Global Vacuum Reflow Soldering Ovens Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Vacuum Reflow Soldering Ovens market size was valued at US$ 131 million in 2024 and is forecast to a readjusted size of USD 179 million by 2031 with a CAGR of 4.7% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
In the vacuum reflow process, the vacuum stage which removes the pores from the liquid solder follows the actual melting process. In contrast, vacuum reflow oven systems have shown to significantly reduce void levels of all types of electronic components, typically below 5%In the vacuum reflow process, the vacuum stage which removes the pores from the liquid solder follows the actual melting process. In contrast, vacuum reflow oven systems have shown to significantly reduce void levels of all types of electronic components, typically below 5%.Vacuum reflow ovens offer a major advantage in electronics manufacturing by creating a low-pressure environment during the soldering process, which effectively eliminates air pockets and voids in solder joints, resulting in improved mechanical strength, enhanced heat dissipation, and higher electrical reliability—especially crucial for high-density, fine-pitch components, automotive electronics, and power devices where long-term performance and durability are critical.
Global key players of vacuum reflow soldering ovens include Rehm Thermal Systems, Kurtz Ersa, Heller Industries, etc. The top five players hold a share over 65%. Asia-Pacific is the largest market, has a share about 69%, followed by North America and Europe, with share 13% and 12%, separately.
The market drivers for Vacuum Reflow Soldering Ovens include the growing demand for high-reliability electronics in sectors like aerospace, automotive, and medical devices; the trend towards miniaturization of electrical components that requires precise soldering methods; the implementation of advanced manufacturing technologies such as Industry 4.0 in the electronics manufacturing industry; the need to meet stringent quality requirements like IPC-A-610; the increased use of lead-free solder alloys due to environmental concerns; and the expansion of the electronics industry in emerging economies, all of which drive the demand for these ovens to ensure high-quality and dependable solder joints for printed circuit boards.
Power semiconductors such as IGBT, SiC, and MOSFET are widely used in electric vehicles, and these devices have extremely high requirements for soldering quality and thermal conductivity. Vacuum reflow soldering can effectively remove solder joint pores, reduce thermal resistance, and improve reliability. It is an important process equipment for high-power device packaging.
Commercial aerospace (such as satellites, rockets, and payload electronic modules) have extremely high requirements for the reliability and thermal shock resistance of electronic components. The solder joints must be free of pores, cold solder joints, and have high thermal conductivity to ensure stable operation in extreme environments (vacuum, radiation, and drastic temperature differences). Vacuum reflow soldering is the core process to meet this demand. SpaceX, Blue Origin, Starlink and other projects are promoting the transition from military-grade small batches to industrial-grade large batch manufacturing, and welding equipment must also develop from experimental level to batch, automated, and highly reliable. Vacuum reflow soldering is located at the technical intersection of "high reliability + industrialization".
This report is a detailed and comprehensive analysis for global Vacuum Reflow Soldering Ovens market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Vacuum Reflow Soldering Ovens market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Vacuum Reflow Soldering Ovens market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Vacuum Reflow Soldering Ovens market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Vacuum Reflow Soldering Ovens market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Vacuum Reflow Soldering Ovens
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Vacuum Reflow Soldering Ovens market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Rehm Thermal Systems, Kurtz Ersa, Heller Industries, SMT Wertheim, BTU International, Shenzhen JT Automation, HIRATA Corporation, Senju Metal Industry Co., Ltd, ATV Technologie GmbH, 3S Silicon, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Vacuum Reflow Soldering Ovens market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Less than 10 Heating Zones
10-20 Heating Zones
More than 20 Heating Zones
Market segment by Application
Telecommunication
Consumer Electronics
Automotive
Aerospace
Others
Major players covered
Rehm Thermal Systems
Kurtz Ersa
Heller Industries
SMT Wertheim
BTU International
Shenzhen JT Automation
HIRATA Corporation
Senju Metal Industry Co., Ltd
ATV Technologie GmbH
3S Silicon
EIGHTECH TECTRON
Origin Co., Ltd.
Zhongke Comrades Technology Co., Ltd
PINK GmbH
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Vacuum Reflow Soldering Ovens product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Vacuum Reflow Soldering Ovens, with price, sales quantity, revenue, and global market share of Vacuum Reflow Soldering Ovens from 2020 to 2025.
Chapter 3, the Vacuum Reflow Soldering Ovens competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Vacuum Reflow Soldering Ovens breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Vacuum Reflow Soldering Ovens market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Vacuum Reflow Soldering Ovens.
