Global Thinning Machine Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Thinning Machine market size was valued at US$ 890 million in 2024 and is forecast to a readjusted size of USD 1366 million by 2031 with a CAGR of 6.4% during review period.
Thinning Machine is mainly used for wafer surface processing of material segment and before integrated circuit packaging. The thinning machine removes the substrate material on the back of the wafer by grinding to meet the requirements of chip package thickness and surface roughness, and to improve the heat dissipation effect of the chip. Thinning to a certain thickness is beneficial to the later packaging process. The key palyers of thinning machines in the world include Disco and Tokyo Precision; their market share is about 75%. Japan and China are the main production areas of thinning machines, accounting for 56.46% and 20.47% respectively. The market share of fully automatic thinning machines accounts for about 68.31%, and the market share of 300mm wafer thinning machines accounts for about 81.44%.
In China market, the key players of Thinning Machine include Disco and TOKYO SEIMITSU, etc. The top two players hold a share over 80%. In terms of product type, Fully Automatic is the largest segment, occupied for a share of about 92%, and in terms of application, 300mm Wafer has a share about 80 percent.
This report is a detailed and comprehensive analysis for global Thinning Machine market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Thinning Machine market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031
Global Thinning Machine market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031
Global Thinning Machine market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031
Global Thinning Machine market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Thinning Machine
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Thinning Machine market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Shenzhen Fangda, Hunan Yujing Machine Industrial, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Thinning Machine market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Fully Automatic
Semi-Automatic
Market segment by Application
200mm Wafer
300mm Wafer
Others
Major players covered
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Shenzhen Fangda
Hunan Yujing Machine Industrial
SpeedFam
Hauhaiqingke
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Thinning Machine product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Thinning Machine, with price, sales quantity, revenue, and global market share of Thinning Machine from 2020 to 2025.
Chapter 3, the Thinning Machine competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Thinning Machine breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Thinning Machine market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Thinning Machine.
Chapter 14 and 15, to describe Thinning Machine sales channel, distributors, customers, research findings and conclusion.
Thinning Machine is mainly used for wafer surface processing of material segment and before integrated circuit packaging. The thinning machine removes the substrate material on the back of the wafer by grinding to meet the requirements of chip package thickness and surface roughness, and to improve the heat dissipation effect of the chip. Thinning to a certain thickness is beneficial to the later packaging process. The key palyers of thinning machines in the world include Disco and Tokyo Precision; their market share is about 75%. Japan and China are the main production areas of thinning machines, accounting for 56.46% and 20.47% respectively. The market share of fully automatic thinning machines accounts for about 68.31%, and the market share of 300mm wafer thinning machines accounts for about 81.44%.
In China market, the key players of Thinning Machine include Disco and TOKYO SEIMITSU, etc. The top two players hold a share over 80%. In terms of product type, Fully Automatic is the largest segment, occupied for a share of about 92%, and in terms of application, 300mm Wafer has a share about 80 percent.
This report is a detailed and comprehensive analysis for global Thinning Machine market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Thinning Machine market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031
Global Thinning Machine market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031
Global Thinning Machine market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031
Global Thinning Machine market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Thinning Machine
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Thinning Machine market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Shenzhen Fangda, Hunan Yujing Machine Industrial, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Thinning Machine market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Fully Automatic
Semi-Automatic
Market segment by Application
200mm Wafer
300mm Wafer
Others
Major players covered
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Shenzhen Fangda
Hunan Yujing Machine Industrial
SpeedFam
Hauhaiqingke
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Thinning Machine product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Thinning Machine, with price, sales quantity, revenue, and global market share of Thinning Machine from 2020 to 2025.
Chapter 3, the Thinning Machine competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Thinning Machine breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Thinning Machine market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Thinning Machine.
Chapter 14 and 15, to describe Thinning Machine sales channel, distributors, customers, research findings and conclusion.
Table of Contents
116 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Thinning Machine by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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