Global Underfills for Semiconductor Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Underfills for Semiconductor market size was valued at US$ 284 million in 2024 and is forecast to a readjusted size of USD 469 million by 2031 with a CAGR of 6.9% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
Underfills for Semiconductor is a key packaging material for connecting chips to substrates. Its core functions include: filling the gap between the chip and the substrate through capillary action to disperse surface stress, effectively alleviating the internal stress caused by the difference in thermal expansion coefficients between the chip, solder and substrate; at the same time, forming a physical protective layer to enhance the impact resistance of the solder balls, significantly improving the reliability of the chip under drop shock and thermal cycling conditions.
From the perspective of application scenarios, underfill can be divided into two categories: board-level packaging applications (PCB) and wafer/panel-level packaging applications. Among them, BGA Underfill is the leading field in the field of board-level packaging, which is mainly used to achieve the gap filling of the solder ball array between the packaging substrate and the PCB circuit board, and its process accuracy is required to reach the millimeter level; while the chip-level packaging field corresponds to the flip-chip underfill (Flip-Chip Underfill), which is specially used for the precision filling of the micro-bump array between the chip and the packaging substrate, and the process window requires micron-level accuracy.
In the Underfill market, the leading companies are mainly from Japan and Europe, such as NAMICS, Henkel, RESONAC, Nagase ChemteX Corporation, Shin-Etsu Chemical, Zymet, MacDermid Alpha, etc. There are certain differences in the applications faced by different companies. In the semiconductor (chip-level packaging) market, the mainstream company is Japan's NAMICS, and the Chinese local company is Darbond Technology. In the PCB field, the core company is Henkel.
This report is a detailed and comprehensive analysis for global Underfills for Semiconductor market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Underfills for Semiconductor market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Underfills for Semiconductor market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Underfills for Semiconductor market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Underfills for Semiconductor market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Underfills for Semiconductor
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Underfills for Semiconductor market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include NAMICS, Henkel, RESONAC, Nagase ChemteX Corporation, Shin-Etsu Chemical, Panasonic, MacDermid Alpha, Sunstar, Fuji Chemical, Zymet, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Underfills for Semiconductor market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
PLP Underfill
WLP Underfill
Market segment by Application
Consumer Electronics
Automotive
Telecom & Infrastructure
Medical
Industrial
Aerospace & Defense
Others
Major players covered
NAMICS
Henkel
RESONAC
Nagase ChemteX Corporation
Shin-Etsu Chemical
Panasonic
MacDermid Alpha
Sunstar
Fuji Chemical
Zymet
Shenzhen Dover
Threebond
AIM Solder
Darbond
Master Bond
Jiangsu HHCK Advanced Materials Co.,Ltd
Parker Hannifin
Asec Co., Ltd.
Panacol-Elosol
United Adhesives
Henan Siny Optic-com Co., Ltd
Dongguan Hanstars
GTA Material
H.B.Fuller
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Underfills for Semiconductor product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Underfills for Semiconductor, with price, sales quantity, revenue, and global market share of Underfills for Semiconductor from 2020 to 2025.
Chapter 3, the Underfills for Semiconductor competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Underfills for Semiconductor breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Underfills for Semiconductor market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Underfills for Semiconductor.
Chapter 14 and 15, to describe Underfills for Semiconductor sales channel, distributors, customers, research findings and conclusion.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
Underfills for Semiconductor is a key packaging material for connecting chips to substrates. Its core functions include: filling the gap between the chip and the substrate through capillary action to disperse surface stress, effectively alleviating the internal stress caused by the difference in thermal expansion coefficients between the chip, solder and substrate; at the same time, forming a physical protective layer to enhance the impact resistance of the solder balls, significantly improving the reliability of the chip under drop shock and thermal cycling conditions.
From the perspective of application scenarios, underfill can be divided into two categories: board-level packaging applications (PCB) and wafer/panel-level packaging applications. Among them, BGA Underfill is the leading field in the field of board-level packaging, which is mainly used to achieve the gap filling of the solder ball array between the packaging substrate and the PCB circuit board, and its process accuracy is required to reach the millimeter level; while the chip-level packaging field corresponds to the flip-chip underfill (Flip-Chip Underfill), which is specially used for the precision filling of the micro-bump array between the chip and the packaging substrate, and the process window requires micron-level accuracy.
In the Underfill market, the leading companies are mainly from Japan and Europe, such as NAMICS, Henkel, RESONAC, Nagase ChemteX Corporation, Shin-Etsu Chemical, Zymet, MacDermid Alpha, etc. There are certain differences in the applications faced by different companies. In the semiconductor (chip-level packaging) market, the mainstream company is Japan's NAMICS, and the Chinese local company is Darbond Technology. In the PCB field, the core company is Henkel.
This report is a detailed and comprehensive analysis for global Underfills for Semiconductor market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Underfills for Semiconductor market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Underfills for Semiconductor market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Underfills for Semiconductor market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Underfills for Semiconductor market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Underfills for Semiconductor
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Underfills for Semiconductor market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include NAMICS, Henkel, RESONAC, Nagase ChemteX Corporation, Shin-Etsu Chemical, Panasonic, MacDermid Alpha, Sunstar, Fuji Chemical, Zymet, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Underfills for Semiconductor market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
PLP Underfill
WLP Underfill
Market segment by Application
Consumer Electronics
Automotive
Telecom & Infrastructure
Medical
Industrial
Aerospace & Defense
Others
Major players covered
NAMICS
Henkel
RESONAC
Nagase ChemteX Corporation
Shin-Etsu Chemical
Panasonic
MacDermid Alpha
Sunstar
Fuji Chemical
Zymet
Shenzhen Dover
Threebond
AIM Solder
Darbond
Master Bond
Jiangsu HHCK Advanced Materials Co.,Ltd
Parker Hannifin
Asec Co., Ltd.
Panacol-Elosol
United Adhesives
Henan Siny Optic-com Co., Ltd
Dongguan Hanstars
GTA Material
H.B.Fuller
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Underfills for Semiconductor product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Underfills for Semiconductor, with price, sales quantity, revenue, and global market share of Underfills for Semiconductor from 2020 to 2025.
Chapter 3, the Underfills for Semiconductor competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Underfills for Semiconductor breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Underfills for Semiconductor market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Underfills for Semiconductor.
Chapter 14 and 15, to describe Underfills for Semiconductor sales channel, distributors, customers, research findings and conclusion.
Table of Contents
157 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Underfills for Semiconductor by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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