Global Thermal Conductor Paste Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Thermal Conductor Paste market size was valued at US$ 199 million in 2024 and is forecast to a readjusted size of USD 279 million by 2031 with a CAGR of 5.0% during review period.
Thermal conductor paste, also known as thermal grease, thermal compound, or thermal paste, is a type of material used to improve the thermal conductivity and heat transfer between two surfaces. It is commonly used in electronics, computer hardware, and other applications where efficient heat dissipation is crucial to prevent overheating and ensure optimal performance.The primary purpose of thermal conductor paste is to fill in microscopic air gaps and imperfections between two surfaces, such as a microprocessor (CPU) and a heat sink or a graphics processing unit (GPU) and a cooling solution. These small gaps can create thermal resistance, inhibiting the efficient transfer of heat from one component to another. Thermal conductor paste typically consists of a mixture of thermally conductive particles suspended in a carrier fluid. The particles are often made of materials like metal oxides, ceramics, or carbon-based materials. The carrier fluid is usually a silicone or non-silicone-based compound that helps the paste flow and spread evenly over the surfaces.
In the global market, Thermal Conductor Paste core manufacturers are mainly Momentive, Shin-Etsu Chemical, Parker Hannifin, Denka Company, CHT Group, ect. The top five players in this industry account for about 36% of the market share. North America, Europe, and Asia-Pacific are the major manufacturing regions for this product, with Asia-Pacific accounting for more than 62% of the global market share.
This report is a detailed and comprehensive analysis for global Thermal Conductor Paste market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Structure and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Thermal Conductor Paste market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/kg), 2020-2031
Global Thermal Conductor Paste market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/kg), 2020-2031
Global Thermal Conductor Paste market size and forecasts, by Structure and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/kg), 2020-2031
Global Thermal Conductor Paste market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/kg), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Thermal Conductor Paste
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Thermal Conductor Paste market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Henkel, Shin-Etsu Chemical, Parker Hannifin, 3M, Dow, Cooler Master, CHT Group, Denka Company, Momentive, RS Components, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Thermal Conductor Paste market is split by Structure and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Structure, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Structure
Silicone Based
Non-silicone Based
Market segment by Application
Electronics and Home Appliances
Automotive and Transportation
Telecommunications
LED
Other
Major players covered
Henkel
Shin-Etsu Chemical
Parker Hannifin
3M
Dow
Cooler Master
CHT Group
Denka Company
Momentive
RS Components
Thermal Grizzly
OKS
MacDermid Alpha Electronics Solutions
Fujipoly
Wacker
Arctic
NTE Electronics
Boyd
Noctua
CoolLaboratory
GELID Solutions
ProlimaTech
Xigmatek
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Thermal Conductor Paste product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Thermal Conductor Paste, with price, sales quantity, revenue, and global market share of Thermal Conductor Paste from 2020 to 2025.
Chapter 3, the Thermal Conductor Paste competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Thermal Conductor Paste breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Structure and by Application, with sales market share and growth rate by Structure, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Thermal Conductor Paste market forecast, by regions, by Structure, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Thermal Conductor Paste.
Chapter 14 and 15, to describe Thermal Conductor Paste sales channel, distributors, customers, research findings and conclusion.
Thermal conductor paste, also known as thermal grease, thermal compound, or thermal paste, is a type of material used to improve the thermal conductivity and heat transfer between two surfaces. It is commonly used in electronics, computer hardware, and other applications where efficient heat dissipation is crucial to prevent overheating and ensure optimal performance.The primary purpose of thermal conductor paste is to fill in microscopic air gaps and imperfections between two surfaces, such as a microprocessor (CPU) and a heat sink or a graphics processing unit (GPU) and a cooling solution. These small gaps can create thermal resistance, inhibiting the efficient transfer of heat from one component to another. Thermal conductor paste typically consists of a mixture of thermally conductive particles suspended in a carrier fluid. The particles are often made of materials like metal oxides, ceramics, or carbon-based materials. The carrier fluid is usually a silicone or non-silicone-based compound that helps the paste flow and spread evenly over the surfaces.
In the global market, Thermal Conductor Paste core manufacturers are mainly Momentive, Shin-Etsu Chemical, Parker Hannifin, Denka Company, CHT Group, ect. The top five players in this industry account for about 36% of the market share. North America, Europe, and Asia-Pacific are the major manufacturing regions for this product, with Asia-Pacific accounting for more than 62% of the global market share.
This report is a detailed and comprehensive analysis for global Thermal Conductor Paste market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Structure and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Thermal Conductor Paste market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/kg), 2020-2031
Global Thermal Conductor Paste market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/kg), 2020-2031
Global Thermal Conductor Paste market size and forecasts, by Structure and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/kg), 2020-2031
Global Thermal Conductor Paste market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/kg), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Thermal Conductor Paste
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Thermal Conductor Paste market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Henkel, Shin-Etsu Chemical, Parker Hannifin, 3M, Dow, Cooler Master, CHT Group, Denka Company, Momentive, RS Components, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Thermal Conductor Paste market is split by Structure and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Structure, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Structure
Silicone Based
Non-silicone Based
Market segment by Application
Electronics and Home Appliances
Automotive and Transportation
Telecommunications
LED
Other
Major players covered
Henkel
Shin-Etsu Chemical
Parker Hannifin
3M
Dow
Cooler Master
CHT Group
Denka Company
Momentive
RS Components
Thermal Grizzly
OKS
MacDermid Alpha Electronics Solutions
Fujipoly
Wacker
Arctic
NTE Electronics
Boyd
Noctua
CoolLaboratory
GELID Solutions
ProlimaTech
Xigmatek
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Thermal Conductor Paste product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Thermal Conductor Paste, with price, sales quantity, revenue, and global market share of Thermal Conductor Paste from 2020 to 2025.
Chapter 3, the Thermal Conductor Paste competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Thermal Conductor Paste breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Structure and by Application, with sales market share and growth rate by Structure, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Thermal Conductor Paste market forecast, by regions, by Structure, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Thermal Conductor Paste.
Chapter 14 and 15, to describe Thermal Conductor Paste sales channel, distributors, customers, research findings and conclusion.
Table of Contents
158 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Thermal Conductor Paste by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Structure
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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