke Adhesive Tape Technology, Plusco Tech, Taicang Zhanxin Adhesive Material, Cybrid Technologies, ZZSM, BYE POLYMER MATERIAL, ZHONGSHAN CROWN ADHESIVE PRODUCTS, Yantai Darbond Technology and Sunliky New Material Technology. It is expected that in the next few years, Chinese local companies will gradually grow and occupy a higher share in the Chinese market.
This report is a detailed and comprehensive analysis for global Wafer Dicing Tape market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Peel-off Method and by Base Film. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Wafer Dicing Tape market size and forecasts, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2020-2031
Global Wafer Dicing Tape market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2020-2031
Global Wafer Dicing Tape market size and forecasts, by Peel-off Method and by Base Film, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2020-2031
Global Wafer Dicing Tape market shares of main players, shipments in revenue ($ Million), sales quantity (K Sqm), and ASP (US$/Sq m), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Wafer Dicing Tape
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Wafer Dicing Tape market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsui Chemicals, LINTEC Corporation, Denka, Nitto Denko Corporation, Furukawa Electric, Sekisui Chemical, Maxell Sliontec, Resonac Corporation, Sumitomo Bakelite Company, D&X Co., Ltd, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Wafer Dicing Tape market is split by Peel-off Method and by Base Film. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Peel-off Method, and by Base Film in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Peel-off Method
UV Tape
Non-UV Tape
Market segment by Base Film
PO Base Film Tape
PVC Base Film Tape
PET Base Film Tape
Major players covered
Mitsui Chemicals
LINTEC Corporation
Denka
Nitto Denko Corporation
Furukawa Electric
Sekisui Chemical
Maxell Sliontec
Resonac Corporation
Sumitomo Bakelite Company
D&X Co., Ltd
KGK Chemical Corporation
AI Technology, Inc. (AIT)
Ultron System
Daehyun ST
Solar Plus Company
Alliance Material Co., Ltd (AMC)
3M
Shanghai Guke Adhesive Tape Technology
Plusco Tech
Taicang Zhanxin Adhesive Material
Cybrid Technologies
ZZSM
BYE POLYMER MATERIAL
ZHONGSHAN CROWN ADHESIVE PRODUCTS
Yantai Darbond Technology
Sunliky New Material Technology
GTA Material
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Dicing Tape product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Dicing Tape, with price, sales quantity, revenue, and global market share of Wafer Dicing Tape from 2020 to 2025.
Chapter 3, the Wafer Dicing Tape competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Dicing Tape breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Peel-off Method and by Base Film, with sales market share and growth rate by Peel-off Method, by Base Film, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Wafer Dicing Tape market forecast, by regions, by Peel-off Method, and by Base Film, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Dicing Tape.
Chapter 14 and 15, to describe Wafer Dicing Tape sales channel, distributors, customers, research findings and conclusion.
Dicing Tape is a type of adhesive tape used in semiconductor manufacturing, also known as cutting tape.
This report studies the semiconductor wafer dicing tapes, include the UV and Non-UV tapes used in waer dicing processing.
Current the key manufacturers of semiconductor wafer tapes worldwide mainly include Mitsui Chemicals, LINTEC Corporation, Furukawa Electric, Denka, Nitto Denko Corporation, Maxell Sliontec and Sekisui Chemical. In 2023, the top five manufacturers in the world accounted for about 82.5% of the market share. Chinese local manufacturers of wafer tapes are currently mainly in the verification and small batch stages. Representative companies include Shanghai Guke Adhesive Tape Technology, Plusco Tech, Taicang Zhanxin Adhesive Material, Cybrid Technologies, ZZSM, BYE POLYMER MATERIAL, ZHONGSHAN CROWN ADHESIVE PRODUCTS, Yantai Darbond Technology and Sunliky New Material Technology. It is expected that in the next few years, Chinese local companies will gradually grow and occupy a higher share in the Chinese market.
This report is a detailed and comprehensive analysis for global Wafer Dicing Tape market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Peel-off Method and by Base Film. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Wafer Dicing Tape market size and forecasts, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2020-2031
Global Wafer Dicing Tape market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2020-2031
Global Wafer Dicing Tape market size and forecasts, by Peel-off Method and by Base Film, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2020-2031
Global Wafer Dicing Tape market shares of main players, shipments in revenue ($ Million), sales quantity (K Sqm), and ASP (US$/Sq m), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Wafer Dicing Tape
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Wafer Dicing Tape market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsui Chemicals, LINTEC Corporation, Denka, Nitto Denko Corporation, Furukawa Electric, Sekisui Chemical, Maxell Sliontec, Resonac Corporation, Sumitomo Bakelite Company, D&X Co., Ltd, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Wafer Dicing Tape market is split by Peel-off Method and by Base Film. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Peel-off Method, and by Base Film in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Peel-off Method
UV Tape
Non-UV Tape
Market segment by Base Film
PO Base Film Tape
PVC Base Film Tape
PET Base Film Tape
Major players covered
Mitsui Chemicals
LINTEC Corporation
Denka
Nitto Denko Corporation
Furukawa Electric
Sekisui Chemical
Maxell Sliontec
Resonac Corporation
Sumitomo Bakelite Company
D&X Co., Ltd
KGK Chemical Corporation
AI Technology, Inc. (AIT)
Ultron System
Daehyun ST
Solar Plus Company
Alliance Material Co., Ltd (AMC)
3M
Shanghai Guke Adhesive Tape Technology
Plusco Tech
Taicang Zhanxin Adhesive Material
Cybrid Technologies
ZZSM
BYE POLYMER MATERIAL
ZHONGSHAN CROWN ADHESIVE PRODUCTS
Yantai Darbond Technology
Sunliky New Material Technology
GTA Material
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Dicing Tape product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Dicing Tape, with price, sales quantity, revenue, and global market share of Wafer Dicing Tape from 2020 to 2025.
Chapter 3, the Wafer Dicing Tape competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Dicing Tape breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Peel-off Method and by Base Film, with sales market share and growth rate by Peel-off Method, by Base Film, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Wafer Dicing Tape market forecast, by regions, by Peel-off Method, and by Base Film, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Dicing Tape.
Chapter 14 and 15, to describe Wafer Dicing Tape sales channel, distributors, customers, research findings and conclusion.
Table of Contents
175 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Wafer Dicing Tape by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Peel-off Method
- 6 Market Segment by Base Film
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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