Global Thick-Film Hybrid Integrated Circuits Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Thick-Film Hybrid Integrated Circuits market size was valued at US$ 6430 million in 2024 and is forecast to a readjusted size of USD 8887 million by 2031 with a CAGR of 4.8% during review period.
Thick film hybrid integrated circuit (THIC) is a kind of hybrid integrated circuit, which is made of passive network on the same substrate by thick film process such as screen printing and sintering, and then assembled with discrete semiconductor chip or monolithic integrated circuit or micro component, and then packaged. The characteristics of thick film hybrid integrated circuit: compared with discrete component circuit, hybrid integrated circuit has the characteristics of high density, high reliability and better electrical performance; compared with PCB Compared with monolithic integrated circuit, it is flexible in design, simple in process, convenient in production of many varieties and small batch, and has wide parameter range, high precision, and can withstand high voltage and large output In terms of digital circuits, although semiconductor integrated circuits give full play to the characteristics of miniaturization, high reliability and large-scale low-cost production, thick film hybrid integrated circuits still maintain their advantages over semiconductor integrated circuits in many aspects, such as low-noise circuits, high-stability passive networks, high-frequency linear circuits High precision linear circuit, microwave circuit, high-voltage circuit, high-power circuit and mixed analog-to-digital circuit.
The main sales regions of thick film hybrid IC are Asia Pacific and North America, which together occupy about 60% of the global market share.
This report is a detailed and comprehensive analysis for global Thick-Film Hybrid Integrated Circuits market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Thick-Film Hybrid Integrated Circuits market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031
Global Thick-Film Hybrid Integrated Circuits market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031
Global Thick-Film Hybrid Integrated Circuits market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031
Global Thick-Film Hybrid Integrated Circuits market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Thick-Film Hybrid Integrated Circuits
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Thick-Film Hybrid Integrated Circuits market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include International Rectifier (Infineon), Crane Interpoint, GE Aviation, VPT (HEICO), MDI, MSK (Anaren), Technograph Microcircuits, Cermetek Microelectronics, Midas Microelectronics, NAURA Technology Group Co., Ltd., etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Thick-Film Hybrid Integrated Circuits market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Al2O3 Ceramic Substrate
BeO Ceramic Substrate
Ain Substrate
Others
Market segment by Application
Aviation and National Defense
Automotive Industry
Telecommunication and Computer Industry
Consumer Electronics
Others
Major players covered
International Rectifier (Infineon)
Crane Interpoint
GE Aviation
VPT (HEICO)
MDI
MSK (Anaren)
Technograph Microcircuits
Cermetek Microelectronics
Midas Microelectronics
NAURA Technology Group Co., Ltd.
JRM
International Sensor Systems
Zhenhua Microelectronics Ltd.
Xin Jingchang Electronics Co.,Ltd
E-TekNet
China Electronics Technology Group Corporation
Kolektor Siegert GmbH
Advance Circtuit Technology
AUREL s.p.a.
Fenghua Advanced Technology Holding CO.,LTD,
Custom Interconnect
Integrated Technology Lab
Chongqing Sichuan Instrument Microcircuit Co., Ltd.
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Thick-Film Hybrid Integrated Circuits product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Thick-Film Hybrid Integrated Circuits, with price, sales quantity, revenue, and global market share of Thick-Film Hybrid Integrated Circuits from 2020 to 2025.
Chapter 3, the Thick-Film Hybrid Integrated Circuits competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Thick-Film Hybrid Integrated Circuits breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Thick-Film Hybrid Integrated Circuits market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Thick-Film Hybrid Integrated Circuits.
Chapter 14 and 15, to describe Thick-Film Hybrid Integrated Circuits sales channel, distributors, customers, research findings and conclusion.
Thick film hybrid integrated circuit (THIC) is a kind of hybrid integrated circuit, which is made of passive network on the same substrate by thick film process such as screen printing and sintering, and then assembled with discrete semiconductor chip or monolithic integrated circuit or micro component, and then packaged. The characteristics of thick film hybrid integrated circuit: compared with discrete component circuit, hybrid integrated circuit has the characteristics of high density, high reliability and better electrical performance; compared with PCB Compared with monolithic integrated circuit, it is flexible in design, simple in process, convenient in production of many varieties and small batch, and has wide parameter range, high precision, and can withstand high voltage and large output In terms of digital circuits, although semiconductor integrated circuits give full play to the characteristics of miniaturization, high reliability and large-scale low-cost production, thick film hybrid integrated circuits still maintain their advantages over semiconductor integrated circuits in many aspects, such as low-noise circuits, high-stability passive networks, high-frequency linear circuits High precision linear circuit, microwave circuit, high-voltage circuit, high-power circuit and mixed analog-to-digital circuit.
The main sales regions of thick film hybrid IC are Asia Pacific and North America, which together occupy about 60% of the global market share.
This report is a detailed and comprehensive analysis for global Thick-Film Hybrid Integrated Circuits market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Thick-Film Hybrid Integrated Circuits market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031
Global Thick-Film Hybrid Integrated Circuits market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031
Global Thick-Film Hybrid Integrated Circuits market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031
Global Thick-Film Hybrid Integrated Circuits market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Thick-Film Hybrid Integrated Circuits
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Thick-Film Hybrid Integrated Circuits market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include International Rectifier (Infineon), Crane Interpoint, GE Aviation, VPT (HEICO), MDI, MSK (Anaren), Technograph Microcircuits, Cermetek Microelectronics, Midas Microelectronics, NAURA Technology Group Co., Ltd., etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Thick-Film Hybrid Integrated Circuits market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Al2O3 Ceramic Substrate
BeO Ceramic Substrate
Ain Substrate
Others
Market segment by Application
Aviation and National Defense
Automotive Industry
Telecommunication and Computer Industry
Consumer Electronics
Others
Major players covered
International Rectifier (Infineon)
Crane Interpoint
GE Aviation
VPT (HEICO)
MDI
MSK (Anaren)
Technograph Microcircuits
Cermetek Microelectronics
Midas Microelectronics
NAURA Technology Group Co., Ltd.
JRM
International Sensor Systems
Zhenhua Microelectronics Ltd.
Xin Jingchang Electronics Co.,Ltd
E-TekNet
China Electronics Technology Group Corporation
Kolektor Siegert GmbH
Advance Circtuit Technology
AUREL s.p.a.
Fenghua Advanced Technology Holding CO.,LTD,
Custom Interconnect
Integrated Technology Lab
Chongqing Sichuan Instrument Microcircuit Co., Ltd.
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Thick-Film Hybrid Integrated Circuits product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Thick-Film Hybrid Integrated Circuits, with price, sales quantity, revenue, and global market share of Thick-Film Hybrid Integrated Circuits from 2020 to 2025.
Chapter 3, the Thick-Film Hybrid Integrated Circuits competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Thick-Film Hybrid Integrated Circuits breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Thick-Film Hybrid Integrated Circuits market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Thick-Film Hybrid Integrated Circuits.
Chapter 14 and 15, to describe Thick-Film Hybrid Integrated Circuits sales channel, distributors, customers, research findings and conclusion.
Table of Contents
146 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Thick-Film Hybrid Integrated Circuits by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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