Chapter 14 and 15, to describe Vacuum Reflow Soldering Ovens sales channel, distributors, customers, research findings and conclusion.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
In the vacuum reflow process, the vacuum stage which removes the pores from the liquid solder follows the actual melting process. In contrast, vacuum reflow oven systems have shown to significantly reduce void levels of all types of electronic components, typically below 5%In the vacuum reflow process, the vacuum stage which removes the pores from the liquid solder follows the actual melting process. In contrast, vacuum reflow oven systems have shown to significantly reduce void levels of all types of electronic components, typically below 5%.Vacuum reflow ovens offer a major advantage in electronics manufacturing by creating a low-pressure environment during the soldering process, which effectively eliminates air pockets and voids in solder joints, resulting in improved mechanical strength, enhanced heat dissipation, and higher electrical reliability—especially crucial for high-density, fine-pitch components, automotive electronics, and power devices where long-term performance and durability are critical.
Global key players of vacuum reflow soldering ovens include Rehm Thermal Systems, Kurtz Ersa, Heller Industries, etc. The top five players hold a share over 65%. Asia-Pacific is the largest market, has a share about 69%, followed by North America and Europe, with share 13% and 12%, separately.
The market drivers for Vacuum Reflow Soldering Ovens include the growing demand for high-reliability electronics in sectors like aerospace, automotive, and medical devices; the trend towards miniaturization of electrical components that requires precise soldering methods; the implementation of advanced manufacturing technologies such as Industry 4.0 in the electronics manufacturing industry; the need to meet stringent quality requirements like IPC-A-610; the increased use of lead-free solder alloys due to environmental concerns; and the expansion of the electronics industry in emerging economies, all of which drive the demand for these ovens to ensure high-quality and dependable solder joints for printed circuit boards.
Power semiconductors such as IGBT, SiC, and MOSFET are widely used in electric vehicles, and these devices have extremely high requirements for soldering quality and thermal conductivity. Vacuum reflow soldering can effectively remove solder joint pores, reduce thermal resistance, and improve reliability. It is an important process equipment for high-power device packaging.
Commercial aerospace (such as satellites, rockets, and payload electronic modules) have extremely high requirements for the reliability and thermal shock resistance of electronic components. The solder joints must be free of pores, cold solder joints, and have high thermal conductivity to ensure stable operation in extreme environments (vacuum, radiation, and drastic temperature differences). Vacuum reflow soldering is the core process to meet this demand. SpaceX, Blue Origin, Starlink and other projects are promoting the transition from military-grade small batches to industrial-grade large batch manufacturing, and welding equipment must also develop from experimental level to batch, automated, and highly reliable. Vacuum reflow soldering is located at the technical intersection of "high reliability + industrialization".
This report is a detailed and comprehensive analysis for global Vacuum Reflow Soldering Ovens market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Vacuum Reflow Soldering Ovens market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Vacuum Reflow Soldering Ovens market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Vacuum Reflow Soldering Ovens market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Vacuum Reflow Soldering Ovens market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Vacuum Reflow Soldering Ovens
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Vacuum Reflow Soldering Ovens market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Rehm Thermal Systems, Kurtz Ersa, Heller Industries, SMT Wertheim, BTU International, Shenzhen JT Automation, HIRATA Corporation, Senju Metal Industry Co., Ltd, ATV Technologie GmbH, 3S Silicon, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Vacuum Reflow Soldering Ovens market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Less than 10 Heating Zones
10-20 Heating Zones
More than 20 Heating Zones
Market segment by Application
Telecommunication
Consumer Electronics
Automotive
Aerospace
Others
Major players covered
Rehm Thermal Systems
Kurtz Ersa
Heller Industries
SMT Wertheim
BTU International
Shenzhen JT Automation
HIRATA Corporation
Senju Metal Industry Co., Ltd
ATV Technologie GmbH
3S Silicon
EIGHTECH TECTRON
Origin Co., Ltd.
Zhongke Comrades Technology Co., Ltd
PINK GmbH
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Vacuum Reflow Soldering Ovens product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Vacuum Reflow Soldering Ovens, with price, sales quantity, revenue, and global market share of Vacuum Reflow Soldering Ovens from 2020 to 2025.
Chapter 3, the Vacuum Reflow Soldering Ovens competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Vacuum Reflow Soldering Ovens breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Vacuum Reflow Soldering Ovens market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Vacuum Reflow Soldering Ovens.
Chapter 14 and 15, to describe Vacuum Reflow Soldering Ovens sales channel, distributors, customers, research findings and conclusion.
Table of Contents
116 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Vacuum Reflow Soldering Ovens by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
Pricing
Currency Rates
Questions or Comments?
Our team has the ability to search within reports to verify it suits your needs. We can also help maximize your budget by finding sections of reports you can purchase.
